Patents by Inventor Akinori Sato

Akinori Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11402767
    Abstract: An image forming apparatus includes a developer container including a storage portion and a supplying inlet, a discharging portion configured to discharge a recording material in a discharging direction, a discharging outlet through which the recording material is discharged to an outside of the image forming apparatus, and a stacking portion which is a part of a top surface of an exterior of the image forming apparatus. The stacking portion includes a first area on which the recording material discharged from the discharging outlet is stacked, and a second area which is positioned outward with respect to the discharging outlet in a width direction orthogonal to the discharging direction. The supplying inlet is disposed at a position corresponding to the first area in the width direction. At least a part of the second area is positioned below the discharging outlet.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: August 2, 2022
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Akinori Mitsumata, Takeo Kawanami, Masaaki Sato
  • Publication number: 20220135828
    Abstract: A curable resin film of the present invention forms a first protective film (la) by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) with an average peak height (h1) of 50 to 400 ?m, an average diameter of 60 to 500 ?m, and an average pitch of 100 to 800 ?m, heating the attached curable resin film at 100° C. to 200° C. for 0.
    Type: Application
    Filed: January 14, 2022
    Publication date: May 5, 2022
    Inventors: Masanori YAMAGISHI, Akinori SATO
  • Patent number: 11267992
    Abstract: The present invention provides a film-shaped firing material 1 including sinterable metal particles 10, and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a tensile elasticity of the film-shaped firing material at 60° C. is in a range of 4.0 to 10.0 MPa, and a breaking elongation thereof at 60° C. is 500% or greater; and a film-shaped firing material with a support sheet including the film-shaped firing material 1 which contains sinterable metal particles and a binder component, and a support sheet 2 which is provided on at least one side of the film-shaped firing material, in which an adhesive force (a2) of the film-shaped firing material to the support sheet is smaller than an adhesive force (a1) of the film-shaped firing material to a semiconductor wafer, the adhesive force (a1) is 0.1 N/25 mm or greater, and the adhesive force (a2) is in a range of 0.1 N/25 mm to 0.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: March 8, 2022
    Assignee: LINTEC Corporation
    Inventors: Isao Ichikawa, Hidekazu Nakayama, Akinori Sato
  • Publication number: 20220002541
    Abstract: A curable composition containing a polyoxyalkylene polymer (A) having a reactive silyl group and a (meth)acrylic ester polymer (B) having a reactive silyl group is provided. In the polyoxyalkylene polymer (A), an average ratio per molecule of a number of reactive silyl groups to a number of ends of a polymer backbone is 0.80 or more. In the (meth)acrylic ester polymer (B), an average number per molecule of the reactive silyl groups bonded at ends of a polymer backbone is from 0.30 to 1.00, and the average number per molecule of the reactive silyl groups bonded inside the polymer backbone is from 0 to less than 0.30.
    Type: Application
    Filed: September 22, 2021
    Publication date: January 6, 2022
    Applicant: KANEKA CORPORATION
    Inventor: Akinori Sato
  • Publication number: 20210284797
    Abstract: A polyoxyalkylene polymer including a main chain structure of a polyoxyalkylene and terminal structures bonded to ends of the main chain structure is provided. The terminal structures include a hydrolyzable silyl group and further include a terminal olefin group and/or an internal olefin group. The total number of the hydrolyzable silyl, terminal olefin, and internal olefin groups is more than 1.0 on average per terminal structure, and the ratio of the number of moles of the hydrolyzable silyl groups to the total number of moles of the hydrolyzable silyl, terminal olefin, and internal olefin groups is from 0.3 to 0.7.
