Patents by Inventor Akihiro Motoki
Akihiro Motoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8410886Abstract: A multilayer coil component is provided to have high reliability and in which internal stress arising from the difference in firing shrinkage behavior and/or thermal expansion coefficient between ferrite layers and internal conductor layers is alleviated without forming conventional voids between the ferrite layers and the internal conductor layers. A method of manufacturing a multilayer coil includes a step of isolating interfaces between internal conductors and surrounding ferrite by allowing a complexing agent solution to reach interfaces between the internal conductors and the surrounding ferrite through side gap portions from side surfaces of a ferrite element including a helical coil. The complexing agent solution contains at least one selected from the group consisting of an aminocarboxylic acid, a salt of the aminocarboxylic acid, an oxycarboxylic acid, a salt of the oxycarboxylic acid, an amine, phosphoric acid, a salt of phosphoric acid, and a lactone compound.Type: GrantFiled: January 24, 2012Date of Patent: April 2, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Mitsuru Odahara, Akihiro Motoki, Akihiro Ono
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Patent number: 8411409Abstract: When an external terminal electrode of a ceramic electronic component such as a laminated ceramic capacitor is formed by plating, plating growth may be also caused even in an undesired location. The ceramic surface provided by a component main body is configured to include a high plating growth region of, for example, a barium titanate based ceramic, which exhibits relatively high plating growth, and a low plating growth region of, for example, a calcium zirconate based ceramic, which exhibits relatively low plating growth. The plating film constituting a first layer to define a base for an external terminal electrode is formed in such a way that the growth of a plated deposit deposited with conductive surfaces provided by exposed ends of internal electrodes as starting points is limited so as not to cross over a boundary between the high plating growth region and the low plating growth region toward the low plating growth region.Type: GrantFiled: June 16, 2011Date of Patent: April 2, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Makoto Ogawa, Akihiro Motoki, Masahito Saruban, Toshiyuki Iwanaga, Syunsuke Takeuchi, Kiyoyasu Sakurada
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Patent number: 8400754Abstract: A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.Type: GrantFiled: December 7, 2009Date of Patent: March 19, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Makoto Ogawa, Seiichi Matsumoto, Akihiro Motoki, Toshiyuki Iwanaga, Tatsuo Kunishi
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Publication number: 20130062994Abstract: A method for manufacturing a laminated ceramic electronic component enables formation of a plating film as at least a portion of an external electrode which connects exposed ends of internal electrodes. A component main body including a plurality of ceramic layers and a plurality of internal electrodes partially exposed from the component main body is prepared such that the component main body has a conductive region formed by diffusion of a conductive component included in the internal electrodes at the end surfaces of the ceramic layers located between adjacent exposed ends of the plurality of internal electrodes. The ceramic layers are preferably composed of a glass ceramic containing a glass component of about 10 weight % or more. A plating film is formed directly on the component main body by growing the exposed ends of the internal electrodes and the conductive region as nucleuses for plating deposition.Type: ApplicationFiled: March 5, 2012Publication date: March 14, 2013Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Makoto OGAWA, Akihiro MOTOKI, Masahito SARUBAN, Wataru OGAWA
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Patent number: 8355241Abstract: A laminated electronic component includes a component body including a plurality of laminated functional layers, a plurality of internal conductors provided inside the component body, and an external terminal electrode that is electrically connected to an internal conductor via an exposed portion of the internal conductor and that is defined by a direct plating film. An average grain diameter of metal grains defining the plating film is about 0.1 ?m or less.Type: GrantFiled: November 10, 2010Date of Patent: January 15, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Makoto Ogawa, Akihiro Motoki, Syunsuke Takeuchi, Kenichi Kawasaki
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Patent number: 8341815Abstract: A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 ?m or less when a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 ?m or less, and is about 20 ?m or less when a protruding length of the adjacent internal electrodes from the end surface is at least about 0.1 ?m. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.Type: GrantFiled: June 9, 2010Date of Patent: January 1, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Tatsuo Kunishi, Yoshihiko Takano, Shigeyuki Kuroda, Akihiro Motoki, Hideyuki Kashio, Takashi Noji
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Patent number: 8334748Abstract: A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.Type: GrantFiled: January 25, 2012Date of Patent: December 18, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Syunsuke Takeuchi, Teruyo Katayama, Toshiyuki Iwanaga, Akihiro Motoki, Makoto Ogawa, Kenichi Kawasaki
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Publication number: 20120314336Abstract: An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.Type: ApplicationFiled: May 24, 2012Publication date: December 13, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Makoto OGAWA, Akihiro MOTOKI, Atsuko SAITO, Kenji MASUKO, Toshinobu FUJIWARA
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Patent number: 8320101Abstract: In a method for manufacturing a multilayer electronic component, after a plating layer for forming an external electrode is formed on an end surface of a laminate, conditions for heat-treating the laminate are set such that interdiffusion layers have ends which face internal electrodes and which are spaced from the end surface of the laminate at a distance of about 0.5 ?m to about 1.9 ?m.Type: GrantFiled: June 17, 2010Date of Patent: November 27, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Shunsuke Takeuchi, Kenichi Kawasaki, Akihiro Motoki, Makoto Ogawa
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Patent number: 8315036Abstract: A ceramic electronic component includes a ceramic body and a plurality of external electrodes disposed at a surface of the ceramic body. The external electrodes include a plating layer containing glass particles each coated with a metal film. The plating layer is formed by co-deposition of a plating metal and the metal-coated glass particles.Type: GrantFiled: March 17, 2009Date of Patent: November 20, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Makoto Ogawa, Akihiro Motoki, Junichi Saito, Shunsuke Takeuchi, Kenichi Kawasaki
