Patents by Inventor Akira Yao

Akira Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6450132
    Abstract: Inner peripheral grooves for transporting a liquid of a working fluid in the longitudinal direction of a first wick are provided along the first wick which transports the liquid contained in the evaporator to a heating portion in the evaporator by capillary force, and a liquid supply portion for supplying the liquid of the working fluid is further provided to the inner peripheral grooves. Therefore, the liquid of the working fluid can be efficiently supplied to the inner peripheral surface of the first wick with a simple structure, so that a loop type heat pipe which can be constantly stably operated can be obtained.
    Type: Grant
    Filed: February 5, 2001
    Date of Patent: September 17, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Akira Yao, Hiroaki Ishikawa, Tetsurou Ogushi, Eiichi Ozaki
  • Publication number: 20020043220
    Abstract: Inner peripheral grooves for transporting a liquid of a working fluid in the longitudinal direction of a first wick are provided along the first wick which transports the liquid contained in the evaporator to a heating portion in the evaporator by capillary force, and a liquid supply portion for supplying the liquid of the working fluid is further provided to the inner peripheral grooves. Therefore, the liquid of the working fluid can be efficiently supplied to the inner peripheral surface of the first wick with a simple structure, so that a loop type heat pipe which can be constantly stably operated can be obtained.
    Type: Application
    Filed: February 5, 2001
    Publication date: April 18, 2002
    Inventors: Akira Yao, Hiroaki Ishikawa, Tetsurou Ogushi, Eiichi Ozaki
  • Patent number: 6330907
    Abstract: An evaporator includes a container, a wick provided in contact with an inner peripheral surface of said container and formed such that (1) if the number of pores per unit volume is fixed, the diameter of pores is varied, or (2) if the diameters of pores are formed substantially uniformly, the number of pores is varied, a sump having said wick as its inner wall surface and connected to a liquid pipe for supplying a liquid-phase working fluid, and a vapor channel formed in a contact surface of said container with respect to said wick so as to guide a gas-phase working fluid into a vapor pipe connected to an end portion of said container.
    Type: Grant
    Filed: September 10, 1999
    Date of Patent: December 18, 2001
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tetsurou Ogushi, Masaaki Murakami, Akira Yao, Takeshi Okamoto, Hiromitsu Masumoto, Hisaaki Yamakage
  • Patent number: 5769158
    Abstract: An interface portion structure and a reinforcing structure for flexible thermal joints. A member having a high thermal conductivity represented by bundled graphite fibers is used as a thermal conductor for heat transfer from a heat source to a heat sink. The thermal conductor is provided with auxiliary thermal conductors at its interface portions in order to suppress thermal resistance on a face for conducting heat between the thermal conductor and the heat source or heat sink, and a conduction cross-sectional area is increased by the auxiliary thermal conductors. To suppress thermal resistance, a heat conduction face is cut slantwise or metallized, and adhesive agent is disused.
    Type: Grant
    Filed: March 6, 1997
    Date of Patent: June 23, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Akira Yao
  • Patent number: 5727619
    Abstract: A sandwiched honeycomb panel with built in heat pipes includes a radiating fin which is integral with an envelope having a heat pipe formed therein. A heat block may be used in place of the radiating fin.
    Type: Grant
    Filed: July 10, 1996
    Date of Patent: March 17, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Akira Yao, Hiromi Seko
  • Patent number: 5682943
    Abstract: A sandwiched honeycomb panel with built in heat pipes includes a radiating fin which is integral with an envelope having a heat pipe formed therein. A heat block may be used in place of the radiating fin.
    Type: Grant
    Filed: July 1, 1996
    Date of Patent: November 4, 1997
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Akira Yao, Hiromi Seko
  • Patent number: 5335720
    Abstract: A heat pipe comprising a hermetic shell tube, a heat conveying fluid within the shell tube and a plurality of capillary circumferential or axial grooves provided entirely of an inner surface of the shell. A capillary axial channel structure which includes axially extending plates defining a U-shaped or V-shaped channels therebetween circumferential grooves and having an opening defining therein a meniscus of the heat conveying fluid in the liquid phase at least in the evaporator section and the condenser section. The capillary axial channel structure may comprise an inner tube for defining a tubular, axially extending capillary space therebetween. The inner tube has open ends disposed within the evaporation and condensation sections for allowing the heat conveying fluid to flow therethrough.
    Type: Grant
    Filed: August 6, 1992
    Date of Patent: August 9, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tetsurou Ogushi, Masaaki Murakami, Kazuyoshi Yabuchi, Akira Yao
  • Patent number: 5259447
    Abstract: A heat transport system is disclosed which comprises an evaporator, a condenser, an accumulator, switching means and connecting pipe therethrough. The switching means changes the operation mode from the first mode to the second mode alternatively. In the first mode, cooled liquid flows into the accumulator. In the second mode, the capillary pressure occurring in the evaporator leads the liquid in the accumulator to the evaporator. By switching the first mode and the second mode alternatively, the heat is transported from the evaporator to the condenser. Because of the operation of the capillary pressure, the heat transport system of the present invention can work even in gravity-free environments.
    Type: Grant
    Filed: August 5, 1991
    Date of Patent: November 9, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tetsurou Ogushi, Masaaki Murakami, Akira Yao