Abstract: A semiconductor module includes: a plurality of power semiconductor elements arranged in parallel to each other; a first conductor plate and a second conductor plate respectively bonded to an upper surface and a lower surface of the power semiconductor elements arranged in parallel to each other; a wiring substrate provided on the second conductor plate; and an electronic component mounted on the wiring substrate, the power semiconductor elements, the first conductor plate, the second conductor plate, the wiring substrate, and the electronic component being sealed with a sealing member. The first conductor plate positioned on the upper surface side of the wiring substrate has at least one of a recess and a through hole in a region facing with the electronic component on the wiring substrate.

Abstract: An object of the present invention is to provide a cell culture device capable of reproducing, in vitro, a growth and proliferation environment of an anaerobic bacterium in a living body; a kit for cell culture; and a cell culture method. According to the present invention, there is provided a cell culture device including a plate having a concave portion for accommodating a culture medium, a cell accommodating container having a gas permeable membrane, a first member for holding the cell accommodating container, and a second member having a structure for regulating a gas concentration in an upper space of the cell accommodating container, in which, in a case where a cell sheet is formed on an upper surface of the gas permeable membrane, a space above the gas permeable membrane is in a sealed state in which gas does not pass through.

Abstract: Provided is a power semiconductor module comprising: a gate terminal to which a control signal is inputted; a reference potential terminal disposed adjacent to the gate terminal with a predetermined interval from the gate terminal; a main circuit wiring disposed in the vicinity of the reference potential terminal and the gate terminal; and an electromagnetic shield disposed between the gate terminal and the reference potential terminal to shield induction field generated by current flowing through the main circuit wiring. The present invention is also characterized in that: the electromagnetic shield is integrally formed with the gate terminal and/or the reference potential terminal; and, in a portion between the gate terminal and the reference potential terminal, a gap that is not shielded by the electromagnetic shield as seen from a direction in which a magnetic flux of the induction field intersects with the electromagnetic shield, is 1 mm or less.

Abstract: Provided are a positive electrode terminal and a negative electrode terminal being terminals of a capacitor element; a positive electrode conductor plate connected to the positive electrode terminal; a negative electrode conductor plate connected to the negative electrode terminal; and a power conversion module connected to the two conductor plates. The positive electrode terminal and the negative electrode terminal are formed along an arrangement direction of the capacitor element. The positive electrode conductor plate and the negative electrode conductor plate form a laminated conductor portion in which the positive electrode conductor plate and the negative electrode conductor plate have respective main surfaces disposed, to face the main surface of the capacitor element, and are laminated to each other.

Abstract: Provided are a positive electrode terminal and a negative electrode terminal being terminals of a capacitor element; a positive electrode conductor plate connected to the positive electrode terminal; a negative electrode conductor plate connected to the negative electrode terminal; and a power conversion module connected to the two conductor plates. The positive electrode terminal and the negative electrode terminal are formed along an arrangement direction of the capacitor element. The positive electrode conductor plate and the negative electrode conductor plate form a laminated conductor portion in which the positive electrode conductor plate and the negative electrode conductor plate have respective main surfaces disposed, to face the main surface of the capacitor element, and are laminated to each other.

Abstract: Provided is a compact and highly reliable power semiconductor device that prevents partial discharge originating from voids generated by the entering of water vapor from the exterior of the semiconductor device through a sealing resin or voids generated between a main terminal and the sealing resin when the main terminal is heated. The power semiconductor device comprises an insulating substrate, a semiconductor element provided on a front surface of the insulating substrate, and a gel-like first insulation material for sealing the semiconductor element. The power semiconductor device further includes a plate-shaped terminal for electrically connecting the semiconductor element and an external equipment, and an entire portion of the plate-shaped terminal surrounded by the first insulating material is covered with a second insulating material having a hardness greater than that of the first insulating material.

