Patents by Inventor Akio Sumiya

Akio Sumiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10525658
    Abstract: A method for producing a mesh including a resin mesh main body, and a resin reinforcing member configured to reinforce the mesh main body includes: a step of forming a plurality of through-holes using a laser beam in a mesh formation region of a first film material made of resin; a step of forming an opening portion in a second film material made of resin; a step of layering the first film material and the second film material so that the mesh formation region and the opening portion are arranged at positions that conform to each other; and a step of joining the first film material and the second film material to each other through laser welding at a portion surrounding the opening portion.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: January 7, 2020
    Assignees: OMRON Corporation, OMRON HEALTHCARE Co., Ltd.
    Inventors: Satoshi Hirono, Yuka Tanioka, Junji Kawamoto, Makoto Tabata, Akio Sumiya
  • Patent number: 10471660
    Abstract: A bonding structure manufacturing method for manufacturing a bonding structure in which a first member and a second member are bonded is provided with: a step for forming a perforation with an opening in the surface of the first member and forming a protrusion that protrudes into the inner circumferential surface of the perforation; a step for disposing the region of the first member where the perforation is formed adjacent to the second member; and step for filling and curing the second member in the perforation of the first member by irradiating a laser on the region of the first member where the perforation is formed from the second member side.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: November 12, 2019
    Assignee: OMRON Corporation
    Inventors: Kazuyoshi Nishikawa, Akio Sumiya, Satoshi Hirono, Tomoyuki Hakata
  • Patent number: 10449698
    Abstract: A bonded structure is made of a first member and a second member which are bonded to each other. At least one bore having an opening is formed in a surface of the first member, and the second member is filled in the bore of the first member. The bore is defined by a diameter-increasing portion whose opening size increases in a depth direction from a surface side toward a bottom of the first member, and a first diameter-decreasing portion whose opening size decreases in the depth direction from the surface side toward the bottom. The diameter-increasing portion is formed on the surface side, and the first diameter-decreasing portion is formed on a bottom side.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: October 22, 2019
    Assignee: OMRON CORPORATION
    Inventors: Kazuyoshi Nishikawa, Akio Sumiya, Satoshi Hirono, Tomoyuki Hakata, Hiroshige Uematsu
  • Publication number: 20180264773
    Abstract: A method for producing a mesh including a resin mesh main body, and a resin reinforcing member configured to reinforce the mesh main body includes: a step of forming a plurality of through-holes using a laser beam in a mesh formation region of a first film material made of resin; a step of forming an opening portion in a second film material made of resin; a step of layering the first film material and the second film material so that the mesh formation region and the opening portion are arranged at positions that conform to each other; and a step of joining the first film material and the second film material to each other through laser welding at a portion surrounding the opening portion.
    Type: Application
    Filed: November 18, 2015
    Publication date: September 20, 2018
    Applicants: OMRON Corporation, OMRON HEALTHCARE Co., Ltd.
    Inventors: Satoshi HIRONO, Yuka TANIOKA, Junji KAWAMOTO, Makoto TABATA, Akio SUMIYA
  • Publication number: 20180207847
    Abstract: Provided is a production method for a bonded structure (100, 200) in which a first member (10, 10a, 10b, 10c, 10d, 30) and a second member (20) are bonded. The production method is provided with: a step for forming perforations (11, 11b, 11c, 11d, 31) with an opening in the surface (13) of the first member (10, 10a, 10b, 10c, 10d, 30) by irradiating the surface (13) of the first member (10, 10a, 10b, 10c, 10d, 30) with a laser in which one pulse is configured from a plurality of sub-pulses; and a step for filling and curing the second member (20) in the perforations (11, 11b, 11c, 11d, 31) of the first member (10, 10a, 10b, 10c, 10d, 30).
