Patents by Inventor Akihisa Matsuda

Akihisa Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11373800
    Abstract: A magnetic coupling coil component according to one embodiment of the present invention includes: an insulating layer; a first coil conductor embedded in the insulating layer, the first coil conductor having a first top coil surface and a first bottom coil surface; a second coil conductor embedded in the insulating layer, the second coil conductor having a second top coil surface and a second bottom coil surface; a first cover layer provided on a first surface of the insulating layer so as to be opposed to the first top coil surface; and a second cover layer provided on a second surface of the insulating layer opposite to the first surface so as to be opposed to the second bottom coil surface. At least one of the first cover layer and the second cover layer has a magnetic permeability higher than a magnetic permeability of the insulating layer.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: June 28, 2022
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takayuki Arai, Masanori Nagano, Akihisa Matsuda, Daisuke Yamaguchi, Naoya Terauchi
  • Publication number: 20220122766
    Abstract: A coil component according to one embodiment of the present invention includes: a first insulator body containing first magnetic metal particles; a second insulator body containing second magnetic metal particles; a first coil conductor provided in the first insulator body and wound around a coil axis for N1 turns such that intervals between adjacent turns are g1; and a second coil conductor provided in the second insulator body and wound around the coil axis for N2 turns such that intervals between adjacent turns are g2. In the embodiment, a first coil surface of the first coil conductor faces a second coil surface of the second coil conductor, and a distance T between the first coil surface and the second coil surface satisfies a relationship T?g1×N1+g2×N2.
    Type: Application
    Filed: December 29, 2021
    Publication date: April 21, 2022
    Inventors: Akihisa MATSUDA, Daisuke YAMAGUCHI, Takayuki ARAI
  • Patent number: 11217384
    Abstract: A coil component according to one embodiment of the present invention includes: a first insulator body containing first filler particles at least partially having electrical conductivity; a second insulator body containing second filler particles at least partially having electrical conductivity; a first coil conductor provided in the first insulator body and wound around a coil axis for N1 turns such that intervals between adjacent turns are g1; and a second coil conductor provided in the second insulator body and wound around the coil axis for N2 turns such that intervals between adjacent turns are g2. In the embodiment, a first coil surface of the first coil conductor faces a second coil surface of the second coil conductor, and a distance T between the first coil surface and the second coil surface satisfies a relationship T?g1×N1+g2×N2.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: January 4, 2022
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Akihisa Matsuda, Daisuke Yamaguchi, Takayuki Arai
  • Patent number: 11114235
    Abstract: A magnetic coupling coil component includes: a main body including a first region, a second region disposed on a top side of the first region, and a third region disposed on a bottom side of the first region; a top-side coil conductor provided in the second region of the main body and wound around a coil axis extending in a top-bottom direction; and a bottom-side coil conductor provided in the third region of the main body and wound around the coil axis. The top-side coil conductor includes a plurality of top-side conductive patterns, and the plurality of top-side conductive patterns include a first top-side conductive pattern which is positioned closest to the first region among the plurality of top-side conductive patterns, and a number of turns of the first top-side conductive pattern is larger than an average of numbers of turns of the plurality of top-side conductive patterns.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: September 7, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takayuki Arai, Masanori Nagano, Akihisa Matsuda, Daisuke Yamaguchi, Naoya Terauchi
  • Publication number: 20190148060
    Abstract: A magnetic coupling coil component includes: a main body including a first region, a second region disposed on a top side of the first region, and a third region disposed on a bottom side of the first region; a top-side coil conductor provided in the second region of the main body and wound around a coil axis extending in a top-bottom direction; and a bottom-side coil conductor provided in the third region of the main body and wound around the coil axis. The top-side coil conductor includes a plurality of top-side conductive patterns, and the plurality of top-side conductive patterns include a first top-side conductive pattern which is positioned closest to the first region among the plurality of top-side conductive patterns, and a number of turns of the first top-side conductive pattern is larger than an average of numbers of turns of the plurality of top-side conductive patterns.
