Abstract: At least one vertically alternating sequence of continuous insulating layers and continuous sacrificial material layers is formed over a substrate. Rows of backside support pillar structures are formed through the at least one vertically alternating sequence. Memory stack structures are formed through the at least one vertically alternating sequence. A two-dimensional array of discrete backside trenches is formed through the at least one vertically alternating sequence. Contiguous combinations of a subset of the backside trenches and a subset of the backside support pillar structures divide the at least one vertically alternating sequence into alternating stacks of insulating layers and sacrificial material layers. The sacrificial material layers are replaced with electrically conductive layers while the backside support pillar structures provide structural support to the insulating layers.

Abstract: At least one vertically alternating sequence of continuous insulating layers and continuous sacrificial material layers is formed over a substrate. Rows of backside support pillar structures are formed through the at least one vertically alternating sequence. Memory stack structures are formed through the at least one vertically alternating sequence. A two-dimensional array of discrete backside trenches is formed through the at least one vertically alternating sequence. Contiguous combinations of a subset of the backside trenches and a subset of the backside support pillar structures divide the at least one vertically alternating sequence into alternating stacks of insulating layers and sacrificial material layers. The sacrificial material layers are replaced with electrically conductive layers while the backside support pillar structures provide structural support to the insulating layers.

Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers, memory openings vertically extending through the alternating stack, and memory opening fill structures located within a respective one of the memory openings. Composite drain-select-level isolation structures divide each drain-select-level electrically conductive layer into a respective plurality of electrically conductive strips. Each drain-select-level isolation structure includes a respective first drain-select-level isolation material portion vertically extending through each drain-select-level electrically conductive layers and a respective set of second drain-select-level isolation material portions vertically extending through each of the drain-select-level electrically conductive layers and at least a topmost dummy electrically conductive layer that underlies the drain-select-level electrically conductive layers.

Abstract: A vertically alternating sequence of unit layer stacks is formed over a substrate. Each unit layer stacks includes an insulating layer and a spacer material layer that is formed as, or is subsequently replaced with, a first electrically conductive layer. A 2×N array of stepped surfaces is formed. Each column of two stepped surfaces other than one column is vertically extended by performing a set of processing sequences at least once. The set of processing sequences includes forming a patterned etch mask layer and etching an unmasked subset of the 2×N array. One or more patterned etch mask layer has a respective continuous opening including an entire area of a respective 2×M array of stepped surfaces that is a subset of the 2×N array of stepped surfaces. Vertical stacks of memory elements are formed through the vertically alternating sequence.

Abstract: An alternating stack of insulating layers and spacer material layers is formed over a substrate. The spacer material layers are formed as, or are subsequently replaced with, electrically conductive layers. Memory openings and support openings are formed through the alternating stack. The memory openings are arranged in a first hexagonal array having a nearest-neighbor direction that is parallel to a first horizontal direction, and the support openings are arranged in a second hexagonal array having a nearest-neighbor direction that is perpendicular to the first horizontal direction. Memory opening fill structures are formed within a respective one of the memory openings, and support pillar structures within a respective one of the support openings.

Abstract: A method includes providing a first wafer including a respective set of first metal bonding pads and at least one first alignment diagnostic structure, providing a second wafer including a respective set of second metal bonding pads and a respective set of second alignment diagnostic structures, overlaying the first wafer and the second wafer, measuring at least one of a current, voltage or contact resistance between the first alignment diagnostic structures and the second alignment diagnostic structures to determine an overlay offset, and bonding the second wafer to the first wafer.

Abstract: An alternating stack of insulating layers and sacrificial material layers is formed over a substrate. Memory openings and support openings are formed through the alternating stack, and memory opening fill structures and support pillar structures are formed in the memory openings and in the support openings, respectively. Via cavities extending to each of the sacrificial material layers are formed through the alternating stack without forming any stepped surfaces in the alternating stack. The via cavities may be formed in areas that do not overlap with the support pillar structures, or in areas that include at least one support pillar structure. Sacrificial via fill structures are formed in the via cavies, and the sacrificial material layers are replaced with electrically conductive layers. The sacrificial via fill structures are removed, and a combination of a tubular dielectric spacer and a contact via structure can be formed in the via cavities.

Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers, where the electrically conductive layers include word-line-level electrically conductive layers and drain-select-level electrically conductive layers located above the word-line-level electrically conductive layers, memory opening fill structures vertically extending through the alternating stack, and drain-select-level contact via structures. A first one of the drain-select level contact structures directly contacts at least a first two of the drain-select-level electrically conductive layers that are vertically spaced apart from each other. A second one of the drain-select level contact structures directly contacts at least a second two of the drain-select-level electrically conductive layers that are vertically spaced apart from each other and which are located below the at least the first two of the drain-select-level electrically conductive layers.

Abstract: A vertically alternating sequence of unit layer stacks is formed over a substrate. Each unit layer stacks includes an insulating layer and a spacer material layer that is formed as, or is subsequently replaced with, a first electrically conductive layer. A 2×N array of stepped surfaces is formed. Each column of two stepped surfaces other than one column is vertically extended by performing a set of processing sequences at least once. The set of processing sequences includes forming a patterned etch mask layer and etching an unmasked subset of the 2×N array. One or more patterned etch mask layer has a respective continuous opening including an entire area of a respective 2×M array of stepped surfaces that is a subset of the 2×N array of stepped surfaces. Vertical stacks of memory elements are formed through the vertically alternating sequence.

Abstract: An alternating stack of insulating layers and sacrificial material layers is formed over a substrate. Memory openings and support openings are formed through the alternating stack, and memory opening fill structures and support pillar structures are formed in the memory openings and in the support openings, respectively. Via cavities extending to each of the sacrificial material layers are formed through the alternating stack without forming any stepped surfaces in the alternating stack. The via cavities may be formed in areas that do not overlap with the support pillar structures, or in areas that include at least one support pillar structure. Sacrificial via fill structures are formed in the via cavies, and the sacrificial material layers are replaced with electrically conductive layers. The sacrificial via fill structures are removed, and a combination of a tubular dielectric spacer and a contact via structure can be formed in the via cavities.

Abstract: A method includes providing a first wafer including a respective set of first metal bonding pads and at least one first alignment diagnostic structure, providing a second wafer including a respective set of second metal bonding pads and a respective set of second alignment diagnostic structures, overlaying the first wafer and the second wafer, measuring at least one of a current, voltage or contact resistance between the first alignment diagnostic structures and the second alignment diagnostic structures to determine an overlay offset, and bonding the second wafer to the first wafer.

Abstract: A method includes forming a first-tier alternating stack of first insulating layers and first sacrificial material layers, forming a joint dielectric layer over the first-tier alternating stack, such that the joint dielectric layer is thicker than each of the first insulating layers and the first sacrificial material layers, forming a second-tier alternating stack of second insulating layers and second sacrificial material layers over the joint dielectric layer and the first-tier alternating stack, performing a level-shift anisotropic etch process to form a recess trench or via cavities vertically extending through the second-tier alternating stack and down to the joint dielectric layer, and performing an extension etching process to extend the recess trench or the via cavities through at least the joint dielectric level. At least one of etching time or etching power used during the extension etching process is different from that used during the level-shift anisotropic etch process.

Abstract: At least one vertically alternating sequence of continuous insulating layers and continuous sacrificial material layers is formed over a substrate. Rows of backside support pillar structures are formed through the at least one vertically alternating sequence. Memory stack structures are formed through the at least one vertically alternating sequence. A two-dimensional array of discrete backside trenches is formed through the at least one vertically alternating sequence. Contiguous combinations of a subset of the backside trenches and a subset of the backside support pillar structures divide the at least one vertically alternating sequence into alternating stacks of insulating layers and sacrificial material layers. The sacrificial material layers are replaced with electrically conductive layers while the backside support pillar structures provide structural support to the insulating layers.

Abstract: An alternating stack of insulating layers and sacrificial material layers is formed over a substrate. Memory openings and support openings are formed through the alternating stack, and memory opening fill structures and support pillar structures are formed in the memory openings and in the support openings, respectively. Via cavities extending to each of the sacrificial material layers are formed through the alternating stack without forming any stepped surfaces in the alternating stack. The via cavities may be formed in areas that do not overlap with the support pillar structures, or in areas that include at least one support pillar structure. Sacrificial via fill structures are formed in the via cavies, and the sacrificial material layers are replaced with electrically conductive layers. The sacrificial via fill structures are removed, and a combination of a tubular dielectric spacer and a contact via structure can be formed in the via cavities.

