Patents by Inventor Akihiro Takei
Akihiro Takei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105565Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.Type: ApplicationFiled: December 11, 2023Publication date: March 28, 2024Applicant: LAPIS Semiconductor Co., Ltd.Inventors: Toshihisa SONE, Kazuya YAMADA, Akihiro TAKEI, Yuichi YOSHIDA, Kengo TAKEMASA
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Patent number: 11854952Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.Type: GrantFiled: March 30, 2022Date of Patent: December 26, 2023Assignee: LAPIS SEMICONDUCTOR CO., LTD.Inventors: Toshihisa Sone, Kazuya Yamada, Akihiro Takei, Yuichi Yoshida, Kengo Takemasa
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Publication number: 20220223505Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.Type: ApplicationFiled: March 30, 2022Publication date: July 14, 2022Applicant: LAPIS Semiconductor Co., Ltd.Inventors: Toshihisa SONE, Kazuya YAMADA, Akihiro TAKEI, Yuichi YOSHIDA, Kengo TAKEMASA
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Patent number: 11309234Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.Type: GrantFiled: April 6, 2020Date of Patent: April 19, 2022Assignee: LAPIS SEMICONDUCTOR CO., LTD.Inventors: Toshihisa Sone, Kazuya Yamada, Akihiro Takei, Yuichi Yoshida, Kengo Takemasa
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Publication number: 20200235046Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.Type: ApplicationFiled: April 6, 2020Publication date: July 23, 2020Applicant: LAPIS Semiconductor Co., Ltd.Inventors: Toshihisa SONE, Kazuya YAMADA, Akihiro TAKEI, Yuichi YOSHIDA, Kengo TAKEMASA
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Patent number: 10622944Abstract: A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.Type: GrantFiled: February 15, 2019Date of Patent: April 14, 2020Assignee: LAPIS SEMICONDUCTOR CO., LTD.Inventors: Kengo Takemasa, Yuichi Yoshida, Toshihisa Sone, Kazuya Yamada, Akihiro Takei
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Patent number: 10615108Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.Type: GrantFiled: January 18, 2016Date of Patent: April 7, 2020Assignee: LAPIS SEMICONDUCTOR CO., LTD.Inventors: Toshihisa Sone, Kazuya Yamada, Akihiro Takei, Yuichi Yoshida, Kengo Takemasa
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Patent number: 10411715Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.Type: GrantFiled: November 3, 2017Date of Patent: September 10, 2019Assignee: LAPIS Semiconductor Co., Ltd.Inventors: Kazuya Yamada, Toshihisa Sone, Akihiro Takei, Yuichi Yoshida, Kengo Takemasa
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Publication number: 20190190449Abstract: A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.Type: ApplicationFiled: February 15, 2019Publication date: June 20, 2019Applicant: LAPIS Semiconductor Co., Ltd.Inventors: Kengo TAKEMASA, Yuichi YOSHIDA, Toshihisa SONE, Kazuya YAMADA, Akihiro TAKEI
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Patent number: 10243515Abstract: A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.Type: GrantFiled: August 31, 2017Date of Patent: March 26, 2019Assignee: LAPIS Semiconductor Co., Ltd.Inventors: Kengo Takemasa, Yuichi Yoshida, Toshihisa Sone, Kazuya Yamada, Akihiro Takei
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Patent number: 10141015Abstract: A reference block which is machined from a single body of material and is a single block with reference pins integral therewith is configured for use in a method of manufacturing a head suspension by laser-welding the flexure to the load beam at a first welding spot so that a tongue is pressed against a convex portion under predetermined load. The method includes steps of forming, before joining the flexure and load beam together, at least one positioning reference hole in each of the flexure and load beam within a circular range that is defined around the first welding spot with a radius equal to a distance between the first welding spot and the projection, laying the flexure and load beam one on another, inserting the reference pins of the reference pin block into the reference holes, and laser-welding the flexure and load beam to each other at the first welding spot.Type: GrantFiled: January 20, 2016Date of Patent: November 27, 2018Assignee: NHK Spring Co., Ltd.Inventors: Akihiro Takei, Naoki Tanaka
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Publication number: 20180076817Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.Type: ApplicationFiled: November 3, 2017Publication date: March 15, 2018Applicant: LAPIS Semiconductor Co., Ltd.Inventors: Kazuya YAMADA, Toshihisa SONE, Akihiro TAKEI, Yuichi YOSHIDA, Kengo TAKEMASA
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Publication number: 20180006604Abstract: A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.Type: ApplicationFiled: August 31, 2017Publication date: January 4, 2018Applicant: LAPIS Semiconductor Co., Ltd.Inventors: Kengo TAKEMASA, Yuichi YOSHIDA, Toshihisa SONE, Kazuya YAMADA, Akihiro TAKEI
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Patent number: 9838022Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.Type: GrantFiled: January 13, 2017Date of Patent: December 5, 2017Assignee: LAPIS SEMICONDUCTOR CO., LTD.Inventors: Kazuya Yamada, Toshihisa Sone, Akihiro Takei, Yuichi Yoshida, Kengo Takemasa
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Patent number: 9787250Abstract: A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.Type: GrantFiled: January 4, 2016Date of Patent: October 10, 2017Assignee: LAPIS SEMICONDUCTOR CO., LTD.Inventors: Kengo Takemasa, Yuichi Yoshida, Toshihisa Sone, Kazuya Yamada, Akihiro Takei
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Publication number: 20170126233Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.Type: ApplicationFiled: January 13, 2017Publication date: May 4, 2017Applicant: LAPIS Semiconductor Co., Ltd.Inventors: Kazuya YAMADA, Toshihisa SONE, Akihiro TAKEI, Yuichi YOSHIDA, Kengo TAKEMASA
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Patent number: 9584134Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.Type: GrantFiled: October 29, 2015Date of Patent: February 28, 2017Assignee: LAPIS SEMICONDUCTOR CO., LTD.Inventors: Kazuya Yamada, Toshihisa Sone, Akihiro Takei, Yuichi Yoshida, Kengo Takemasa
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Publication number: 20160155690Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.Type: ApplicationFiled: January 18, 2016Publication date: June 2, 2016Applicant: LAPIS Semiconductor Co., Ltd.Inventors: Toshihisa SONE, Kazuya YAMADA, Akihiro TAKEI, Yuichi YOSHIDA, Kengo TAKEMASA
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Publication number: 20160140988Abstract: A reference block which is machined from a single body of material and is a single block with reference pins integral therewith is configured for use in a method of manufacturing a head suspension by laser-welding the flexure to the load beam at a first welding spot so that a tongue is pressed against a convex portion under predetermined load. The method includes steps of forming, before joining the flexure and load beam together, at least one positioning reference hole in each of the flexure and load beam within a circular range that is defined around the first welding spot with a radius equal to a distance between the first welding spot and the projection, laying the flexure and load beam one on another, inserting the reference pins of the reference pin block into the reference holes, and laser-welding the flexure and load beam to each other at the first welding spot.Type: ApplicationFiled: January 20, 2016Publication date: May 19, 2016Inventors: Akihiro TAKEI, Naoki TANAKA
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Publication number: 20160118938Abstract: A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.Type: ApplicationFiled: January 4, 2016Publication date: April 28, 2016Applicant: LAPIS Semiconductor Co., Ltd.Inventors: Kengo TAKEMASA, Yuichi YOSHIDA, Toshihisa SONE, Kazuya YAMADA, Akihiro TAKEI