Patents by Inventor Akiko UMEDA

Akiko UMEDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11315899
    Abstract: The present invention provides a die bonding material containing the following component (A) and a solvent and having a refractive index (nD) at 25° C. of 1.41 to 1.43 and a thixotropic index of 2 or more, a light-emitting device including an adhesive member derived from the die bonding material, and a method for producing the light-emitting device. The die bonding material of the present invention is preferably used for fixing a light emitting element at a predetermined position. Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) and satisfying predetermined requirements related to 29Si-NMR and mass average molecular weight (Mw) R1-D-SiO3/2??(a-1) [wherein R1 represents a fluoroalkyl group represented by a compositional formula: CmH(2m?n+1)Fn; m represents an integer of 1 to 10, and n represents an integer of 2 to (2m+1); and D represents a linking group (excluding an alkylene group) for connecting R1 and Si, or a single bond].
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: April 26, 2022
    Assignees: LINTEC CORPORATION, NICHIA CORPORATION
    Inventors: Akiko Umeda, Manabu Miyawaki, Hidekazu Nakayama, Hiroki Inoue, Toshifumi Imura
  • Publication number: 20200335471
    Abstract: The present invention provides a die bonding material containing the following component (A) and a solvent and having a refractive index (nD) at 25° C. of 1.41 to 1.43 and a thixotropic index of 2 or more, a light-emitting device including an adhesive member derived from the die bonding material, and a method for producing the light-emitting device. The die bonding material of the present invention is preferably used for fixing a light emitting element at a predetermined position. Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) and satisfying predetermined requirements related to 29Si-NMR and mass average molecular weight (Mw) R1-D-SiO3/2 ??(a-1) [wherein R1 represents a fluoroalkyl group represented by a compositional formula: CmH(2m-n+1)Fn; m represents an integer of 1 to 10, and n represents an integer of 2 to (2m+1); and D represents a linking group (excluding an alkylene group) for connecting R1 and Si, or a single bond].
    Type: Application
    Filed: April 17, 2020
    Publication date: October 22, 2020
    Applicant: LINTEC Corporation
    Inventors: Akiko UMEDA, Manabu MIYAWAKI, Hidekazu NAKAYAMA, Hiroki INOUE, Toshifumi IMURA