    Type: Application
    Filed: November 6, 2018
    Publication date: May 16, 2019
    Inventors: Takayuki ARAI, Masanori NAGANO, Akihisa MATSUDA, Daisuke YAMAGUCHI, Naoya TERAUCHI
  • Publication number: 20190131063
    Abstract: A magnetic coupling coil component according to one embodiment of the present invention includes: an insulating layer; a first coil conductor embedded in the insulating layer, the first coil conductor having a first top coil surface and a first bottom coil surface; a second coil conductor embedded in the insulating layer, the second coil conductor having a second top coil surface and a second bottom coil surface; a first cover layer provided on a first surface of the insulating layer so as to be opposed to the first top coil surface; and a second cover layer provided on a second surface of the insulating layer opposite to the first surface so as to be opposed to the second bottom coil surface. At least one of the first cover layer and the second cover layer has a magnetic permeability higher than a magnetic permeability of the insulating layer.
    Type: Application
    Filed: October 16, 2018
    Publication date: May 2, 2019
    Inventors: Takayuki ARAI, Masanori NAGANO, Akihisa MATSUDA, Daisuke YAMAGUCHI, Naoya TERAUCHI
  • Publication number: 20190103216
    Abstract: A coil component according to one embodiment of the present invention includes: a first insulator body containing first filler particles at least partially having electrical conductivity; a second insulator body containing second filler particles at least partially having electrical conductivity; a first coil conductor provided in the first insulator body and wound around a coil axis for N1 turns such that intervals between adjacent turns are g1; and a second coil conductor provided in the second insulator body and wound around the coil axis for N2 turns such that intervals between adjacent turns are g2. In the embodiment, a first coil surface of the first coil conductor faces a second coil surface of the second coil conductor, and a distance T between the first coil surface and the second coil surface satisfies a relationship T?g1×N1+g2×N2.
    Type: Application
    Filed: September 25, 2018
    Publication date: April 4, 2019
    Inventors: Akihisa MATSUDA, Daisuke YAMAGUCHI, Takayuki ARAI
  • Patent number: 9190202
    Abstract: A laminated inductor includes a component body that provides a mounting surface on one of its faces, and at least a pair of external electrodes are formed on the mounting surface, wherein the component body has a laminate constituted by multiple insulator layers, a spiral coil conductor formed in the laminate, and leader parts that electrically connect the coil conductor and external electrodes; the coil conductor comprises conductor patterns formed in the insulator layers and via hole conductors that penetrate through the insulator layers and electrically connect the multiple conductor patterns, and also has a coil axis running roughly in parallel with the mounting surface and a turn unit having one or more sides running roughly in parallel with the mounting surface; and the via hole conductors are formed only on the side farthest away from the mounting surface among the one or more sides.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: November 17, 2015
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Koji Ishii, Akihisa Matsuda, Yo Fujitsuna, Kazuhiko Oyama, Yasuyuki Taki
  • Patent number: 8962619
    Abstract: The present invention relates to substituted imidazopyridinyl-aminopyridine compounds and methods of synthesizing these compounds. The present invention also relates to pharmaceutical compositions containing substituted imidazopyridinyl-aminopyridine compounds and methods of treating cell proliferative disorders, such as cancer, by administering these compounds and pharmaceutical compositions to subjects in need thereof.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: February 24, 2015
    Assignee: ArQule, Inc.
    Inventors: Mark A. Ashwell, Chris Brassard, Anton Filikov, Jason Hill, Steffi Koerner, Jean-Marc Lapierre, Yanbin Liu, Nivedita Namdev, Robert Nicewonger, Rocio Palma, Manish Tandon, David Vensel, Akihisa Matsuda, Shin Iimura, Kenichi Yoshida, Takanori Yamazaki, Takahiro Kitamura, Takeshi Isoyama
  • Patent number: 8815854
    Abstract: The present invention relates to substituted imidazopyridinyl compounds and methods of synthesizing these compounds. The present invention also relates to pharmaceutical compositions containing substituted imidazopyridinyl compounds and methods of treating cell proliferative disorders, such as cancer, by administering these compounds and pharmaceutical compositions to subjects in need thereof.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: August 26, 2014
    Assignee: ArQule, Inc.
    Inventors: Mark A. Ashwell, Chris Brassard, Anton Filikov, Jason Hill, Steffi Koerner, Jean-Marc Lapierre, Yanbin Liu, Nivedita Namdev, Robert Nicewonger, Rocio Palma, Manish Tandon, David Vensel, Akihisa Matsuda, Shin Iimura, Yuko Yamamoto, Takeshi Isoyama
  • Publication number: 20140145815
    Abstract: A laminated inductor includes a component body that provides a mounting surface on one of its faces, and at least a pair of external electrodes are formed on the mounting surface, wherein the component body has a laminate constituted by multiple insulator layers, a spiral coil conductor formed in the laminate, and leader parts that electrically connect the coil conductor and external electrodes; the coil conductor comprises conductor patterns formed in the insulator layers and via hole conductors that penetrate through the insulator layers and electrically connect the multiple conductor patterns, and also has a coil axis running roughly in parallel with the mounting surface and a turn unit having one or more sides running roughly in parallel with the mounting surface; and the via hole conductors are formed only on the side farthest away from the mounting surface among the one or more sides.
