Patents by Inventor Akiko Tanaka

Akiko Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250035833
    Abstract: An optical laminate includes: a first optical sheet that has a first main surface with a relief structure thereon and a second main surface on the reverse side from the first main surface; and a second optical sheet that has a third main surface disposed on the first main surface side of the first optical sheet. The relief structure of the first main surface includes a plurality of recessed portions and flat portions that are each between two recessed portions adjacent to one another among the plurality of recessed portions. The third main surface and the flat portions of the first main surface are bonded by covalent bonding with a molecular adhesive therebetween.
    Type: Application
    Filed: October 21, 2022
    Publication date: January 30, 2025
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tatsuya SUZUKI, Kaori MIZOBATA, Kaori SHINYA, Satoshi HONDA, Akiko TANAKA, Mizuho MIZUNO, Shigeki ISHIGURO
  • Patent number: 12158362
    Abstract: The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, in which the FBG sensor is held by the resin portion.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: December 3, 2024
    Assignees: NITTO DENKO CORPORATION, IHI INSPECTION AND INSTRUMENTATION CO., LTD.
    Inventors: Akiko Tanaka, Shigeki Ishiguro, Yoshiko Kira, Shintaro Fukumoto, Shun Imagawa, Takayuki Nishido
  • Publication number: 20240392167
    Abstract: Provided is a PSA sheet having an active energy ray-curable PSA layer that is less susceptible to reduction of hardness to the curable component. The PSA sheet provided comprises an active energy ray-curable PSA layer. The PSA forming the PSA layer comprises a base polymer and a resin A. The resin A is an active energy ray-curable resin having a glans transition temperature of 0° C. or higher by DSC analysis.
    Type: Application
    Filed: August 18, 2022
    Publication date: November 28, 2024
    Inventors: Mizuho MIZUNO, Akiko TANAKA
  • Publication number: 20240384144
    Abstract: An adhesive kit includes: an adhesive layer containing an epoxy resin and an elastomer; and a curing agent liquid composition capable of curing the adhesive layer by contact and a reaction with the adhesive layer, in which the adhesive layer contains 1 mass % to 30 mass % of the elastomer.
    Type: Application
    Filed: September 22, 2022
    Publication date: November 21, 2024
    Inventors: Yuto SUZUKI, Akiko TANAKA
  • Patent number: 12013410
    Abstract: An automatic analysis apparatus of an embodiment includes a holder, a first dispenser, a second dispenser, a detector, a memory, and processing circuitry. The holder movably holds a plurality of reaction vessels. The first dispenser dispenses an analyte into each of the reaction vessels. The second dispenser dispenses a reagent into the reaction vessel. The detector detects light transmitted through the reaction vessel. The memory stores a test order. The processing circuitry controls the holder, the first dispenser, and the second dispenser based on the test order. The processing circuitry determines one of the reaction vessels to be used for measuring the analyte based on the test order, and performs control to collect characteristic data from another of the reaction vessels not used for measuring the analyte while the analyte is measured.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: June 18, 2024
    Assignee: CANON MEDICAL SYSTEMS CORPORATION
    Inventors: Isamu Matsuda, Takehiko Oonuma, Akiko Tanaka
  • Publication number: 20240124755
    Abstract: An adhesive layer is formed by cross-linking an adhesive composition containing: a polyester resin that is a copolymer of a polycarboxylic acid and a polyalcohol; a cross-linking agent; and at least one cross-linking catalyst selected from the group consisting of an organic zirconium compound, an organic iron compound, and an organic aluminum compound, the adhesive layer having a gel fraction of 40% or more after being retained at a temperature of 85° C. and a relative humidity of 85% for 300 hours, and having a 180° peel adhesive strength of 100 mN/20 mm or more with respect to a PMMA film.
    Type: Application
    Filed: February 4, 2022
    Publication date: April 18, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Taishi OGAWA, Akiko TANAKA, Mizuho MIZUNO, Kozo NAKAMURA
  • Publication number: 20240061157
    Abstract: An optical stack includes: a first optical sheet having a first principal face with a concavo-convex structure and a second principal face at an opposite side from the first principal face; and an adhesive layer that is disposed on the first principal face of the first optical sheet. The concavo-convex structure includes a plurality of dents and flat portions between adjacent ones of the plurality of dents. A surface of the adhesive layer and the first principal face of the first optical sheet together define an internal space within each of the plurality of dents. Each of the plurality of dents satisfies 0.10?(C?A)/C 1.00 and 0.75?(C?A)/(C?B), where A is a maximum height value of the adhesive layer existing in that dent; B is a minimum height value of the adhesive layer existing in that dent; and C is a depth of that dent.
