Patents by Inventor Akihiro MURANAKA

Akihiro MURANAKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230371219
    Abstract: A module includes a substrate and a first metal member. The substrate has an upper main surface and a lower main surface arranged in an up-down direction. The first metal member includes a first plate-shaped portion provided on the upper main surface of the substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. The first metal member further includes a first left support portion. A boundary between the first plate-shaped portion and the first left support portion is defined as a first left boundary. The first left support portion bends with respect to the first plate-shaped portion at the first left boundary so as to be located behind the first plate-shaped portion.
    Type: Application
    Filed: July 13, 2023
    Publication date: November 16, 2023
    Inventors: Shota HAYASHI, Nobuaki OGAWA, Yuki ASANO, Akihiro MURANAKA, Takanori UEJIMA, Hiromichi KITAJIMA
  • Publication number: 20230360983
    Abstract: In a module, a metal member includes a right support portion, the right support portion has a right support foremost portion located at a foremost in the right support portion and located in front of the plate-shaped portion, the right support portion bends in a forward direction from a right boundary when the right support portion has the right support foremost portion, the right support portion bends in a backward direction and a right direction from the right support foremost portion when the right support portion has the right support foremost portion, and the right support portion is provided with a first lower notch extending in an upward direction from a lower side and overlapping the right support foremost portion when viewed in the up-down direction.
    Type: Application
    Filed: July 13, 2023
    Publication date: November 9, 2023
    Inventors: Shota HAYASHI, Nobuaki OGAWA, Yuki ASANO, Akihiro MURANAKA
  • Publication number: 20230189490
    Abstract: A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side. The metal member further includes a plurality of foot portions. All of the plurality of foot portions extend backward from the lower side.
    Type: Application
    Filed: February 9, 2023
    Publication date: June 15, 2023
    Inventors: Shota Hayashi, Nobuaki Ogawa, Yuki Asano, Akihiro Muranaka, Takanori Uejima, Hiromichi Katajima, Takahiro Eguchi
  • Publication number: 20230187131
    Abstract: A coil module includes a coil conductor including a plurality of coil elements and a plurality of wire electrodes disposed on a circuit board, each of the plurality of coil elements including a pair of leg portions and a bridge portion connecting one end portions of the pair of leg portions together, the plurality of coil elements being disposed to cross a winding axis. A method for manufacturing the coil module includes an assembly forming step of integrating the plurality of coil elements with resin to form a coil element assembly, and a conductor forming step of mounting the coil element assembly on the circuit board to complete the coil conductor wound about the winding axis. In the conductor forming step, the resin is introduced into a die set in which the plurality of coil elements are arranged to form a block, to thus form the coil element assembly.
    Type: Application
    Filed: February 14, 2023
    Publication date: June 15, 2023
    Inventors: Shinichiro BANBA, Akihiro MURANAKA
  • Patent number: 11615918
    Abstract: A coil module includes a coil conductor including a plurality of coil elements and a plurality of wire electrodes disposed on a circuit board, each of the plurality of coil elements including a pair of leg portions and a bridge portion connecting one end portions of the pair of leg portions together, the plurality of coil elements being disposed to cross a winding axis. A method for manufacturing the coil module includes an assembly forming step of integrating the plurality of coil elements with resin to form a coil element assembly, and a conductor forming step of mounting the coil element assembly on the circuit board to complete the coil conductor wound about the winding axis. In the conductor forming step, the resin is introduced into a die set in which the plurality of coil elements are arranged to form a block, to thus form the coil element assembly.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: March 28, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shinichiro Banba, Akihiro Muranaka
  • Patent number: 11362412
