Abstract: The present disclosure relates to an information processing device and a method capable of implementing more various communications. In a space of a user, an input of information by the user is accepted, and tag information for associating control information for controlling occurrence of an event for a communication partner of the user with a space of the communication partner is generated using the accepted information. Furthermore, it is determined whether or not an occurrence condition of the event designated by the tag information for associating the control information for controlling the occurrence of the event for the communication partner with the space of the communication partner, the tag information associated with the space of the user is satisfied, and in a case where it is determined that the occurrence condition is satisfied, the event designated by the tag information is allowed to occur.

Abstract: The present disclosure relates to an information processing device and a method capable of implementing more various communications. In a space of a user, an input of information by the user is accepted, and tag information for associating control information for controlling occurrence of an event for a communication partner of the user with a space of the communication partner is generated using the accepted information. Furthermore, it is determined whether or not an occurrence condition of the event designated by the tag information for associating the control information for controlling the occurrence of the event for the communication partner with the space of the communication partner, the tag information associated with the space of the user is satisfied, and in a case where it is determined that the occurrence condition is satisfied, the event designated by the tag information is allowed to occur.

Abstract: Disclosed herein is an information processing apparatus including a specifying section that specifies a base map to be processed, and a registering section that associates annexed data annexed to the base map specified by the specifying section with information regarding the base map and registers the annexed data in a map database including a database that manages data regarding maps.

Abstract: A heating apparatus 1 includes a shell 2, a primary heat exchanger (sensible heat exchanger) 3, a burner (combustion means) 5, and a fan 6. A secondary heat exchanger (latent heat exchanger) 7 has a plurality of heat receiving tubes 18 arranged in parallel between a pair of headers 16 and 17, the heat receiving tubes 18 being fixed to tube plates 20. The heat receiving tubes 18 are bare tubes without fins and are arranged across flow of combustion gas. The number of the tubes 18 arranged vertically is less than the number of the tubes 18 arranged horizontally.

Abstract: A secondary heat exchanger B for recovering latent heat from combustion gas includes water tubes 5 each of which is so inclined that a first end 50a is positioned lower than a second end 50b. Therefore, in draining water from each of the water tubes 5, water can be caused to flow smoothly into a water-inflow and hot-water-outflow header 6A connected to the first ends 50a. The secondary heat exchanger B includes a casing 7 which includes an upper wall 70a and a bottom wall 70b which are so inclined that the inner surfaces thereof extend generally in parallel with the water tubes 5, and the upper and the lower gaps 79a and 79b have constant widths s2 and s3. Therefore, the amount of heat recovery from the combustion gas passing through the gaps 79a and 79b can be increased.

Abstract: A heating apparatus 1 includes a shell 2, a primary heat exchanger (sensible heat exchanger)3, a burner (combustion means) 5, and a fan 6. A secondary heat exchanger (latent heat exchanger) 7 has a plurality of heat receiving tubes 18 arranged in parallel between a pair of headers 16 and 17, the heat receiving tubes 18 being fixed to tube plates 20. The heat receiving tubes 18 are bare tubes without fins and are arranged across flow of combustion gas. The number of the tubes 18 arranged vertically is less than the number of the tubes 18 arranged horizontally.

Abstract: A secondary heat exchanger B for recovering latent heat from combustion gas includes water tubes 5 each of which is so inclined that a first end 50a is positioned lower than a second end 50b. Therefore, in draining water from each of the water tubes 5, water can be caused to flow smoothly into a water-inflow and hot-water-outflow header 6A connected to the first ends 50a. The secondary heat exchanger B includes a casing 7 which includes an upper wall 70a and a bottom wall 70b which are so inclined that the inner surfaces thereof extend generally in parallel with the water tubes 5, and the upper and the lower gaps 79a and 79b have constant widths s2 and s3. Therefore, the amount of heat recovery from the combustion gas passing through the gaps 79a and 79b can be increased.