    Type: Application
    Filed: May 27, 2021
    Publication date: September 16, 2021
    Applicant: KANEKA CORPORATION
    Inventors: Akinori Sato, Takahiro Saito, Kohei Yamashita
  • Patent number: 11099648
    Abstract: A tactile sensation providing apparatus, so as to reduce an influence by provision of a tactile sensation on detection of a position by a touch sensor, includes a touch sensor 11, a tactile sensation providing unit 12 disposed near the sensor 11 and configured to vibrate the sensor 11, a touch sensor control unit 20 configured to transmit a scanning signal to the sensor 11 and, by receiving the signal from the sensor 11, to detect the position of the contact to the sensor, signal lines 16, 18 configured to transmit the signal between the sensor 11 and the control unit 20, and a tactile sensation control unit 30 configured to, based on the position of the contact detected by the control unit 20, control the providing unit 12 to vibrate the sensor 11. The providing unit 12 is disposed avoiding overlapping with the lines 16, 18.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: August 24, 2021
    Assignee: KYOCERA Corporation
    Inventors: Hiroshi Inoue, Akinori Sato
  • Patent number: 10876851
    Abstract: An environment adjustment system includes an acquisition unit configured to acquire environmental information of an environment related to a user, a drafting unit configured to draft an action plan to recommend to the user based on the environmental information, a transmission unit configured to transmit the action plan to the user's terminal, and a confirming unit configured to confirm whether the user has performed the action plan. When the drafting unit drafts a new action plan for another user or for the user, it drafts the new action plan using a result of the confirmation by the confirming unit.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: December 29, 2020
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Satoshi Iwai, Koji Yamada, Marie Ishikawa, Akinori Sato, Hiroyuki Yamada, Akira Shichi, Masanori Ishigaki, Shuji Tomura, Kenji Ito, Reiko Makino, Keisuke Ichige
  • Patent number: 10846786
    Abstract: A storage battery module rental system includes a storage battery module prepared in each providing point that is dispersedly distributed and that can be rented to a user, an acquisition unit configured to acquire individual information of a plurality of the users and module information from the storage battery module, the user being a rentee candidate of the storage battery module, a determining unit configured to determine an incentive given for renting the storage battery module based on the individual information and the module information in such a way that the incentive could differ for each user; and a notifying unit configured to notify the user of the incentive determined by the determining unit for each of the users.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: November 24, 2020
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Satoshi Iwai, Koji Yamada, Marie Ishikawa, Akinori Sato, Masanori Ishigaki, Shuji Tomura, Shigeaki Goto, Makoto Kusakabe, Tomoki Nishi, Akira Shichi, Hiroyuki Yamada
  • Publication number: 20200277515
    Abstract: The present invention provides a film-shaped firing material 1 including sinterable metal particles 10, and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a tensile elasticity of the film-shaped firing material at 60° C. is in a range of 4.0 to 10.0 MPa, and a breaking elongation thereof at 60° C. is 500% or greater; and a film-shaped firing material with a support sheet including the film-shaped firing material 1 which contains sinterable metal particles and a binder component, and a support sheet 2 which is provided on at least one side of the film-shaped firing material, in which an adhesive force (a2) of the film-shaped firing material to the support sheet is smaller than an adhesive force (a1) of the film-shaped firing material to a semiconductor wafer, the adhesive force (a1) is 0.1 N/25 mm or greater, and the adhesive force (a2) is in a range of 0.1 N/25 mm to 0.
    Type: Application
    Filed: September 4, 2018
    Publication date: September 3, 2020
    Inventors: Isao ICHIKAWA, Hidekazu NAKAYAMA, Akinori SATO
  • Patent number: 10717901
    Abstract: This curable resin film is attached to a surface having bumps of a semiconductor wafer and is cured so as to form a first protective film on the surface, and when the curable resin film is cured by being heated at 160° C. for one hour, a yellow index (YI1) after curing is equal to or lower than 45, or when the curable resin film is cured by being irradiated with ultraviolet rays under conditions of illuminance of 230 mW/cm2, and light intensity of 510 mJ/cm2, a yellow index (YI2) after curing is equal to or lower than 45. The first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: July 21, 2020
    Assignee: LINTEC Corporation
    Inventors: Masanori Yamagishi, Akinori Sato
  • Patent number: 10515830
    Abstract: The present invention relates to a first protective film-forming sheet formed by stacking a first pressure-sensitive adhesive layer on a first base material and stacking a curable resin layer on the first pressure-sensitive adhesive layer, in which the curable resin layer is a layer to form a first protective film on a bump-provided surface of a semiconductor wafer by being attached to the surface and cured, a sum of a thickness of the curable resin layer and a thickness of a first pressure-sensitive adhesive layer is 110 ?m or more, and the thickness of the curable resin layer is 20 ?m to 100 ?m.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: December 24, 2019
    Assignee: LINTEC CORPORATION
    Inventors: Masanori Yamagishi, Akinori Sato
  • Publication number: 20190330465
    Abstract: This curable resin film forms a first protective film on a surface having bumps of a semiconductor wafer by being attached to the surface and being cured, in which a cured material of the curable resin film has a Young's modulus of equal to or greater than 0.02 MPa and a peak value of a load measured by a probe tack test at 80° C. is equal to or less than 500 g. A first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.
    Type: Application
    Filed: July 2, 2019
    Publication date: October 31, 2019
    Inventors: Akinori SATO, Masanori YAMAGISHI
  • Publication number: 20190195646
    Abstract: An environment adjustment system includes an acquisition unit configured to acquire environmental information of an environment related to a user, a drafting unit configured to draft an action plan to recommend to the user based on the environmental information, a transmission unit configured to transmit the action plan to the user's terminal, and a confirming unit configured to confirm whether the user has performed the action plan. When the drafting unit drafts a new action plan for another user or for the user, it drafts the new action plan using a result of the confirmation by the confirming unit.
    Type: Application
    Filed: October 29, 2018
    Publication date: June 27, 2019
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Satoshi IWAI, Koji YAMADA, Marie ISHIKAWA, Akinori SATO, Hiroyuki YAMADA, Akira SHICHI, Masanori ISHIGAKI, Shuji TOMURA, Kenji ITO, Reiko MAKINO, Keisuke ICHIGE
  • Publication number: 20190193573
    Abstract: A traveling energy distribution system includes a plurality of supply facilities each of which is able to supply traveling energy to a vehicle, an information acquisition unit configured to acquire, from a vehicle, vehicle information relevant to an amount of traveling energy remaining in the vehicle and acquire, from each of the plurality of supply facilities, supply facility information relevant to an amount of traveling energy that can be supplied from that supply facility, and a determination unit configured to determine a transfer source supply facility and a transfer destination supply facility for traveling energy to be transferred from among the plurality of supply facilities and determine an amount of the traveling energy to be transferred based on the vehicle information and the supply facility information acquired by the information acquisition unit.
