Patents by Inventor Akio Mitsuoka

Akio Mitsuoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire with coating for ultrasonic bonding
    Patent number: 4963435
    Abstract: A wire with a coated layer for bonding to a joint body by ultrasonic vibration, the coated layer of said wire comprising urethane resin having formulated therein a brominated epoxy resin.
    Type: Grant
    Filed: December 2, 1988
    Date of Patent: October 16, 1990
    Assignees: Hitachi, Ltd., Hitachi Computer Peripherals Co., Ltd., Hitachi Cable, Ltd.
    Inventors: Shigeo Hara, Setsuo Sekine, Toshio Suzuki, Minoru Taguchi, Akio Mitsuoka, Yoshiyuki Tetsu
  • Self-bondable insulated wires comprising three coatings including a phenoxy resin outer layer
    Patent number: 4129678
    Abstract: In a self-bondable insulated wire comprising a conductor and three resin insulating layers, the first resin insulating layer is formed with a resin selected from the group consisting of polyimide resins, polyamideimide resins and polyesterimide resins, the intermediate resin insulating layer is formed with a resin selected from the group consisting of polyvinyl formal resins and epoxy resins, and the outermost resin insulating layer is formed with a self-bondable resin of phenoxy series. Thus, a self-bondable insulated wire which is excellent in both oil resistance and heat resistance is obtained.
    Type: Grant
    Filed: May 26, 1977
    Date of Patent: December 12, 1978
    Assignees: Hitachi, Ltd., Hitachi Cable, Ltd.
    Inventors: Masatoshi Seki, Moriichi Sato, Hideo Tsukioka, Etuo Ohe, Masatsugu Ogata, Akio Mitsuoka