Abstract: A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.

Abstract: Link mechanisms provided corresponding to press bonding heads each include a first link member having one end pivotably connected to an upper end of the press bonding head, a second link member having one end pivotably connected to the other end of the first link member and having the other end pivotably connected to a link bracket above the press bonding head, and a connection slide part connected to a connection part between the first and second link members, collectively drive the connection slide parts of the link mechanisms by a press bonding head driving unit in horizontal directions (Y axis directions) orthogonal to a direction (X axis direction) of side-by-side arrangement of the plurality of press bonding heads, open and close the first and second link members of the link mechanisms in the vertical directions thereby collectively moving the plurality of press bonding heads downward and upward.

Abstract: Link mechanisms provided corresponding to press bonding heads each include a first link member having one end pivotably connected to an upper end of the press bonding head, a second link member having one end pivotably connected to the other end of the first link member and having the other end pivotably connected to a link bracket above the press bonding head, and a connection slide part connected to a connection part between the first and second link members, collectively drive the connection slide parts of the link mechanisms by a press bonding head driving unit in horizontal directions (Y axis directions) orthogonal to a direction (X axis direction) of side-by-side arrangement of the plurality of press bonding heads, open and close the first and second link members of the link mechanisms in the vertical directions thereby collectively moving the plurality of press bonding heads downward and upward.

Abstract: A substrate transfer device has an arm, and a support shaft fixed to one end of the arm so as to pivotably support the arm in a horizontal plane. The support shaft is placed between a first working device and a second working device. A holding unit that is supported by the other end of the arm and sucks and holds an upper surface of a substrate, a rotational driving device makes the holding unit pivot on the support shaft as a center of rotation, and a posture holding mechanism keeps the pivoting holding unit in a fixed posture in horizontal directions. The substrate is transferred while the fixed posture in the horizontal directions is maintained by pivotal movement of the holding unit, between the first working device and the second working device.

Abstract: A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.

Abstract: A substrate cleaning apparatus for cleaning a front-side clean target surface 1a and a back-side clean target surface 1b of a edge portion of a substrate 1 by wiping surfaces 12a, 12b of a cleaning tape 12. The substrate cleaning apparatus includes a presser member 11a for pressing the cleaning tape 12 against the clean target surface 1a, a presser member 11b for pressing the cleaning tape 12 against the clean target surface 1b, a tape path passing through between the presser member 11a and the clean target surface 1a and between the presser member 11b and the clean target surface 1b, a moving device for moving the cleaning tape 12 and the substrate 1 relative to each other in a longitudinal direction of the edge portion.

Abstract: A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: A substrate cleaning apparatus for cleaning a front-side clean target surface 1a and a back-side clean target surface 1b of a edge portion of a substrate 1 by wiping surfaces 12a, 12b of a cleaning tape 12. The substrate cleaning apparatus includes a presser member 11a for pressing the cleaning tape 12 against the clean target surface 1a, a presser member 11b for pressing the cleaning tape 12 against the clean target surface 1b, a tape path passing through between the presser member 11a and the clean target surface 1a and between the presser member 11b and the clean target surface 1b, a moving device for moving the cleaning tape 12 and the substrate 1 relative to each other in a longitudinal direction of the edge portion.

Abstract: It is an object of the invention to provide a liquid substance supplying device exhibiting high operability in handling a container having a large capacity. A liquid substance supplying device for supplying a liquid substance reserved in a vertically elongated container 30 has a configuration in which a bottom part of a container holder 15 for holding the container inserted through an insertion hole provided on a top side of a holder main body 16 is pivoted on a base bracket 14 with a hinge portion 19 to support the container holder 15 such that it can assume either upright attitude or tilted attitude and in which the container holder 15 is fixed in the upright attitude by a holder fixing mechanism 20. As a result, the container holder 15 can be mounted and removed to and from the holder main body 16 in the tilted state at the time of a container replacing operation, which allows high operability to be maintained even in handling a large-capacity container having a great height dimension.