    Type: Application
    Filed: November 27, 2013
    Publication date: May 29, 2014
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Koji ISHII, Akihisa MATSUDA, Yo FUJITSUNA, Kazuhiko OYAMA, Yasuyuki TAKI
  • Publication number: 20140073635
    Abstract: The present invention relates to substituted imidazopyridinyl-aminopyridine compounds and methods of synthesizing these compounds. The present invention also relates to pharmaceutical compositions containing substituted imidazopyridinyl-aminopyridine compounds and methods of treating cell proliferative disorders, such as cancer, by administering these compounds and pharmaceutical compositions to subjects in need thereof.
    Type: Application
    Filed: November 8, 2013
    Publication date: March 13, 2014
    Inventors: Mark A. Ashwell, Chris Brassard, Anton Filikov, Jason Hill, Steffi Koerner, Jean-Marc Lapierre, Yanbin Liu, Nivedita Namdev, Robert Nicewonger, Rocio Palma, Manish Tandon, David Vensel, Akihisa Matsuda, Shin Iimura, Kenichi Yoshida, Takanori Yamazaki, Takahiro Kitamura, Takeshi Isoyama
  • Patent number: 8609688
    Abstract: The present invention relates to substituted imidazopyridinyl-aminopyridine compounds and methods of synthesizing these compounds. The present invention also relates to pharmaceutical compositions containing substituted imidazopyridinyl-aminopyridine compounds and methods of treating cell proliferative disorders, such as cancer, by administering these compounds and pharmaceutical compositions to subjects in need thereof.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: December 17, 2013
    Assignee: ArQule, Inc.
    Inventors: Mark A. Ashwell, Chris Brassard, Anton Filikov, Jason Hill, Steffi Koerner, Jean-Marc Lapierre, Yanbin Liu, Nivedita Namdev, Robert Nicewonger, Rocio Palma, Manish Tandon, David Vensel, Akihisa Matsuda, Shin Iimura, Kenichi Yoshida, Takanori Yamazaki, Takahiro Kitamura, Takeshi Isoyama
  • Patent number: 8569331
    Abstract: The present invention relates to substituted benzo[f]imidazo[1,2-d]pyrido[2,3-b][1,4]diazepine compounds and methods of synthesizing these compounds. The present invention also relates to pharmaceutical compositions containing substituted benzo[f]imidazo[1,2-d]pyrido[2,3-b][1,4]diazepine compounds and methods of treating cell proliferative disorders, such as cancer, by administering these compounds and pharmaceutical compositions to subjects in need thereof.
    Type: Grant
    Filed: November 1, 2011
    Date of Patent: October 29, 2013
    Assignee: ArQule, Inc.
    Inventors: Mark A. Ashwell, Sudharshan Eathiraj, Anton Filikov, Steffi Koerner, Jean-Marc Lapierre, Yanbin Liu, Rocio Palma, David Vensel, Shin Iimura, Akiko Shiina, Kenichi Yoshida, Takanori Yamazaki, Akihisa Matsuda
  • Patent number: 8501770
    Abstract: The present invention relates to substituted imidazopyridinyl-aminopyridine compounds and methods of synthesizing these compounds. The present invention also relates to pharmaceutical compositions containing substituted imidazopyridinyl-aminopyridine compounds and methods of treating cell proliferative disorders, such as cancer, by administering these compounds and pharmaceutical compositions to subjects in need thereof.
    Type: Grant
    Filed: December 29, 2010
    Date of Patent: August 6, 2013
    Assignee: ArQule, Inc.
    Inventors: Mark A. Ashwell, Chris Brassard, Anton Filikov, Jason Hill, Steffi Koerner, Jean-Marc Lapierre, Yanbin Liu, Nivedita Namdev, Robert Nicewonger, Rocio Palma, Manish Tandon, David Vensel, Akihisa Matsuda, Shin Iimura, Yuko Yamamoto
  • Publication number: 20120329791
    Abstract: The present invention relates to substituted imidazopyridinyl-aminopyridine compounds and methods of synthesizing these compounds. The present invention also relates to pharmaceutical compositions containing substituted imidazopyridinyl-aminopyridine compounds and methods of treating cell proliferative disorders, such as cancer, by administering these compounds and pharmaceutical compositions to subjects in need thereof.