    Type: Application
    Filed: November 16, 2018
    Publication date: June 27, 2019
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Satoshi IWAI, Koji YAMADA, Marie ISHIKAWA, Akinori SATO, Hiroyuki YAMADA, Akira SHICHI, Masanori ISHIGAKI, Shuji TOMURA, Shigeaki GOTO, Hajime MURATA, Kenji ITO, Reiko MAKINO, Keisuke ICHIGE
  • Publication number: 20190197608
    Abstract: A storage battery module rental system includes a storage battery module prepared in each providing point that is dispersedly distributed and that can be rented to a user, an acquisition unit configured to acquire individual information of a plurality of the users and module information from the storage battery module, the user being a rentee candidate of the storage battery module, a determining unit configured to determine an incentive given for renting the storage battery module based on the individual information and the module information in such a way that the incentive could differ for each user; and a notifying unit configured to notify the user of the incentive determined by the determining unit for each of the users.
    Type: Application
    Filed: October 29, 2018
    Publication date: June 27, 2019
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Satoshi IWAI, Koji YAMADA, Marie ISHIKAWA, Akinori SATO, Masanori ISHIGAKI, Shuji TOMURA, Shigeaki GOTO, Makoto KUSAKABE, Tomoki NISHI, Akira SHICHI, Hiroyuki YAMADA
  • Patent number: 10287399
    Abstract: Provided is a curable composition which is free of organotin compounds to be environmentally friendly and whose cured product shows high elongation and high elastic recovery to be suitable particularly as a sealant. The present invention relates to a curable composition containing a reactive silyl group-containing organic polymer (A) which has a highly active reactive silyl group at a molecular chain end, and a compound (B) having 2 to 10 ethyloxy groups in its molecule but having no amino group in its molecule, the compound (B) being a C1-C20 saturated hydrocarbon having one alkoxysilyl group, a C1-C20 hydrocarbon having two or more alkoxysilyl groups, or a C1-C20 polycarboxylic acid ester.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: May 14, 2019
    Assignee: KANEKA CORPORATION
    Inventors: Luc Peeters, Stan Claes, Ayako Yano, Akinori Sato
  • Publication number: 20190055396
    Abstract: This curable resin film forms a first protective film on a surface having bumps of a semiconductor wafer by being attached to the surface and being cured, in which a cured material of the curable resin film has a Young's modulus of equal to or greater than 0.02 MPa and a peak value of a load measured by a probe tack test at 80° C. is equal to or less than 500 g. A first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.
    Type: Application
    Filed: November 2, 2016
    Publication date: February 21, 2019
    Inventors: Akinori SATO, Masanori YAMAGISHI
  • Patent number: 10192768
    Abstract: A semiconductor processing sheet, the sheet comprising a base material and a pressure sensitive adhesive layer laminated on at least one surface of the base material, the pressure sensitive adhesive layer being formed of a pressure sensitive adhesive composition, the pressure sensitive adhesive composition containing a polymer having a salt and an energy ray curable group and an energy ray curable pressure sensitive adhesive component (excluding the above polymer). The semiconductor processing sheet can suppress contamination of an adherent at the time of peeling after energy ray irradiation while exhibiting a sufficient antistatic property.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: January 29, 2019
    Assignee: LINTEC CORPORATION
    Inventors: Shigeyuki Yamashita, Akinori Sato
  • Publication number: 20180327637
    Abstract: This curable resin film is attached to a surface having bumps of a semiconductor wafer and is cured so as to form a first protective film on the surface, and when the curable resin film is cured by being heated at 160° C. for one hour, a yellow index (YI1) after curing is equal to or lower than 45, or when the curable resin film is cured by being irradiated with ultraviolet rays under conditions of illuminance of 230 mW/cm2, and light intensity of 510 mJ/cm2, a yellow index (YI2) after curing is equal to or lower than 45. The first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.
    Type: Application
    Filed: November 2, 2016
    Publication date: November 15, 2018
    Applicant: LINTEC Corporation
    Inventors: Masanori YAMAGISHI, Akinori SATO
  • Publication number: 20180323084
    Abstract: The present invention relates to a first protective film-forming sheet formed by stacking a first pressure-sensitive adhesive layer on a first base material and stacking a curable resin layer on the first pressure-sensitive adhesive layer, in which the curable resin layer is a layer to form a first protective film on a bump-provided surface of a semiconductor wafer by being attached to the surface and cured, a sum of a thickness of the curable resin layer and a thickness of a first pressure-sensitive adhesive layer is 110 ?m or more, and the thickness of the curable resin layer is 20 ?m to 100 ?m.
    Type: Application
    Filed: November 2, 2016
    Publication date: November 8, 2018
    Inventors: Masanori YAMAGISHI, Akinori SATO