Patents by Inventor Akihiro Motoki

Akihiro Motoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9165714
    Abstract: An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: October 20, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Makoto Ogawa, Akihiro Motoki, Atsuko Saito, Kenji Masuko, Toshinobu Fujiwara
  • Patent number: 9147525
    Abstract: A multilayer coil component is provided to have high reliability and in which internal stress arising from the difference in firing shrinkage behavior and/or thermal expansion coefficient between ferrite layers and internal conductor layers is alleviated without forming conventional voids between the ferrite layers and the internal conductor layers. A method of manufacturing a multilayer coil includes a step of isolating interfaces between internal conductors and surrounding ferrite by allowing a complexing agent solution to reach interfaces between the internal conductors and the surrounding ferrite through side gap portions from side surfaces of a ferrite element including a helical coil. The complexing agent solution contains at least one selected from the group consisting of an aminocarboxylic acid, a salt of the aminocarboxylic acid, an oxycarboxylic acid, a salt of the oxycarboxylic acid, an amine, phosphoric acid, a salt of phosphoric acid, and a lactone compound.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: September 29, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Mitsuru Odahara, Akihiro Motoki, Akihiro Ono
  • Patent number: 9123469
    Abstract: In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: September 1, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akihiro Motoki, Syunsuke Takeuchi, Makoto Ogawa, Seiichi Nishihara, Kenichi Kawasaki, Shuji Matsumoto
  • Patent number: 9111690
    Abstract: A method is used to manufacture a multilayer electronic component including a multilayer composite including internal electrodes having ends that are exposed at a predetermined surface of the multilayer composite. In the method, the exposed ends of the internal electrodes are coated with a metal film primarily composed of at least one metal selected from the group consisting of Pd, Au, Pt and Ag and having a thickness of at least about 0.1 ?m by immersing the multilayer composite in a liquid containing a metal ion or a metal complex. Then, a continuous plating layer is formed by depositing a plating metal on the ends of the internal electrodes exposed at the predetermined surface of the multilayer composite, and subsequently growing the deposits of the plating metal so as to be connected to each other. Thus, exposed ends of the internal electrodes are electrically connected to each other.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: August 18, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akihiro Motoki, Makoto Ogawa, Toshiyuki Iwanaga, Akihiro Yoshida, Takayuki Kayatani
  • Publication number: 20150205638
    Abstract: The present invention addresses the problem of providing a migration system and a migration method by which a completion timing of a live migration of virtual machines can be adjusted. The migration system (1) comprises: a transfer means (61A) for transmitting memory data of the virtual machines from a transfer source physical host (31) to a transfer destination physical host (32) to synchronize data of the virtual machines on the physical host (31) and the virtual machines on the physical host (32); a determination means (51A) for determining, for each of the virtual machines, whether the data of the virtual machine (81A) on the transfer source physical host (31) is synchronized with the data of the virtual machine (81B); and a control means (10) for issuing an instruction of switching from the virtual machines on the physical host (31) to the virtual machines on the physical host (32), if the data of all the virtual machines is synchronized based on the determination result.
    Type: Application
    Filed: July 5, 2013
    Publication date: July 23, 2015
    Inventor: Akihiro Motoki
  • Patent number: 9070498
    Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: June 30, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akihiro Motoki, Makoto Ogawa, Kenichi Kawasaki, Shunsuke Takeuchi, Shigeyuki Kuroda
  • Patent number: 9013859
    Abstract: A method for manufacturing a laminated electronic component in which, when first plating layers that respectively connect a plurality of internal electrodes to each other and second plating layers that improves the mountability of a laminated electronic component are formed as external terminal electrodes, the entire component main body is treated with a water repellent agent after the formation of the first plating layers, and the water repellent agent on the first plating layers is then removed before the formation of the second plating layers. The gaps between the end edges of the first plating films on the outer surface of the component main body and the outer surface of the component main body are filled with the water repellent agent.
    Type: Grant
    Filed: February 4, 2011
    Date of Patent: April 21, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masahito Saruban, Makoto Ogawa, Akihiro Motoki, Syunsuke Takeuchi, Kiyoyasu Sakurada
  • Patent number: 8982533
    Abstract: A monolithic electronic component includes a laminate including a plurality of stacked insulating layers and a plurality of internal electrodes which extend between the insulating layers and which have end portions exposed at predetermined surfaces of the laminate, first plating layers disposed on the predetermined surfaces of the laminate, and second plating layers disposed on the first plating layer. The first plating layers are made of a metal different from that used to make the internal electrodes. The first plating layers are formed by electroless plating. The second plating layers are formed by electroplating.
    Type: Grant
    Filed: May 3, 2013
    Date of Patent: March 17, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akihiro Motoki, Akihiro Yoshida, Makoto Ogawa
  • Patent number: 8971015
    Abstract: An electronic component includes a laminate including a plurality of insulating layers that are laminated on each other. A capacitor conductor is embedded in the laminate and includes an exposed portion exposed between the insulating layers at a predetermined surface of the laminate. An external electrode is provided on the predetermined surface by direct plating so as to cover the exposed portion. An outer edge of the external electrode is spaced away from the exposed portion by about 0.8 ?m or more.
