Abstract: Provided is a curing reactive organopolysiloxane composition that forms a pressure-sensitive adhesive layer having a high shear storage elastic modulus and stress at 500% strain and having excellent adhesive strength. The organopolysiloxane composition comprises: (A) a chain organopolysiloxane having an alkenyl group; (B) an organopolysiloxane resin having 9 mol % or less of hydroxyl groups and the like, and being a mixture of (b1) an organopolysiloxane resin having a (Mw) of 4500 or more and (b2) an organopolysiloxane resin having a (Mw) of less than 4500; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. A mass ratio of a resin component to a chain siloxane component is within a range of 1.4 to 3.0 A pressure-sensitive adhesive layer obtained by curing the composition has a shear storage elastic modulus G? at 25° C. of 3.5 MPa or more, and a stress at 500% strain of 0.25 MPa or more.

Abstract: A rapid rise in the temperature of a liquid level sensor is prevented even at close to a vacuum atmosphere. In a material supply system that is equipped with a tank containing a liquid material and with the liquid level sensor that is provided inside the tank, and in which the liquid level sensor is a self-heating type of sensor that, when the liquid level sensor is generating heat as a result of being supplied with a predetermined normal energy, detects a liquid surface, there are provided a monitoring portion that monitors a detection value from an output signal from the liquid level sensor, and an energy control portion that, when the monitored detection value reaches a predetermined upper limit value, performs control in such a way that the energy supplied to the liquid level sensor is low-level energy that is lower than the normal energy.

Abstract: Provided is a curing reactive organopolysiloxane composition that forms a pressure-sensitive adhesive layer having practically sufficient curability and pressure-sensitive adhesive strength, and a relatively high shear storage elastic modulus and tensile stress at 500% strain. The organopolysiloxane composition comprises: (A) a chain organopolysiloxane having a content of vinyl portions in alkenyl groups within a range of 0.02 to 0.30 mass %; (B) an organopolysiloxane resin having a content of hydroxyl groups and the like of 9 mol % or less, and a molecular weight of 4500 or more; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. A mass ratio of a resin component to a chain siloxane component is within a range of 1.4 to 3.0. A pressure-sensitive adhesive layer obtained by curing the organopolysiloxane composition has a shear storage elastic modulus G? at 25° C. of 1.0 MPa or more and a stress at 500% strain of 0.50 MPa or more.

Abstract: Provided is a curing reactive organopolysiloxane composition that forms a pressure-sensitive adhesive layer having excellent curing properties, a wide range of designable viscoelastic properties such as storage elastic modulus (G?) and the like, and practically sufficient pressure-sensitive adhesive strength and tensile adhesive strength. The organopolysiloxane composition comprises: (A) an organopolysiloxane having an alkenyl group; (B) an organopolysiloxane resin with 9 mol % or less of hydroxyl groups or the like relative to all silicon atoms in a molecule or resin mixture thereof; (C) an organohydrogenpolysiloxane; (D) an organic silicon compound having an alkenyl group; and (E) a hydrosilylation reaction catalyst. A ratio (molar ratio) of the substance amount of SiH groups in component (C) relative to the sum of alkenyl groups in components (A), (B) and (D) is 1.0 or less.

Abstract: A light emitting element includes: a semiconductor structure including: a first semiconductor, an active layer, and a second semiconductor layer; a first electrode; a first insulating layer; a first internal electrode; a second internal electrode; a second insulating layer; a first external electrode; and a second external electrode.

Abstract: A support shaft capable of supporting a wound body with a long sheet wound therearound includes a first projection located at a proximal end of an outer peripheral part, and a second projection located at a distal end of the outer peripheral part. A core body of the wound body includes a one-end-side first recess part located at one end of an inner peripheral part, an other-end-side firsts recess part located at an other end of the inner peripheral part, and a second recess part located to extend from the one end to the other end. In a state where the core body is mounted on an outer periphery of the support shaft, the first projection engages the one-end-side first recess part or the other-end-side first recess part.

Abstract: The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package.

Abstract: The present invention relates to provision of a photosensitive resin composition, a photosensitive resin composition for photo via formation, and a photosensitive resin composition for interlayer insulating layer, each of which is excellent in both photosensitive characteristics and strippability from a support film. In addition, the present invention relates to provision of a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which is composed of the aforementioned photosensitive resin composition. Furthermore, the present invention relates to provision of a multilayer printed wiring board and a semiconductor package, and to provision of a method for producing the aforementioned multilayer printed wiring board.

Abstract: A high-frequency switch includes an input interface configured to receive a high-frequency signal; an output interface configured to output the high-frequency signal to outside; and a reactance switch inserted between the input interface and the output interface. The reactance switch includes a plurality of reactance circuits connected in a cascade arrangement between the input interface and the output interface. Each of the plurality of reactance circuits is configured to form a common passband for the high-frequency signal based on a reactance of a respective predetermined values, and at least one of the reactance circuits is a variable reactance circuit having a reactance which changes in response to a control signal input from the outside so that the passband of the variable reactance circuit changes.

Abstract: Disclosed is an adhesive film. The adhesive film has a silicone adhesive layer on one surface or both surfaces of a substrate film. A silicone adhesive material is used to form the silicone adhesive layer. The silicone adhesive material has 120 to 380% of an elongation at break (tensile speed of 300 mm/min, temperature of 25° C.) specified in JIS K 6251, and 1.8×105 to 4.5×105 Pa of a shear storage modulus (frequency of 10 Hz, temperature of 25° C.). The adhesive film generally has good wettability to the surface of an adherend and in general can be easily attached without creating air bubbles, to the extent that, even if air bubbles are created, the air bubbles can be easily dissipated. Further, even though the adhesive film is generally not easily peeled, peeling is generally possible with a small adhesive force during high speed peeling.