    Type: Application
    Filed: August 17, 2015
    Publication date: July 26, 2018
    Applicant: OMRON Corporation
    Inventors: Kazuyoshi NISHIKAWA, Akio SUMIYA, Satoshi HIRONO, Tomoyuki HAKATA
  • Publication number: 20170352470
    Abstract: A transformer includes a stacked structure in which a plurality of coils is stacked through insulation layers. The stacked structure includes: a primary coil stacked layer including a plurality of primary coil layers connected in parallel with one another; and a secondary coil stacked layer including a plurality of secondary coil layers connected in parallel with one another. One of the primary coil layers is disposed as an outermost layer in the stacked structure, and another is disposed between at least two layers of the plurality of secondary coil layers. The primary coil layer includes a plurality of primary coils connected in parallel with one another. The secondary coil layer includes one or more secondary coils thicker than the primary coil.
    Type: Application
    Filed: March 10, 2017
    Publication date: December 7, 2017
    Applicants: OMRON AUTOMOTIVE ELECTRONICS CO., LTD., OMRON Corporation
    Inventors: Masahiro Yamagami, Noriyoshi Omote, Tomoyuki Hakata, Masaya Fukuda, Akio Sumiya
  • Publication number: 20170259468
    Abstract: A bonded structure is made of a first member and a second member which are bonded to each other. At least one bore having an opening is formed in a surface of the first member, and the second member is filled in the bore of the first member. The bore is defined by a diameter-increasing portion whose opening size increases in a depth direction from a surface side toward a bottom of the first member, and a first diameter-decreasing portion whose opening size decreases in the depth direction from the surface side toward the bottom. The diameter-increasing portion is formed on the surface side, and the first diameter-decreasing portion is formed on a bottom side.
    Type: Application
    Filed: August 17, 2015
    Publication date: September 14, 2017
    Applicant: OMRON Corporation
    Inventors: Kazuyoshi NISHIKAWA, Akio SUMIYA, Satoshi HIRONO, Tomoyuki HAKATA, Hiroshige UEMATSU
  • Publication number: 20170210058
    Abstract: A bonding structure manufacturing method for manufacturing a bonding structure in which a first member and a second member are bonded is provided with: a step for forming a perforation with an opening in the surface of the first member and forming a protrusion that protrudes into the inner circumferential surface of the perforation; a step for disposing the region of the first member where the perforation is formed adjacent to the second member; and step for filling and curing the second member in the perforation of the first member by irradiating a laser on the region of the first member where the perforation is formed from the second member side.
    Type: Application
    Filed: August 17, 2015
    Publication date: July 27, 2017
    Applicant: OMRON Corporation
    Inventors: Kazuyoshi NISHIKAWA, Akio SUMIYA, Satoshi HIRONO, Tomoyuki HAKATA
  • Publication number: 20160052202
    Abstract: A joined structure has a first member, a second member that is joined together with the first member, and a pore portion formed on the first member and having an opening in a surface of the first member. The pore portion is filled with the second member. The pore portion has an inwardly extending protrusion on an inner periphery thereof.
    Type: Application
    Filed: August 3, 2015
    Publication date: February 25, 2016
    Applicant: OMRON CORPORATION
    Inventors: Kazuyoshi Nishikawa, Akio Sumiya, Satoshi Hirono, Tomoyuki Hakata, Hiroshige Uematsu, Kazuhiro Ijiri
  • Patent number: 9092998
    Abstract: A method for assembling an apparatus including a display sheet having a non-transparent part in at least a part of the display sheet, has a bonding step of bonding the display sheet to a housing. The bonding step has a first step of attaching the display sheet to the housing via a UV curable adhesive, and a second step of causing an ultraviolet light emitting apparatus to irradiate, from an external surface side of the display sheet. The display sheet is attached to the housing with ultraviolet light after the first step so that the ultraviolet light passes through at least a part of the non-transparent part of the display sheet and cures the UV curable adhesive.
