Patents by Inventor Akio Suzuki

Akio Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6863371
    Abstract: An image recording apparatus records an image on a recording medium by causing a recording head having an arrangement of a plurality of recording elements to conduct its main scanning for the recording medium interrelatedly in the direction opposite to the arrangement of the recording elements. The apparatus comprises a setting device to set the number of main scannings by the recording head; a main scanning device to perform recording by plural numbers of main scannings with respect to one pixel by causing the recording head to conduct its main scannings for the same recording area of the recording medium in accordance with the number set by the setting device; and a sub-scanning device to cause the recording head and the recording medium to be sub-scanned interrelatedly per main scanning in an amount smaller than the width of the arrangement of the recording elements of the recording head.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: March 8, 2005
    Assignee: Canon Kabushiki Kaisha
    Inventors: Akio Suzuki, Kiyoharu Tanaka, Yoshihiro Takada, Yasushi Miura, Nobuhiko Ogata
  • Publication number: 20050032989
    Abstract: A heat-curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane with both molecular chain terminals blocked with hydroxyl groups, (B) an organopolysiloxane resin comprising monofunctional siloxane units and SiO2 units, (C) a compound having two or more allyloxycarbonyl groups (CH2?CHCH2O(CO)—), an allyl group-containing isocyanurate compound, and/or an alkoxysilyl group-containing isocyanurate compound, and (D) a curing agent is provided. The composition is useful as an adhesive which has adequate pressure-sensitive adhesion (stickiness) to a substrate and which can be cured by short-time heat treatment to show strong adhesion. The adhesive is preferably provided in the form of a film.
    Type: Application
    Filed: August 4, 2004
    Publication date: February 10, 2005
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Satosi Onai, Hiroyasu Hara, Akio Suzuki
  • Publication number: 20040213994
    Abstract: A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2-2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising (A) a polyimide resin, (B) an epoxy resin, and (C) an epoxy resin curing catalyst.
    Type: Application
    Filed: April 22, 2004
    Publication date: October 28, 2004
    Inventors: Shouhei Kozakai, Akio Suzuki, Nobuhiro Ichiroku, Toshio Shiobara
  • Patent number: 6731074
    Abstract: An electrode-less lamp equipment with higher luminance by higher lamp-cooling efficiency wherein the airflow generated by the blower 9 goes through the ventilation hole 12 and spouts out from the open end of the lamp-cooling nozzle 15 and cools the surface of the electrode-less lamp 1 is provided. The velocity of the airflow is accordingly high around the lamp surface enough to efficiently cool the lamp. This makes it possible to raise the input power density to the lamp and to increase luminance.
    Type: Grant
    Filed: May 10, 2002
    Date of Patent: May 4, 2004
    Assignee: ORC Manufacturing Co., Ltd.
    Inventor: Akio Suzuki
  • Patent number: 6720733
    Abstract: An emission element enclosed inside an electrodeless lamp 5 is excited by an electromagnetic field of a microwave irradiated from a magnetron 2 for emitting light from the electrodeless lamp 5. A soft-starting method is provided such that an electric power enough to drive the magnetron 2 is gradually increased. The soft-starting method is to prevent the magnetron from being destroyed by self-heating due to a reflected wave of the microwave. The soft-staring method is used when a light begins to be emitted from the electrodeless lamp 5. Accordingly, the electrodeless lamp system is provided such that breakage of the magnetron caused by the self-heating due to the reflected wave of the microwave can be prevented.
    Type: Grant
    Filed: August 22, 2002
    Date of Patent: April 13, 2004
    Assignee: Orc Manufacturing Co., Ltd
    Inventors: Akio Suzuki, Takeshi Tada, Taisei Kato
  • Publication number: 20040068076
    Abstract: A silicone adhesive comprises (A) a reaction mixture obtained by subjecting a partially condensed mixture of (i) a hydroxy-terminated diorganopolysiloxane and (ii) an organopolysiloxane copolymer having hydroxyl and alkenyl radicals and comprising R33SiO1/2 units and SiO2 units, and (iii) a silicon compound having a silicon atom-bonded hydrogen atom and a silicon atom-bonded alkoxy radical to addition reaction in the presence of a platinum catalyst and (B) a crosslinking agent. The silicone adhesive exhibits at the initial a tackiness sufficient to fixedly secure a substrate. By press bonding another substrate to the adhesive-bearing substrate and heating them, the substrates can be firmly bonded together.
    Type: Application
    Filed: October 2, 2003
    Publication date: April 8, 2004
    Inventors: Shouhei Kozakai, Akio Suzuki
  • Publication number: 20040067372
    Abstract: The present invention provides a heat conductive silicone rubber composite sheet that is suitable as a heat dissipating member provided between a heat generating electronic component and a heat dissipating component such as a heat dissipating fin, wherein the heat conductive silicone rubber composite sheet has a laminated structure with good electrical insulation and thermal conductivity, as well as excellent strength, flexibility, and particularly superior interlayer adhesion.