    Type: Application
    Filed: February 4, 2022
    Publication date: February 22, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Akiko TANAKA, Mizuho MIZUNO, Kozo NAKAMURA, Yufeng WENG
  • Publication number: 20240002707
    Abstract: A bonding method for providing an adhesive layer and a curing agent layer between a first adherend and a second adherend to bond the first adherend and the second adherend in which: the adhesive layer contains an epoxy resin as a main component and is cured by an effect of the curing agent layer; a curing agent contained in the curing agent layer is a polymerization catalyst type curing agent; and a thickness A (m) of the adhesive layer before curing and the application amount B (kg/m2) of the curing agent contained in the curing agent layer satisfy 5<B/A<900.
    Type: Application
    Filed: November 18, 2021
    Publication date: January 4, 2024
    Inventors: Akiko TANAKA, Yuto SUZUKI, Chie HAMADA
  • Publication number: 20230125153
    Abstract: A bonding sheet (X) of the present invention includes a matrix resin, a plurality of solder particles, and a plurality of flux particles, and has a sheet thickness T. In the bonding sheet (X), a particle size D50 of the solder particles is 12 ?m or less, a particle size D50 of the flux particles is 30 ?m or less, and a ratio of a particle size D90 of the solder particles and a particle size D90 of the flux particles to the sheet thickness T is 0.95 or less.
    Type: Application
    Filed: March 5, 2021
    Publication date: April 27, 2023
    Inventors: Akiko TANAKA, Yuichiro SHISHIDO, Ayumi NISHIMARU
  • Publication number: 20230110868
    Abstract: An adhesive composition layer is made from an adhesive composition that includes: a polymer including a copolymer of at least one (meth)acrylate monomer and at least one copolymerizable functional group-containing monomer selected from the group consisting of hydroxyl group-containing copolymerizable monomers, carboxyl group-containing copolymerizable monomers, and nitrogen-containing vinyl monomers; and a curable resin. The adhesive composition layer has a 23° C. initial tensile modulus of elasticity of 0.35 MPa or more and yet 8.00 MPa or less before curing the curable resin in the adhesive composition, and a 23° C. initial tensile modulus of elasticity of 1.00 MPa or more after curing the curable resin in the adhesive composition.
    Type: Application
    Filed: February 19, 2021
    Publication date: April 13, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Mizuho MIZUNO, Akiko TANAKA, Kozo NAKAMURA
  • Publication number: 20230115205
    Abstract: An optical-fiber-embedding sheet which is a strip-shaped sheet material containing an optical fiber to be used as a sensor and is configured of a base material and an adhesive layer formed thereover which is to be bonded to a placement object where the optical fiber is to be placed, the optical fiber having been embedded in the adhesive layer. The optical fiber is placed by applying a primer, which is for curing the adhesive layer by a chemical reaction with the adhesive layer, to a placement object for the optical fiber and thereafter applying the optical-fiber-embedding sheet to the portion of the placement object to which the primer has been applied.
    Type: Application
    Filed: March 19, 2021
    Publication date: April 13, 2023
    Inventors: Naoki SOGABE, Michio IMAI, Yohei TAIRA, Akiko TANAKA, Takehiko MISHIMA, Chie HAMADA
  • Publication number: 20230102613
    Abstract: An adhesive layer (20a) has a creep deformation rate when a stress of 10000 Pa is applied at 50° C. for 1 second is 10% or less, and a creep deformation rate when a stress of 10000 Pa is applied at 50° C. for 30 minutes is 16% or less, in a creep test using a rotational rheometer, and has a 180° peel adhesive strength of 10 mN/20 mm or more with respect to a PMMA film.
    Type: Application
    Filed: February 19, 2021
    Publication date: March 30, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Mizuho MIZUNO, Akiko TANAKA, Naofumi KOSAKA, Kozo NAKAMURA
  • Publication number: 20220349733
    Abstract: The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, in which the FBG sensor is held by the resin portion.
    Type: Application
    Filed: September 16, 2020
    Publication date: November 3, 2022
    Inventors: Akiko TANAKA, Shigeki ISHIGURO, Yoshiko KIRA, Shintaro FUKUMOTO, Shun IMAGAWA, Takayuki NISHIDO
  • Publication number: 20220186083
    Abstract: The invention relates to a curable adhesive sheet which has an adhesive layer formed from an adhesive composition containing an epoxy resin, a latent curing agent and a gelling agent and in which the latent curing agent has a reaction initiation temperature of 45° C. or higher and 120° C. or lower.