    Type: Grant
    Filed: January 27, 2012
    Date of Patent: July 28, 2015
    Assignee: OMRON Corporation
    Inventors: Naoki Masutani, Seiji Nakajima, Tomohiro Fukuhara, Akio Sumiya, Kazuyoshi Nishikawa
  • Patent number: 8854820
    Abstract: A power module can prevent damages due to cracking or breakage of an insulating substrate when molding even if a heat plate constituting a power module pre-product is made areally smaller than the insulating substrate, and can also sufficiently satisfy demand for minimization. Specifically, the power module pre-product is sealed by a molding resin layer in a state where externally exposed end portion on one end side in both external connecting terminals and the other surface side of a heat plate are each exposed to the outside. The power module substrate constituting a multilayer substrate body includes an aligning hole, into which an aligning pin is inserted, the pin being included in a lower molding die constituting a molding die with an upper molding die that molds a molding resin layer, so as to position the power module pre-product inside a cavity.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: October 7, 2014
    Assignee: Omron Corporation
    Inventors: Shingo Yamamoto, Akio Sumiya, Yasuo Matsuda, Naoto Inoue, Makoto Tami, Ryo Sugihara, Fumiaki Tanaka, Shintaro Hara, Shota Akinaga
  • Publication number: 20130051429
    Abstract: The present invention provides (A) an electronic part including a metal part combined with a non-metal part so as to cover the non-metal part, which electronic part can be assembled (i) with excellent workability, (ii) without requiring a high-temperature condition, and (iii) in a short period of time and (B) a method for manufacturing the electronic part. An electronic part (10) in accordance with the present invention includes (I) a non-metal part (11) and (II) a metal part (14) covering a covered region (11b) provided on a surface of the non-metal part (11). The covered region (11b) and the metal part (14) are combined together via an adhesive layer (12) provided by curing an ultraviolet anaerobic curing adhesive containing a photopolymerization initiator and organic peroxide.
    Type: Application
    Filed: February 21, 2011
    Publication date: February 28, 2013
    Applicant: OMRON CORPORATION
    Inventors: Naoki Masutani, Seiji Nakajima, Tomohiro Fukuhara, Akio Sumiya, Kazuyoshi Nishikawa
  • Publication number: 20120237737
    Abstract: A method for assembling an apparatus including a display sheet having a non-transparent part in at least a part of the display sheet, has a bonding step of bonding the display sheet to a housing. The bonding step has a first step of attaching the display sheet to the housing via a UV curable adhesive, and a second step of causing an ultraviolet light emitting apparatus to irradiate, from an external surface side of the display sheet. The display sheet is attached to the housing with ultraviolet light after the first step so that the ultraviolet light passes through at least a part of the non-transparent part of the display sheet and cures the UV curable adhesive.
    Type: Application
    Filed: January 27, 2012
    Publication date: September 20, 2012
    Applicant: OMRON CORPORATION
    Inventors: Naoki Masutani, Seiji Nakajima, Tomohiro Fukuhara, Akio Sumiya, Kazuyoshi Nishikawa
  • Publication number: 20120127668
    Abstract: A power module can prevent damages due to cracking or breakage of an insulating substrate when molding even if a heat plate constituting a power module pre-product is made areally smaller than the insulating substrate, and can also sufficiently satisfy demand for minimization. Specifically, the power module pre-product is sealed by a molding resin layer in a state where externally exposed end portion on one end side in both external connecting terminals and the other surface side of a heat plate are each exposed to the outside. The power module substrate constituting a multilayer substrate body includes an aligning hole, into which an aligning pin is inserted, the pin being included in a lower molding die constituting a molding die with an upper molding die that molds a molding resin layer, so as to position the power module pre-product inside a cavity.
    Type: Application
    Filed: June 22, 2010
    Publication date: May 24, 2012
    Applicant: OMRON CORPORATION
    Inventors: Shingo Yamamoto, Akio Sumiya, Yasuo Matsuda, Naoto Inoue, Makoto Tami, Ryo Sugihara, Fumiaki Tanaka, Shintaro Hara, Shota Akinaga