Abstract: There has been a problem that when a value of a current flowing through a thermistor increases, a voltage drop generated in the thermistor increases, and variations occur in a clamp voltage. A semiconductor device includes: a switching element that is on-off controlled; and a surge voltage protection circuit connected between a positive electrode side terminal of the switching element and a control terminal of the switching element. The surge voltage protection circuit includes a first Zener diode, a second Zener diode connected in series with the first Zener diode, and a temperature characteristic compensating element having a temperature coefficient different in polarity from the first Zener diode and the second Zener diode and connected in parallel with the second Zener diode.

Abstract: An object of the present invention is to provide a power conversion device configured to attain suppression of heat concentration and miniaturization of the device. The power conversion device 40 includes a power module 17 for converting dc power into ac power, a first circuit substrate (power circuit substrate) 16 including a capacitor 31 for smoothing the dc power, and a casing 20 for storing the power module 17 and the first circuit substrate 16. Either the first circuit substrate 16 or the power module 17 is disposed on an inner surface 20bb of a side wall 20b having an outer wall surface 20ba of the casing 20, and the other is disposed on a predetermined inner wall surface 20a of the casing 20 to form an angle with the inner surface 20bb.

Abstract: A first wall portion and a second wall portion of a shield member are provided on a radially outer side of a rotation axis of a motor shaft with respect to a first magnetic sensor in a region other than a region of overlapping the first magnetic sensor on a plane orthogonal to the rotation axis.

Abstract: To improve accessibility with respect to a power conversion unit in a power converter. The power converter includes a circuit connection part including a positive electrode conductor, a negative electrode conductor and an AC conductor, a power semiconductor module positioned in a particular direction with respect to the circuit connection part and connected to the positive electrode conductor, the negative electrode conductor and the AC conductor and a capacitor positioned in the particular direction with respect to the circuit connection part and connected to the positive electrode conductor and the negative electrode conductor. The positive electrode conductor is connected to a positive electrode conductor of another power conversion unit through a unit connection part positioned in an opposite direction of the particular direction with respect to the circuit connection part.

Abstract: An imbalance of control signals between two power semiconductor elements is reduced. A first power semiconductor module and a second power semiconductor module are arranged in a predetermined direction along a surface of a control signal wiring circuit board, each of longitudinal directions of the first power semiconductor module and the second power semiconductor module along the surface of the control signal wiring circuit board is a predetermined direction, and, in a first control signal wiring, a distance between an external control signal terminal and a second control signal terminal is equal to a distance between the external control signal terminal and a first control signal terminal.

Abstract: An uninterruptible power-supply system is a power converter having a PN laminated bus bar and a plurality of power conversion units and supplying power from a commercial power supply via a converter and an inverter. The power conversion units each have positive side terminals connected to each other and negative side terminals connected to each other through the PN laminated bus bar. At least one power conversion unit constitutes a phase of the converter. At least another one power conversion unit constitutes a phase of the inverter and has the positive side terminal lying adjacent to and connected through the PN laminated bus bar to the positive side terminal of the corresponding power conversion unit constituting the phase of the converter and the negative side terminal lying adjacent to and connected to the negative side terminal of the corresponding power conversion unit constituting the phase of the converter.

Abstract: To improve accessibility with respect to a power conversion unit in a power converter. The power converter includes a circuit connection part including a positive electrode conductor, a negative electrode conductor and an AC conductor, a power semiconductor module positioned in a particular direction with respect to the circuit connection part and connected to the positive electrode conductor, the negative electrode conductor and the AC conductor and a capacitor positioned in the particular direction with respect to the circuit connection part and connected to the positive electrode conductor and the negative electrode conductor. The positive electrode conductor is connected to a positive electrode conductor of another power conversion unit through a unit connection part positioned in an opposite direction of the particular direction with respect to the circuit connection part.