Abstract: The solid immersion lens unit includes: a solid immersion lens having a contact surface allowed to be in contact with an inspection object and a spherical surface allowed to be opposite to an objective lens; a holder holding the solid immersion lens; a magnet provided to the holder; and a spherical body rotatably held by a magnetic force of the magnet at a position opposite to the spherical surface. The holder swingably holds the solid immersion lens in a state where the spherical surface is in contact with the spherical body.

Abstract: An object of the present invention is to provide a technique for monitoring the condition of a device or a target processing object. A monitoring system according to one aspect of the present invention monitors a device powered by an AC motor and estimates a condition of at least one of the device or a target processing object of the device, and includes a time-series data acquisition unit configured to acquire voltage data relating to a drive voltage of an AC motor; a feature value computation unit configured to analyze a feature value of an abnormal voltage waveform in a time-series waveform of the voltage data; and a state estimation unit configured to estimate the condition based on the feature value of the abnormal voltage waveform.

Abstract: Disclosed is an adhesive film. The adhesive film has a silicone adhesive layer on one surface or both surfaces of a substrate film. A silicone adhesive material is used to form the silicone adhesive layer. The silicone adhesive material has 120 to 380% of an elongation at break (tensile speed of 300 mm/min, temperature of 25° C.) specified in JIS K 6251, and 1.8×105 to 4.5×105 Pa of a shear storage modulus (frequency of 10 Hz, temperature of 25° C.). The adhesive film generally has good wettability to the surface of an adherend and in general can be easily attached without creating air bubbles, to the extent that, even if air bubbles are created, the air bubbles can be easily dissipated. Further, even though the adhesive film is generally not easily peeled, peeling is generally possible with a small adhesive force during high speed peeling.

Abstract: Implemented is a configuration in which camera identification information is displayed on an electric paper display unit such that the identification information can be confirmed during a power-off time. An electric paper display unit on which camera identification information is displayed, and a control unit that executes displaying upon receiving an input of identification information to be displayed or information for designating the identification information, are included. The control unit receives an input of the identification information or information for designating the identification from an external apparatus, an external memory, or an inner memory of the camera, and displays, on the electric paper display unit, the identification information or synthesized information including the identification information and additional information.

Abstract: A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer capable of a wide range of storage elastic modulus (G?) at low temperatures, and with excellent curability and adhesion. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin which has a content of 9 moles or less of hydroxyl groups and the like and is a mixture of (b1) an organopolysiloxane resin having a weight average molecular weight (Mw) of 4500 or more and (b2) an organopolysiloxane resin having a Mw of less than 4500; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. The mass ratio of component (B) to component (A) is within a range of 0.9 to 3.0, and the shear storage elastic modulus G? at ?20° C. of a PSA pressure sensitive adhesive layer obtained by curing the composition is within a range of 0.77 to 50.00 MPa.

Abstract: A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a low storage elastic modulus (G?), excellent curability, and sufficient adhesion, along with applications thereof. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin wherein the weight average molecular weight (Mw) thereof is less than 4500 and the sum of the content of hydroxyl groups, etc. is 9 mole % or less; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst; and optionally, (A?) a chain organopolysiloxane which does not contain a carbon-carbon double bond-containing reactive group in the molecule. The mass ratio of the organopolysiloxane resin (B) to the chain organopolysiloxane (A) is within a specific range and the shear storage elastic modulus G? at ?20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 1.0 MPa.

Abstract: A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a relatively low storage elastic modulus (G?) at low temperatures, excellent curability, and sufficient adhesion for practical use. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin which has a content of 9 moles or less of hydroxyl groups and the like is a mixture of (b1) an organopolysiloxane resin having a weight average molecular weight (Mw) of 4500 or more and (b2) an organopolysiloxane resin having a Mw of less than 4500; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. The mass ratio of component (B) to component (A) is within a range of 0.9 to 2.0, and the shear storage elastic modulus G? at ?20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 0.75 MPa.

Abstract: A light emitting element includes: a semiconductor structure including: a first semiconductor, an active layer, and a second semiconductor layer; a first electrode; a first insulating layer; a first internal electrode; a second internal electrode; a second insulating layer; a first external electrode; and a second external electrode.

Abstract: A terminal device includes a memory that stores, characters in a game, a plurality of slots into which action reservations for the characters are to be registered, an action sequence for each of the slots, and effects, a display, a receiver that receives a request of an action reservation for a first character, and a processor that outputs, to the memory, the request when the processor determines the first character is in an active state in which the character is allowed to register the action reservation. The memory registers the first character in an earliest slot in the action sequence among the slots in which no other characters have been registered. The processor causes the first character to execute an action associated with the slot according to the action sequence. The effect associated with the first character is applied to the executed action.

Abstract: A high-frequency switch includes an input interface configured to receive a high-frequency signal; an output interface configured to output the high-frequency signal to outside; and a reactance switch inserted between the input interface and the output interface. The reactance switch includes a plurality of reactance circuits connected in a cascade arrangement between the input interface and the output interface. Each of the plurality of reactance circuits is configured to form a common passband for the high-frequency signal based on a reactance of a respective predetermined values, and at least one of the reactance circuits is a variable reactance circuit having a reactance which changes in response to a control signal input from the outside so that the passband of the variable reactance circuit changes.