    Type: Grant
    Filed: May 22, 2013
    Date of Patent: March 3, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Syunsuke Takeuchi, Yoji Yamamoto, Akihiro Motoki, Makoto Ogawa, Masahito Saruban
  • Publication number: 20150001998
    Abstract: A monolithic ceramic electronic component includes a ceramic body including a stack of ceramic layers. Inner electrodes are disposed within the ceramic body and include exposed portions at the end surfaces of the ceramic body. A pair of outer electrodes is arranged on the end surfaces of the ceramic body so as to extend from the end surfaces to the main surfaces and side surfaces of the ceramic body. Each of the outer electrodes includes a lower electrode layer provided on the ceramic body, an intermediate electrode layer located on the lower electrode layer and defined by a plated Ni layer, and an upper electrode layer located on the intermediate electrode layer and defined by a plated Pd layer. A thickness of the intermediate electrode layer on the main surfaces and the side surfaces of the ceramic body is larger than a thickness of the intermediate electrode layer on the end surfaces of the ceramic body.
    Type: Application
    Filed: June 23, 2014
    Publication date: January 1, 2015
    Inventors: Seiji KATSUTA, Yasuaki KAINUMA, Tatsuya NAGAOKA, Akihiro MOTOKI, Satoshi KODAMA
  • Publication number: 20140321025
    Abstract: An electronic component including an electronic component element with an external electrode, a Ni plating film on the external electrode, and a Sn plating film covering the Ni plating film. The Sn plating film has Sn—Ni alloy flakes therein, the Sn—Ni alloy flakes are present in the range from a surface of the Sn plating film on the Ni plating film to 50% or less of the thickness of the Sn plating film, and when Sn is removed from the Sn plating film to leave only the Sn—Ni alloy flakes, an observed planar view of a region occupied by the Sn—Ni alloy flakes falls within the range from 15% to 60% of the observed planar region.
    Type: Application
    Filed: July 7, 2014
    Publication date: October 30, 2014
    Inventors: Akira Saito, Makoto Ogawa, Akihiro Motoki
  • Publication number: 20140312744
    Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.
    Type: Application
    Filed: July 1, 2014
    Publication date: October 23, 2014
    Inventors: Akihiro MOTOKI, Makoto OGAWA, Kenichi KAWASAKI, Shunsuke TAKEUCHI, Shigeyuki KURODA
  • Publication number: 20140293503
    Abstract: A monolithic ceramic electronic component includes an outer electrode including a first plating layer formed directly on a component body by electroless plating so as to cover an exposed portion distribution region including exposed portions of a plurality of inner electrodes and a second plating layer formed by electrolytic plating so as to cover the first plating layer. An amount of extension of the first plating E1 and an amount of extension of the second plating E2 satisfy the relationship E1/(E1+E2)?20%, where E1 represents a distance from an edge of the exposed portion distribution region to an edge of the first plating layer, and E2 represents a distance from the edge of the first plating layer to an edge of the second plating layer.
    Type: Application
    Filed: March 28, 2014
    Publication date: October 2, 2014
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takehisa SASABAYASHI, Akihiro MOTOKI, Makoto OGAWA
  • Patent number: 8804303
    Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.
    Type: Grant
    Filed: April 5, 2012
    Date of Patent: August 12, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akihiro Motoki, Makoto Ogawa, Kenichi Kawasaki, Shunsuke Takeuchi, Shigeyuki Kuroda
  • Patent number: 8797711
    Abstract: A region where a plating film constituting an external electrode is formed can be accurately controlled in an electronic component in which the external electrode is formed by directly plating a particular region in a surface of a component body. In a component body, a bump is provided in a position in which a region where an external electrode should be formed is partitioned. In a plating process, growth of the plating film constituting the external electrode is substantially stopped or delayed in the bump. As a result, a termination point of the growth of the plating film constituting the external electrode can be accurately controlled in the position of the bump.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: August 5, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Seiichi Matsumoto, Toshiyuki Iwanaga, Makoto Ogawa, Akihiro Motoki
  • Publication number: 20140211369
    Abstract: A monolithic ceramic electronic component includes a component body and outer electrodes. The component body includes a plurality of stacked ceramic layers and a plurality of inner electrodes which extend between the ceramic layers, which contain Ni, and which include exposed ends exposed on predetermined surfaces of the component body. The outer electrodes are electrically connected to the exposed ends of the inner electrodes and are formed on the predetermined surfaces of the component body by plating. The inner electrodes include Mg—Ni coexistence regions where Mg and Ni coexist.
    Type: Application
    Filed: January 22, 2014
    Publication date: July 31, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Takehisa SASABAYASHI, Akihiro MOTOKI, Makoto OGAWA
  • Publication number: 20140158293
    Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.
    Type: Application
    Filed: February 11, 2014
    Publication date: June 12, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Akihiro MOTOKI, Makoto OGAWA, Kenichi KAWASAKI, Shunsuke TAKEUCHI, Shigeyuki KURODA
  • Patent number: 8730646
    Abstract: A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 ?m or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 ?m or less. The metal particles defining the lower plating films may be Cu particles.
    Type: Grant
    Filed: May 15, 2009
    Date of Patent: May 20, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kenichi Kawasaki, Shunsuke Takeuchi, Akihiro Motoki, Makoto Ogawa, Toshiyuki Iwanaga
  • Patent number: 8724291
    Abstract: A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 ?m or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 ?m or less. The metal particles defining the lower plating films may be Cu particles.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: May 13, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kenichi Kawasaki, Shunsuke Takeuchi, Akihiro Motoki, Makoto Ogawa, Toshiyuki Iwanaga
  • Patent number: 8717739
    Abstract: A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: May 6, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoji Yamamoto, Akihiro Motoki, Syunsuke Takeuchi, Makoto Ogawa, Toshiyuki Iwanaga