    Abstract: A radiation conductor is constructed of a metal plate having a pair of main surfaces pointing in opposite directions. Each main surface of the pair of main surfaces includes a first surface region that includes at least part of a peripheral edge portion of the main surface. At least one main surface of the pair of main surfaces includes a second surface region that is a region other than the first surface region. A dielectric member holds the radiation conductor in such a manner that the first surface region of each main surface of the pair of main surfaces is sandwiched between portions of the dielectric member in a thickness direction of the radiation conductor. The second surface region of the at least one main surface is exposed.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: June 14, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideki Ueda, Shinya Mizoguchi, Tsubasa Nishida, Shinichiro Banba, Osamu Yamaguchi, Akihiro Muranaka, Koji Yasojima
  • Patent number: 11223101
    Abstract: A radiation conductor is constructed of a metal plate having a pair of main surfaces pointing in opposite directions. Each main surface of the pair of main surfaces includes a first surface region that includes at least part of a peripheral edge portion of the main surface. At least one main surface of the pair of main surfaces includes a second surface region that is a region other than the first surface region. A dielectric member holds the radiation conductor in such a manner that the first surface region of each main surface of the pair of main surfaces is sandwiched between portions of the dielectric member in a thickness direction of the radiation conductor. A housing supports and accommodates the dielectric member. The second surface region of the at least one main surface is exposed.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: January 11, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideki Ueda, Shinya Mizoguchi, Tsubasa Nishida, Shinichiro Banba, Osamu Yamaguchi, Akihiro Muranaka, Koji Yasojima
  • Publication number: 20200295436
    Abstract: A radiation conductor is constructed of a metal plate having a pair of main surfaces pointing in opposite directions. Each main surface of the pair of main surfaces includes a first surface region that includes at least part of a peripheral edge portion of the main surface. At least one main surface of the pair of main surfaces includes a second surface region that is a region other than the first surface region. A dielectric member holds the radiation conductor in such a manner that the first surface region of each main surface of the pair of main surfaces is sandwiched between portions of the dielectric member in a thickness direction of the radiation conductor. A housing supports and accommodates the dielectric member. The second surface region of the at least one main surface is exposed.
    Type: Application
    Filed: March 12, 2020
    Publication date: September 17, 2020
    Inventors: Hideki UEDA, Shinya MIZOGUCHI, Tsubasa NISHIDA, Shinichiro BANBA, Osamu YAMAGUCHI, Akihiro MURANAKA, Koji YASOJIMA
  • Publication number: 20200295437
    Abstract: A radiation conductor is constructed of a metal plate having a pair of main surfaces pointing in opposite directions. Each main surface of the pair of main surfaces includes a first surface region that includes at least part of a peripheral edge portion of the main surface. At least one main surface of the pair of main surfaces includes a second surface region that is a region other than the first surface region. A dielectric member holds the radiation conductor in such a manner that the first surface region of each main surface of the pair of main surfaces is sandwiched between portions of the dielectric member in a thickness direction of the radiation conductor. The second surface region of the at least one main surface is exposed.
    Type: Application
    Filed: March 12, 2020
    Publication date: September 17, 2020
    Inventors: Hideki UEDA, Shinya MIZOGUCHI, Tsubasa NISHIDA, Shinichiro BANBA, Osamu YAMAGUCHI, Akihiro MURANAKA, Koji YASOJIMA
  • Publication number: 20200118740
    Abstract: A coil module includes a coil conductor including a plurality of coil elements and a plurality of wire electrodes disposed on a circuit board, each of the plurality of coil elements including a pair of leg portions and a bridge portion connecting one end portions of the pair of leg portions together, the plurality of coil elements being disposed to cross a winding axis. A method for manufacturing the coil module includes an assembly forming step of integrating the plurality of coil elements with resin to form a coil element assembly, and a conductor forming step of mounting the coil element assembly on the circuit board to complete the coil conductor wound about the winding axis. In the conductor forming step, the resin is introduced into a die set in which the plurality of coil elements are arranged to form a block, to thus form the coil element assembly.
    Type: Application
    Filed: December 16, 2019
    Publication date: April 16, 2020
    Inventors: Shinichiro BANBA, Akihiro MURANAKA