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Publication number: 20120288724Abstract: An electronic component that prevents or minimizes whiskers or has good solder wettability includes a rectangular solid-shaped electronic component element and external electrodes of terminal electrodes provided at opposed end surfaces of the electronic component element. First plated films including Ni are provided on the surfaces of the external electrodes. Second plated films including Sn defining an outermost layer are arranged so as to cover the first plated films. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are provided at a Sn crystal grain boundary. Intermetallic compound layers including Ni3Sn4 are provided at interfaces between the first plated films and the second plated films.Type: ApplicationFiled: April 26, 2012Publication date: November 15, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Makoto OGAWA, Akihiro MOTOKI, Atsuko SAITO, Kenji MASUKO, Toshinobu FUJIWARA
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Publication number: 20120288731Abstract: A laminated ceramic capacitor includes a rectangular solid-shaped electronic component element. External electrodes of terminal electrodes are disposed at one end surface and the other end surface of the electronic component element. First plated films including a Ni plating are disposed on the surfaces of external electrodes. On the surfaces of the first plated films, second plated films containing Sn are disposed as Sn-plated films defining outermost layers of the external electrodes. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are located at a Sn crystal grain boundary and within a Sn crystal grain, respectively.Type: ApplicationFiled: April 12, 2012Publication date: November 15, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Akihiro MOTOKI, Makoto OGAWA, Atsuko SAITO, Toshinobu FUJIWARA, Kenji MASUKO
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Publication number: 20120236461Abstract: A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view.Type: ApplicationFiled: March 14, 2012Publication date: September 20, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Yoji YAMAMOTO, Akihiro MOTOKI, Syunsuke TAKEUCHI, Makoto OGAWA, Toshiyuki IWANAGA
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Patent number: 8254081Abstract: In a laminated ceramic electronic component in which, by directly carrying out a plating process on an outer surface of a component main body, an external electrode is formed thereon, an attempt is made to improve the adhesion strength between a plated film forming the external electrode and the component main body. A brazing material containing Ti is applied to at least one portion of a surface on which external electrodes of a component main body is formed, and by baking this brazing material, a metal layer containing Ti is formed. Moreover, the external electrodes are formed by a plating process so as to coat at least the metal layer, and a heating process is then carried out so as to cause counter diffusion between the metal layer and the plated film that is to form the external electrodes.Type: GrantFiled: November 13, 2009Date of Patent: August 28, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Seiichi Nishihara, Shuji Matsumoto, Akihiro Motoki, Makoto Ogawa
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Patent number: 8240016Abstract: A method for manufacturing a multilayer electronic component includes a step of preparing a laminate which includes a plurality of stacked insulator layers and a plurality of internal electrodes extending along the interfaces between the insulator layers, and in which an end of each of the plurality of internal electrodes is exposed at a predetermined surface corresponding to one of the first and second end surfaces; a step of forming external electrodes on the predetermined surfaces; and a step of forming thick-film edge electrodes at edge portions. The step of forming external electrodes includes a step of attaching a plurality of conductive particles having a particle size of about 1 ?m or more to the predetermined surfaces of the laminate, and a step of performing plating directly on the predetermined surfaces to which the conductive particles are attached.Type: GrantFiled: April 30, 2010Date of Patent: August 14, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Makoto Ogawa, Kenichi Kawasaki, Shunsuke Takeuchi
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Publication number: 20120194031Abstract: In a method of forming an external electrode by growing plated depositions on exposed ends of a plurality of internal electrodes in a component main body, the component main body is polished to increase exposure of the internal electrodes. To prevent decreased external electrode fixing strength, a radius of curvature is reduced to about 0.01 mm or less for an R chamfered section formed in a ridge section of the component main body during polishing by ion milling, and exposed ends of the internal electrodes are recessed from end surfaces of the component main body with a recess length of about 1 ?m or less. Plating films to serve as external electrodes are formed to extend from the end surfaces of the component main body across the R chamfered section, and include end edges located on at least one of the principal surfaces and the side surfaces.Type: ApplicationFiled: January 27, 2012Publication date: August 2, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Wataru OGAWA, Makoto OGAWA, Masahito SARUBAN, Toshiyuki IWANAGA, Akihiro MOTOKI
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Publication number: 20120188683Abstract: A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.Type: ApplicationFiled: January 25, 2012Publication date: July 26, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Syunsuke TAKEUCHI, Teruyo KATAYAMA, Toshiyuki IWANAGA, Akihiro MOTOKI, Makoto OGAWA, Kenichi KAWASAKI
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Patent number: 8228663Abstract: In a laminated ceramic electronic component, external terminal electrodes include plating films directly covering exposed portions of internal electrodes on end surfaces of a ceramic element assembly. On the boundaries between the end surfaces and principal surfaces of the ceramic element assembly, substantially rounded corners are provided, and the plating films are arranged such that the ends of the plating films stop at the corners and do not project from the principal surfaces.Type: GrantFiled: November 12, 2009Date of Patent: July 24, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Shunsuke Takeuchi, Kenichi Kawasaki, Akihiro Motoki, Makoto Ogawa, Toshiyuki Iwanaga
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Publication number: 20120183682Abstract: A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.Type: ApplicationFiled: March 29, 2012Publication date: July 19, 2012Applicant: Murata Manufacturing Co., Ltd.Inventors: Shunsuke Takeuchi, Kenichi Kawasaki, Akihiro Motoki, Makoto Ogawa, Shuji Matsumoto, Seiichi Nishihara
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Publication number: 20120169180Abstract: In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.Type: ApplicationFiled: December 27, 2011Publication date: July 5, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Masahito SARUBAN, Makoto OGAWA, Wataru OGAWA, Akihiro MOTOKI, Syunsuke TAKEUCHI, Yoji YAMAMOTO