Abstract: An alternating stack of insulating layers and sacrificial material layers is formed over a substrate. Memory openings and support openings are formed through the alternating stack, and memory opening fill structures and support pillar structures are formed in the memory openings and in the support openings, respectively. Via cavities extending to each of the sacrificial material layers are formed through the alternating stack without forming any stepped surfaces in the alternating stack. The via cavities may be formed in areas that do not overlap with the support pillar structures, or in areas that include at least one support pillar structure. Sacrificial via fill structures are formed in the via cavies, and the sacrificial material layers are replaced with electrically conductive layers. The sacrificial via fill structures are removed, and a combination of a tubular dielectric spacer and a contact via structure can be formed in the via cavities.

Abstract: An alternating stack of insulating layers and spacer material layers is formed over a substrate. Memory stack structures are formed through the alternating stack. A pair of backside trenches and a set of nested trenches are simultaneously formed through the alternating stack. Each trench within the set of nested trenches is spaced from any other trench within the set of nested trenches by at least one patterned remaining portion of the alternating stack having a respective shape of an enclosing wall. The at least one patterned remaining portion of the alternating stack is removed from inside to outside using sequential etch processes. A dielectric pillar structure is formed within the pillar-shaped cavity. The sacrificial material layers are replaced with electrically conductive layers. A through-memory-level conductive via structure is formed through the dielectric pillar structure.

Abstract: An alternating stack of insulating layers and spacer material layers is formed over a substrate. Memory stack structures are formed through the alternating stack. A pair of backside trenches and a set of nested trenches are simultaneously formed through the alternating stack. Each trench within the set of nested trenches is spaced from any other trench within the set of nested trenches by at least one patterned remaining portion of the alternating stack having a respective shape of an enclosing wall. The at least one patterned remaining portion of the alternating stack is removed from inside to outside using sequential etch processes. A dielectric pillar structure is formed within the pillar-shaped cavity. The sacrificial material layers are replaced with electrically conductive layers. A through-memory-level conductive via structure is formed through the dielectric pillar structure.

Abstract: An alternating stack of insulating layers and spacer material layers is formed over a substrate. Memory stack structures are formed through the alternating stack. A pair of backside trenches and a set of nested trenches are simultaneously formed through the alternating stack. Each trench within the set of nested trenches is spaced from any other trench within the set of nested trenches by at least one patterned remaining portion of the alternating stack having a respective shape of an enclosing wall. The at least one patterned remaining portion of the alternating stack is removed from inside to outside using sequential etch processes. A dielectric pillar structure is formed within the pillar-shaped cavity. The sacrificial material layers are replaced with electrically conductive layers. A through-memory-level conductive via structure is formed through the dielectric pillar structure.

Abstract: An alternating stack of insulating layers and spacer material layers is formed over a substrate. Memory stack structures are formed through the alternating stack. A pair of backside trenches and a set of nested trenches are simultaneously formed through the alternating stack. Each trench within the set of nested trenches is spaced from any other trench within the set of nested trenches by at least one patterned remaining portion of the alternating stack having a respective shape of an enclosing wall. The at least one patterned remaining portion of the alternating stack is removed from inside to outside using sequential etch processes. A dielectric pillar structure is formed within the pillar-shaped cavity. The sacrificial material layers are replaced with electrically conductive layers. A through-memory-level conductive via structure is formed through the dielectric pillar structure.

Abstract: A reticle for a semiconductor lithography process includes a glass plate having regions with a reduced optical transmission factor. The regions may include arrays of elements comprising defects such as cracks or voids which are formed by laser pulses. The regions may be adjacent to openings in an opaque material at the bottom of the reticle to shield the openings from a portion of the light which illuminates the reticle from the top. As a result, the light which exits the reticle and is used to pattern a substrate has an asymmetric intensity. This allows the substrate to be patterned with an inspection mark which indicates whether a defocus condition exists, and whether there is a positive or negative defocus condition. Related methods use a reticle to form a pattern on a substrate and for adjusting a focus condition using a reticle.