Abstract: In a flux transfer unit to be used in an electronic component mounting apparatus for transferring flux to an electronic component picked up from a component feed unit and then mounting the electronic component onto a board, a blade holding head which has a first blade and a second blade for film formation use and scraping use of flux, respectively, and which is reciprocatively driven by a rodless cylinder via a drive transmission pin, is held by a movable member so as to be swingable about a swing support pin, and the movable member is braked with a specified braking force by a plate spring member. Thus, each time the direction of motion of the blade is reversed, the blade holding head swings, so that the first blade and the second blade can be automatically switched over without providing any exclusive drive mechanism.

Abstract: In a chip reversing method for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.

Abstract: While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet, corresponding to an adhesion region of a semiconductor chip, is sucked and held, a plurality of protruding portions of a removing member are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the adhesion region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change an adhesive surface bond of the semiconductor chip to the adhesive sheet to point bonding. Further, the removing member is moved along the bottom surface of the semiconductor chip so as to change the position of the point bonding and decrease the adhesive bonding force to the adhesive sheet. Then, the semiconductor chip is removed from the adhesive sheet.

Abstract: In a flux transfer unit to be used in an electronic component mounting apparatus for transferring flux to an electronic component picked up from a component feed unit and then mounting the electronic component onto a board, a blade holding head which has a first blade and a second blade for film formation use and scraping use of flux, respectively, and which is reciprocatively driven by a rodless cylinder via a drive transmission pin, is held by a movable member so as to be swingable about a swing support pin, and the movable member is braked with a specified braking force by a plate spring member. Thus, each time the direction of motion of the blade is reversed, the blade holding head swings, so that the first blade and the second blade can be automatically switched over without providing any exclusive drive mechanism.

Abstract: A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: It is an object of the invention to provide a liquid substance supplying device exhibiting high operability in handling a container having a large capacity. A liquid substance supplying device for supplying a liquid substance reserved in a vertically elongated container 30 has a configuration in which a bottom part of a container holder 15 for holding the container inserted through an insertion hole provided on a top side of a holder main body 16 is pivoted on a base bracket 14 with a hinge portion 19 to support the container holder 15 such that it can assume either upright attitude or tilted attitude and in which the container holder 15 is fixed in the upright attitude by a holder fixing mechanism 20. As a result, the container holder 15 can be mounted and removed to and from the holder main body 16 in the tilted state at the time of a container replacing operation, which allows high operability to be maintained even in handling a large-capacity container having a great height dimension.

Abstract: A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: The present invention aims to provide a viscous fluid application device which allows improving manufacturing efficiency of semiconductor packages without deteriorating application position accuracy and decreasing designing flexibility. The device includes: an application unit (101) which applies viscous fluid to a substrate 140a; an application head (100) having a supply unit (102) which supplies the viscous fluid to the application unit (101); an X axis unit (110); a Y axis unit (120); a Z axis unit (130); a substrate carrying unit (140); a head height detection sensor (150); and a control unit (160). The supply unit (102) moves in the Y direction in cooperation with a movement in the Y direction of the application unit (101), and remains unmoved irrespective of a movement in the X and Z direction of the application unit (101).

Abstract: When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition operation is performed in either one of the two mounting units, the component placing or component holding operation is not performed in the other of the mounting units.

Abstract: A magazine is provided with two opening portions that enable insertion and extraction of a tray and are approximately orthogonal to each other, and a regulation portion for regulating insertion and extraction of the tray from the opening portions. A tray component feeding device has a loading port for loading the magazine thereinto, and an extraction port for extracting a tray plate of the magazine, which are approximately orthogonal to each other. Further, a component mounting device is provided with the tray component feeding device loaded with the magazine on a lateral side of the component mounting device to which a transfer conveyor for transferring a circuit board extends.

Abstract: A method for treating extremely small particles of recycled polyethylene terephthalate comprises providing a quantity of RPET particles having an average mean particle size ranging from about 0.0005 inch to about 0.05 inch in diameter, heating the RPET particles to a temperature sufficient to cause at least a portion of the RPET particles to adhere to one another, and forming the adhered RPET particles into pellets, said pellets having substantially the same average surface-to-volume ratio as the bulk, un-adhered RPET particles.