Abstract: An image forming apparatus includes a developer container including a storage portion and a supplying inlet, a discharging portion configured to discharge a recording material in a discharging direction, a discharging outlet through which the recording material is discharged to an outside of the image forming apparatus, and a stacking portion which is a part of a top surface of an exterior of the image forming apparatus. The stacking portion includes a first area on which the recording material discharged from the discharging outlet is stacked, and a second area which is positioned outward with respect to the discharging outlet in a width direction orthogonal to the discharging direction. The supplying inlet is disposed at a position corresponding to the first area in the width direction. At least a part of the second area is positioned below the discharging outlet.

Abstract: A curable resin film of the present invention forms a first protective film (la) by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) with an average peak height (h1) of 50 to 400 ?m, an average diameter of 60 to 500 ?m, and an average pitch of 100 to 800 ?m, heating the attached curable resin film at 100° C. to 200° C. for 0.

Abstract: The present invention provides a film-shaped firing material 1 including sinterable metal particles 10, and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a tensile elasticity of the film-shaped firing material at 60° C. is in a range of 4.0 to 10.0 MPa, and a breaking elongation thereof at 60° C. is 500% or greater; and a film-shaped firing material with a support sheet including the film-shaped firing material 1 which contains sinterable metal particles and a binder component, and a support sheet 2 which is provided on at least one side of the film-shaped firing material, in which an adhesive force (a2) of the film-shaped firing material to the support sheet is smaller than an adhesive force (a1) of the film-shaped firing material to a semiconductor wafer, the adhesive force (a1) is 0.1 N/25 mm or greater, and the adhesive force (a2) is in a range of 0.1 N/25 mm to 0.

Abstract: A curable composition containing a polyoxyalkylene polymer (A) having a reactive silyl group and a (meth)acrylic ester polymer (B) having a reactive silyl group is provided. In the polyoxyalkylene polymer (A), an average ratio per molecule of a number of reactive silyl groups to a number of ends of a polymer backbone is 0.80 or more. In the (meth)acrylic ester polymer (B), an average number per molecule of the reactive silyl groups bonded at ends of a polymer backbone is from 0.30 to 1.00, and the average number per molecule of the reactive silyl groups bonded inside the polymer backbone is from 0 to less than 0.30.

Abstract: A polyoxyalkylene polymer including a main chain structure of a polyoxyalkylene and terminal structures bonded to ends of the main chain structure is provided. The terminal structures include a hydrolyzable silyl group and further include a terminal olefin group and/or an internal olefin group. The total number of the hydrolyzable silyl, terminal olefin, and internal olefin groups is more than 1.0 on average per terminal structure, and the ratio of the number of moles of the hydrolyzable silyl groups to the total number of moles of the hydrolyzable silyl, terminal olefin, and internal olefin groups is from 0.3 to 0.7.

Abstract: A tactile sensation providing apparatus, so as to reduce an influence by provision of a tactile sensation on detection of a position by a touch sensor, includes a touch sensor 11, a tactile sensation providing unit 12 disposed near the sensor 11 and configured to vibrate the sensor 11, a touch sensor control unit 20 configured to transmit a scanning signal to the sensor 11 and, by receiving the signal from the sensor 11, to detect the position of the contact to the sensor, signal lines 16, 18 configured to transmit the signal between the sensor 11 and the control unit 20, and a tactile sensation control unit 30 configured to, based on the position of the contact detected by the control unit 20, control the providing unit 12 to vibrate the sensor 11. The providing unit 12 is disposed avoiding overlapping with the lines 16, 18.

Abstract: An environment adjustment system includes an acquisition unit configured to acquire environmental information of an environment related to a user, a drafting unit configured to draft an action plan to recommend to the user based on the environmental information, a transmission unit configured to transmit the action plan to the user's terminal, and a confirming unit configured to confirm whether the user has performed the action plan. When the drafting unit drafts a new action plan for another user or for the user, it drafts the new action plan using a result of the confirmation by the confirming unit.

Abstract: A storage battery module rental system includes a storage battery module prepared in each providing point that is dispersedly distributed and that can be rented to a user, an acquisition unit configured to acquire individual information of a plurality of the users and module information from the storage battery module, the user being a rentee candidate of the storage battery module, a determining unit configured to determine an incentive given for renting the storage battery module based on the individual information and the module information in such a way that the incentive could differ for each user; and a notifying unit configured to notify the user of the incentive determined by the determining unit for each of the users.

Abstract: The present invention provides a film-shaped firing material 1 including sinterable metal particles 10, and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a tensile elasticity of the film-shaped firing material at 60° C. is in a range of 4.0 to 10.0 MPa, and a breaking elongation thereof at 60° C. is 500% or greater; and a film-shaped firing material with a support sheet including the film-shaped firing material 1 which contains sinterable metal particles and a binder component, and a support sheet 2 which is provided on at least one side of the film-shaped firing material, in which an adhesive force (a2) of the film-shaped firing material to the support sheet is smaller than an adhesive force (a1) of the film-shaped firing material to a semiconductor wafer, the adhesive force (a1) is 0.1 N/25 mm or greater, and the adhesive force (a2) is in a range of 0.1 N/25 mm to 0.