    Type: Application
    Filed: September 23, 2003
    Publication date: April 8, 2004
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hiroshi Takei, Akio Suzuki
  • Publication number: 20040054029
    Abstract: An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.
    Type: Application
    Filed: July 17, 2003
    Publication date: March 18, 2004
    Inventors: Hironao Fujiki, Kazuhiko Tomaru, Ikuo Sakurai, Akio Suzuki, Kunihiko Mita
  • Publication number: 20040044132
    Abstract: A silicone adhesive comprising (A) an organopolysiloxane partial condensate of (i) a diorganopolysiloxane end-capped with a hydroxyl radical and (ii) an organopolysiloxane copolymer having hydroxyl radicals and consisting essentially of R33SiO1/2 units and SiO4/2 units wherein R3 is hydroxyl or a monovalent hydrocarbon radical, (B) a silane or siloxane compound having a silicon atom-bonded alkoxy radical and/or an epoxy radical, and (C) a crosslinking agent exhibits pressure-sensitive adhesion and permanent adhesion.
    Type: Application
    Filed: August 21, 2003
    Publication date: March 4, 2004
    Inventors: Shouhei Kozakai, Akio Suzuki
  • Patent number: 6663964
    Abstract: A heat dissipating structure is provided which lowers the thermal contact resistance between a heat generating electronic component and a heat dissipating component, and markedly improves the heat radiation. The heat dissipating structure comprises a graphite sheet and a heat conducting material layer provided on at least one surface of the graphite sheet, and is positioned between the electronic component and the heat dissipating component. The heat conducting material has no fluidity at room temperature when the electronic component is not operating, but undergoes a reduction in viscosity, softens or melts, under the influence of heat generated during operation of the electronic component.
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: December 16, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kunihiko Mita, Akio Suzuki, Tsutomu Yoneyama
  • Publication number: 20030209995
    Abstract: This invention intends to provide with electrode-less lamp equipment with higher luminance by higher lamp-cooling efficiency wherein the airflow generated by the blower 9 goes through the ventilation hole 12 and spouts out from the open end of the lamp-cooling nozzle 15 and cools the surface of the electrode-less lamp 1. The velocity of the airflow is accordingly high around the lamp surface enough to efficiently cool the lamp. This makes it possible to raise the input power density to the lamp and to increase luminance.
    Type: Application
    Filed: May 10, 2002
    Publication date: November 13, 2003
    Inventor: Akio Suzuki
  • Patent number: 6645000
    Abstract: The modular jack (21) comprises a housing (22) having side walls (30), a plurality of cavities (27, 28) provided at a front side of the housing (22), into which mating modular plugs are inserted, at least one groove (33, 34) provided in one of the side walls (30), and at least one LED (24, 25) fitted into the groove (33, 34) and accommodated in the side walls (30). Accordingly, the fixing work for LEDs (24, 25) is simplified and the manufacturing cost is minimized.
    Type: Grant
    Filed: May 20, 2002
    Date of Patent: November 11, 2003
    Assignee: Hirose Electric Co., Ltd.
    Inventors: Satoshi Sato, Akio Suzuki
  • Patent number: 6617038
    Abstract: A silicone rubber composition comprising a soft magnetic powder, an optional heat conductive powder, and a surface treating agent selected from (a) an organopolysiloxane containing at least one alkoxy radical, hydroxyl radical or functional organic radical in a molecule, (b) a titanate coupling agent, and (c) an aluminum coupling agent is easily workable and flexible and has an ability to absorb electromagnetic waves and optionally, a heat transfer ability. Placement of the composition in an electronic equipment suppresses electromagnetic noise.
    Type: Grant
    Filed: October 25, 2001
    Date of Patent: September 9, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Ikuo Sakurai, Akio Suzuki
  • Patent number: D500488
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: January 4, 2005
    Assignee: Sony Corporation
    Inventors: Mitsuhiro Uehara, Akio Suzuki
  • Patent number: D500489
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: January 4, 2005
    Assignee: Sony Corporation
    Inventors: Mitsuhiro Uehara, Akio Suzuki
  • Patent number: D500752
    Type: Grant
    Filed: February 18, 2004
    Date of Patent: January 11, 2005
    Assignee: Sony Corporation
    Inventors: Mitsuhiro Uehara, Akio Suzuki
  • Patent number: D502690
    Type: Grant
    Filed: March 3, 2004
    Date of Patent: March 8, 2005
    Assignee: Sony Corporation
    Inventors: Mitsuhiro Uehara, Akio Suzuki
  • Patent number: D486509
    Type: Grant
    Filed: April 28, 2003
    Date of Patent: February 10, 2004
    Assignee: Sony Corporation
    Inventor: Akio Suzuki
  • Patent number: D488497
    Type: Grant
    Filed: June 19, 2003
    Date of Patent: April 13, 2004
    Assignee: Sony Corporation
    Inventor: Akio Suzuki
  • Patent number: D491137
    Type: Grant
    Filed: July 23, 2003
    Date of Patent: June 8, 2004
    Assignee: Sony Corporation
    Inventor: Akio Suzuki