Abstract: A module of conversion circuit includes a High side IGBT, a Low side IGBT connected in series to the High side IGBT, a first terminal connected to the High side IGBT, a second terminal connected to the Low side IGBT, a capacitor connected to the first terminal and the second terminal, and a third terminal connected to a connection point between the High side IGBT and the Low side IGBT. A fourth terminal is engaged with the first terminal. A fifth terminal is engaged with the second terminal. A sixth terminal is engaged with the third terminal. The first and second terminals have at portions thereof between front edges and rear edges high-resistance parts having higher resistance than other portions.

Abstract: To improve accessibility with respect to a power conversion unit in a power converter. The power converter includes a circuit connection part including a positive electrode conductor, a negative electrode conductor and an AC conductor, a power semiconductor module positioned in a particular direction with respect to the circuit connection part and connected to the positive electrode conductor, the negative electrode conductor and the AC conductor and a capacitor positioned in the particular direction with respect to the circuit connection part and connected to the positive electrode conductor and the negative electrode conductor. The positive electrode conductor is connected to a positive electrode conductor of another power conversion unit through a unit connection part positioned in an opposite direction of the particular direction with respect to the circuit connection part.

Abstract: The present invention reduces the footprint of a power conversion device. A first power semiconductor module and a second power semiconductor module are connected to a positive conductor, a negative conductor, and an alternating-current conductor. An external alternating-current terminal, the first power semiconductor module, the second power semiconductor module, a capacitor, and an external direct-current terminal including an external positive terminal and an external negative terminal are arrayed on a straight line extending in the longitudinal direction of a circuit connection section. The external alternating-current terminal is disposed at one longitudinal end of the circuit connection section. The external direct-current terminal is disposed at the other longitudinal end of the circuit connection section.

Abstract: An electrical power conversion unit is provided with: a circuit connecting part which includes a positive electrode conductor, a negative electrode conductor, and an alternating current conductor; a power semiconductor module connected to a specific side of the circuit connecting part; a fin that extends to the opposite side of the circuit connecting part with respect to the power semiconductor module; and a capacitor disposed at one end in the lengthwise direction of the circuit connecting part. A space in which a cooling fan is disposed is formed by an extending part and the fin, when the extending part is defined as a region, of the circuit connecting part, other than the portion at which the fin projects to the circuit connecting part, such region including one end that is opposite, via the fin, the one end where the capacitor is present.

Abstract: A cooling structure of a heating element includes: the heating element having at least one cooling surface from which a plurality of pin fins project; a heat receiving plate which has a shape complying with the cooling surface and in which holes are formed at positions facing each pin fin, each pin fin being movably inserted into the holes; a cooler which has a pair of clamping members that sandwich therebetween the heating element and the heat receiving plate while pressing the heating element and the heat receiving plate, and which cools the heat receiving plate; and a space securing part which is provided on the heat receiving plate and suppresses a distance between the pair of clamping members so as not to apply a pressing force by the clamping members to the heating element.

Abstract: A power converter that can be made compact and lightweight is provided. The power converter includes a control circuit power supply, a power semiconductor module that includes power conversion elements, a control circuit board that operates with power from the control circuit power supply and controls the power conversion elements, and a capacitor connected to the power conversion elements. In the power converter, the control circuit power supply charges the capacitor through the control circuit board. With this configuration, hot swapping of the power converter from the converter system can be performed. A boosting circuit may boost voltage of the control circuit power supply to charge the capacitor.

Abstract: The present invention reduces the footprint of a power conversion device. A first power semiconductor module and a second power semiconductor module are connected to a positive conductor, a negative conductor, and an alternating-current conductor. An external alternating-current terminal, the first power semiconductor module, the second power semiconductor module, a capacitor, and an external direct-current terminal including an external positive terminal and an external negative terminal are arrayed on a straight line extending in the longitudinal direction of a circuit connection section. The external alternating-current terminal is disposed at one longitudinal end of the circuit connection section. The external direct-current terminal is disposed at the other longitudinal end of the circuit connection section.