Abstract: This curable resin film is attached to a surface having bumps of a semiconductor wafer and is cured so as to form a first protective film on the surface, and when the curable resin film is cured by being heated at 160° C. for one hour, a yellow index (YI1) after curing is equal to or lower than 45, or when the curable resin film is cured by being irradiated with ultraviolet rays under conditions of illuminance of 230 mW/cm2, and light intensity of 510 mJ/cm2, a yellow index (YI2) after curing is equal to or lower than 45. The first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

Abstract: The present invention relates to a first protective film-forming sheet formed by stacking a first pressure-sensitive adhesive layer on a first base material and stacking a curable resin layer on the first pressure-sensitive adhesive layer, in which the curable resin layer is a layer to form a first protective film on a bump-provided surface of a semiconductor wafer by being attached to the surface and cured, a sum of a thickness of the curable resin layer and a thickness of a first pressure-sensitive adhesive layer is 110 ?m or more, and the thickness of the curable resin layer is 20 ?m to 100 ?m.

Abstract: This curable resin film forms a first protective film on a surface having bumps of a semiconductor wafer by being attached to the surface and being cured, in which a cured material of the curable resin film has a Young's modulus of equal to or greater than 0.02 MPa and a peak value of a load measured by a probe tack test at 80° C. is equal to or less than 500 g. A first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

Abstract: An environment adjustment system includes an acquisition unit configured to acquire environmental information of an environment related to a user, a drafting unit configured to draft an action plan to recommend to the user based on the environmental information, a transmission unit configured to transmit the action plan to the user's terminal, and a confirming unit configured to confirm whether the user has performed the action plan. When the drafting unit drafts a new action plan for another user or for the user, it drafts the new action plan using a result of the confirmation by the confirming unit.

Abstract: A traveling energy distribution system includes a plurality of supply facilities each of which is able to supply traveling energy to a vehicle, an information acquisition unit configured to acquire, from a vehicle, vehicle information relevant to an amount of traveling energy remaining in the vehicle and acquire, from each of the plurality of supply facilities, supply facility information relevant to an amount of traveling energy that can be supplied from that supply facility, and a determination unit configured to determine a transfer source supply facility and a transfer destination supply facility for traveling energy to be transferred from among the plurality of supply facilities and determine an amount of the traveling energy to be transferred based on the vehicle information and the supply facility information acquired by the information acquisition unit.

Abstract: A storage battery module rental system includes a storage battery module prepared in each providing point that is dispersedly distributed and that can be rented to a user, an acquisition unit configured to acquire individual information of a plurality of the users and module information from the storage battery module, the user being a rentee candidate of the storage battery module, a determining unit configured to determine an incentive given for renting the storage battery module based on the individual information and the module information in such a way that the incentive could differ for each user; and a notifying unit configured to notify the user of the incentive determined by the determining unit for each of the users.

Abstract: Provided is a curable composition which is free of organotin compounds to be environmentally friendly and whose cured product shows high elongation and high elastic recovery to be suitable particularly as a sealant. The present invention relates to a curable composition containing a reactive silyl group-containing organic polymer (A) which has a highly active reactive silyl group at a molecular chain end, and a compound (B) having 2 to 10 ethyloxy groups in its molecule but having no amino group in its molecule, the compound (B) being a C1-C20 saturated hydrocarbon having one alkoxysilyl group, a C1-C20 hydrocarbon having two or more alkoxysilyl groups, or a C1-C20 polycarboxylic acid ester.

Abstract: This curable resin film forms a first protective film on a surface having bumps of a semiconductor wafer by being attached to the surface and being cured, in which a cured material of the curable resin film has a Young's modulus of equal to or greater than 0.02 MPa and a peak value of a load measured by a probe tack test at 80° C. is equal to or less than 500 g. A first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

Abstract: A semiconductor processing sheet, the sheet comprising a base material and a pressure sensitive adhesive layer laminated on at least one surface of the base material, the pressure sensitive adhesive layer being formed of a pressure sensitive adhesive composition, the pressure sensitive adhesive composition containing a polymer having a salt and an energy ray curable group and an energy ray curable pressure sensitive adhesive component (excluding the above polymer). The semiconductor processing sheet can suppress contamination of an adherent at the time of peeling after energy ray irradiation while exhibiting a sufficient antistatic property.

Abstract: This curable resin film is attached to a surface having bumps of a semiconductor wafer and is cured so as to form a first protective film on the surface, and when the curable resin film is cured by being heated at 160° C. for one hour, a yellow index (YI1) after curing is equal to or lower than 45, or when the curable resin film is cured by being irradiated with ultraviolet rays under conditions of illuminance of 230 mW/cm2, and light intensity of 510 mJ/cm2, a yellow index (YI2) after curing is equal to or lower than 45. The first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

Abstract: The present invention relates to a first protective film-forming sheet formed by stacking a first pressure-sensitive adhesive layer on a first base material and stacking a curable resin layer on the first pressure-sensitive adhesive layer, in which the curable resin layer is a layer to form a first protective film on a bump-provided surface of a semiconductor wafer by being attached to the surface and cured, a sum of a thickness of the curable resin layer and a thickness of a first pressure-sensitive adhesive layer is 110 ?m or more, and the thickness of the curable resin layer is 20 ?m to 100 ?m.