Abstract: An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps. A resin coating 21 and a resist film 24 are formed in this order on the surface of a metal film 11 and on the surface of each metal bump 16 formed on the metal film 11, and a pressure is applied on the surface to depress the resist film 24 on the metal bump 16, followed by etching. As the surface of the resin coating 21 is partially exposed at the depressed portion of the resist film 24, etching of the resin coating 21 proceeds from that portion to bulge the surface of the metal bump 16 from the resin coating 21. If the resist film 24 is formed after a flexible resin coating 22 is formed on the rigid resin coating 21, the flexible resin coating 22 can serve as an adhesive layer.

Abstract: Photoresist compositions, which can attain high-accuracy etching without causing separation and flexible printed wiring boards prepared with the photoresist compositions are disclosed. In order to etch a polyimide precursor layer on a conductive circuit, a photoresist composition comprising a photopolymerizable organic material (A), a water-soluble resin (B) and an amino-group-containing resin (C) is applied on the surface of the polyimide precursor layer to form a photoresist layer. Then, the photoresist layer is patterned by a photolithographic process. The polyimide precursor layer is etched and the pattern of the photoresist layer is transferred to the polyimide precursor layer. The amino-group-containing resin (C) in the photoresist layer is combined with an acid anhydride in the polyimide precursor layer to attain good adhesion and high-accuracy etching without causing separation of the photoresist layer.

Abstract: A flexible wiring board piece which can prevent a short circuit because of scattering of the connecting terminal parts and facilitate cutting when cut at an intermediate connecting terminal part. A constitution wherein circuit wiring patterns 13 [131-134] are coated with insulating films 11 and 14; connecting terminal parts 17 of the circuit wiring patterns 13 and cut parts 18 of the circuit wiring patterns 13, which are located apart form the connecting terminal parts 17, are exposed in both faces via openings 20a, 20b, 21a and 21b formed in insulating films 11 and 14; and narrow parts for cutting are formed in the cut parts 18 facing the openings 20b and 20b.

Abstract: A flexible printed circuit board that is intended to minimize curling is formed having a first polyimide-resin layer with a conductor pattern formed on one surface thereof and supporting that conductor pattern. A second polyimide-resin is formed on another surface of the conductor pattern and covers and protects the circuit of the conductor pattern. The polyimide-resin layers are chosen so that a difference between a coefficient of linear thermal expansion of the first polyimide-resin layer and the coefficient of linear thermal expansion of the second polyimide-resin layer is 3×10−6/K or smaller.

Abstract: A flexible circuit board comprises a polyimide insulating layer 5 with land access holes 3 and a conductor circuit layer 4 provided thereon, and is produced by coating one surface of a conductor circuit metal foil 1 side with a polyimide precursor varnish, which is dried to give a polyimide precursor layer 2, where the polyimide precursor layer 2 is provided with land access holes 3 by a photolithography process; the conductor circuit metal foil 1 is patterned by the subtractive process to form conductor circuit layer 4; and the polyimide precursor layer 4 is then imidated to form polyimide insulating layer 5.

Abstract: An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps.

Abstract: The present invention provides a circuit substrate containing a conductive circuit on an insulating base, an electrode for connection to an IC and an electrode for connection to a mother board substrate, which eliminates the step of bonding the film-like insulating base and the conductive circuit to simplify the manufacturing process.

Abstract: An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps. A resin coating 21 and a resist film 24 are formed in this order on the surface of a metal film 11 and on the surface of each metal bump 16 formed on the metal film 11, and a pressure is applied on the surface to depress the resist film 24 on the metal bump 16, followed by etching. As the surface of the resin coating 21 is partially exposed at the depressed portion of the resist film 24, etching of the resin coating 21 proceeds from that portion to bulge the surface of the metal bump 16 from the resin coating 21.

Abstract: The present invention aims to obtain a flexible printed wiring board with good flatness. According to the present invention, a copper-clad film 3 is formed by applying a polyamic acid solution on one surface of a copper foil 2 and thermally contracting the polyamic acid layer la so that the other surface of the copper foil 2 may form a convex surface of a curling surface to form a polyimide film 1. A polyamic acid solution is applied on the other surface of the copper foil 2 of the copper-clad film 3, and then the polyamic acid layer 5a is thermally contracted to form a protective film 5, whereby a flexible printed wiring board 10 is obtained.