    Type: Application
    Filed: March 17, 2020
    Publication date: June 16, 2022
    Inventors: Akiko TANAKA, Ayumi NITTA, Atsushi YASUI
  • Publication number: 20220153921
    Abstract: The invention relates to a resin composition containing an epoxy resin and a latent curing agent in which the epoxy resin contains an aliphatic epoxy resin containing a hydroxyl group and having a water dissolution rate of 65% or more and in which the latent curing agent has a reaction initiation temperature of 45° C. or higher and 120° C. or lower.
    Type: Application
    Filed: March 17, 2020
    Publication date: May 19, 2022
    Inventors: Ayumi NITTA, Akiko TANAKA, Atsushi YASUI
  • Patent number: 11274231
    Abstract: A stickable-curable adhesive sheet bonds a deformation/conversion device to an adherend. The stickable-curable adhesive sheet contains a stickable-curable adhesive component and a curing component curing the stickable-curable adhesive component. The stickable-curable adhesive component has pressure-sensitive adhesiveness before curing and the initial tensile elastic modulus at 25° C. of the stickable-curable adhesive sheet after curing is 5×108 Pa or more.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: March 15, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Akiko Tanaka, Keisuke Shimokita, Kenichi Okada, Masayuki Minakata
  • Patent number: 10954216
    Abstract: The present invention relates to novel and excellent small-molecule-compounds that specifically antagonize BMP signal pathways, and these compounds can be used to modulate cell growth, differentiation, proliferation, and apoptosis, and thus can be used to treat diseases or pathological symptoms related to BMP signal pathway including inflammation, cardiovascular diseases, hematopoietic diseases, cancer, osteodystrophia, or the like, particularly, fibrodysplasia ossificans progressiva, and the present invention relates to provision of a pharmaceutical and pharmacological agent used for specifically antagonizing the BMP signal pathways and acting on the BMP signal pathways in the prevention and treatment or experimental application since the compounds can be beneficial for regulating cell differentiation and/or cell proliferation.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: March 23, 2021
    Assignees: RIKEN, THE UNIVERSITY OF TOKYO
    Inventors: Yoshinobu Hashizume, Katsuhiko Sekimata, Hirokazu Kubota, Hirofumi Yamamoto, Yasuko Koda, Hiroo Koyama, Tomonori Taguri, Tomohiro Sato, Akiko Tanaka, Kohei Miyazono
  • Publication number: 20200309803
    Abstract: An automatic analysis apparatus of an embodiment includes a holder, a first dispenser, a second dispenser, a detector, a memory, and processing circuitry. The holder movably holds a plurality of reaction vessels. The first dispenser dispenses an analyte into each of the reaction vessels. The second dispenser dispenses a reagent into the reaction vessel. The detector detects light transmitted through the reaction vessel. The memory stores a test order. The processing circuitry controls the holder, the first dispenser, and the second dispenser based on the test order. The processing circuitry determines one of the reaction vessels to be used for measuring the analyte based on the test order, and performs control to collect characteristic data from another of the reaction vessels not used for measuring the analyte while the analyte is measured.
    Type: Application
    Filed: March 26, 2020
    Publication date: October 1, 2020
    Applicant: CANON MEDICAL SYSTEMS CORPORATION
    Inventors: Isamu Matsuda, Takehiko Oonuma, Akiko Tanaka
  • Patent number: 10696880
    Abstract: Provided are a polyester-based pressure-sensitive adhesive composition having high wetting ability and superior adherability and light peelability, and a pressure-sensitive adhesive sheet produced with such a pressure-sensitive adhesive composition. The polyester-based pressure-sensitive adhesive composition includes a polyester obtained by polycondensation of a difunctional or polyfunctional carboxylic acid and a diol; a fatty acid ester; and a crosslinking agent, wherein the polyester has a weight average molecular weight of 8,500 to 50,000, and the fatty acid ester has no additional functional group and has a molecular weight of 200 to 700. The polyester-based pressure-sensitive adhesive composition contains 10 to 150 parts by weight of the fatty acid ester based on 100 parts by weight of the polyester.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: June 30, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Satomi Yoshie, Shigeki Ishiguro, Akiko Tanaka
  • Patent number: D1026087
    Type: Grant
    Filed: January 20, 2023
    Date of Patent: May 7, 2024
    Assignee: PLUS Corporation
    Inventors: Atsushi Tsukamoto, Akiko Tanaka, Sari Hiraoka, Hayato Horie