    Type: Application
    Filed: June 21, 2012
    Publication date: December 27, 2012
    Applicant: ArQuele, Inc.
    Inventors: Mark A. Ashwell, Chris Brassard, Anton Filikov, Jason Hill, Steffi Koerner, Jean-Marc Lapierre, Yanbin Liu, Nivedita Namdev, Robert Nicewonger, Rocio Palma, Manish Tandon, David Vensel, Akihisa Matsuda, Shin Iimura, Kenichi Yoshida, Takanori Yamazaki, Takahiro Kitamura, Takeshi Isoyama
  • Publication number: 20120329793
    Abstract: The present invention relates to substituted imidazopyridinyl compounds and methods of synthesizing these compounds. The present invention also relates to pharmaceutical compositions containing substituted imidazopyridinyl compounds and methods of treating cell proliferative disorders, such as cancer, by administering these compounds and pharmaceutical compositions to subjects in need thereof.
    Type: Application
    Filed: June 21, 2012
    Publication date: December 27, 2012
    Applicant: ArQule, Inc.
    Inventors: Mark A. Ashwell, Chris Brassard, Anton Filikov, Jason Hill, Steffi Koerner, Jean-Marc Lapierre, Yanbin Liu, Nivedita Namdev, Robert Nicewonger, Rocio Palma, Manish Tandon, David Vensel, Akihisa Matsuda, Shin Iimura, Yuko Yamamoto, Takeshi Isoyama
  • Publication number: 20120108574
    Abstract: The present invention relates to substituted benzo-imidazo-pyrido-diazepine compounds and methods of synthesizing these compounds. The present invention also relates to pharmaceutical compositions containing substituted benzo-imidazo-pyrido-diazepine compounds and methods of treating cell proliferative disorders, such as cancer, by administering these compounds and pharmaceutical compositions to subjects in need thereof.
    Type: Application
    Filed: November 1, 2011
    Publication date: May 3, 2012
    Applicant: ArQule, Inc.
    Inventors: Mark A. Ashwell, Sudharshan Eathiraj, Anton Filikov, Steffi Koerner, Jean-Marc Lapierre, Yanbin Liu, Rocio Palma, David Vensel, Shin Iimura, Akiko Shiina, Kenichi Yoshida, Takanori Yamazaki, Akihisa Matsuda
  • Publication number: 20110172203
    Abstract: The present invention relates to substituted imidazopyridinyl-aminopyridine compounds and methods of synthesizing these compounds. The present invention also relates to pharmaceutical compositions containing substituted imidazopyridinyl-aminopyridine compounds and methods of treating cell proliferative disorders, such as cancer, by administering these compounds and pharmaceutical compositions to subjects in need thereof.
    Type: Application
    Filed: December 29, 2010
    Publication date: July 14, 2011
    Applicant: ArQule, Inc.
    Inventors: Mark A. Ashwell, Chris Brassard, Anton Filikov, Jason Hill, Steffi Koerner, Jean-Marc Lapierre, Yanbin Liu, Nivedita Namdev, Robert Nicewonger, Rocio Palma, Manish Tandon, David Vensel, Akihisa Matsuda, Shin Iimura, Yuko Yamamoto
  • Patent number: RE47950
    Abstract: A laminated inductor includes a component body that provides a mounting surface on one of its faces, and at least a pair of external electrodes are formed on the mounting surface, wherein the component body has a laminate constituted by multiple insulator layers, a spiral coil conductor formed in the laminate, and leader parts that electrically connect the coil conductor and external electrodes; the coil conductor comprises conductor patterns formed in the insulator layers and via hole conductors that penetrate through the insulator layers and electrically connect the multiple conductor patterns, and also has a coil axis running roughly in parallel with the mounting surface and a turn unit having one or more sides running roughly in parallel with the mounting surface; and the via hole conductors are formed only on the side farthest away from the mounting surface among the one or more sides.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: April 14, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Koji Ishii, Akihisa Matsuda, Yo Fujitsuna, Kazuhiko Oyama, Yasuyuki Taki