Patents by Inventor Akira Yasukawa

Akira Yasukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4606405
    Abstract: In a perforated heat conductive surface structure having voids under an outer surface and openings in the outer surface, in order to obtain a high performance in particular at a low pressure and low temperature region, there is provided a heat transfer wall in which a thickness of a wall at a ceiling of each void and a length of a passage of the respective openings are increased in predetermined ranges.
    Type: Grant
    Filed: February 13, 1985
    Date of Patent: August 19, 1986
    Assignees: Hitachi, Ltd., Hitachi Cable, Ltd.
    Inventors: Wataru Nakayama, Tadakatsu Nakajima, Heikichi Kuwahara, Akira Yasukawa, Takahiro Daikoku, Hiromichi Yoshida
  • Patent number: 4585055
    Abstract: A liquid film evaporation type heat exchanger including a plurality of heat transfer units, with each unit including a plurality of flat heat transfer ducts of square cross section formed with a plurality of warm water passageways extending perpendicular to the direction of flow of a liquid medium, and a plurality of liquid distributing beams formed with a pluraity of cutouts. The heat transfer ducts and the liquid distributing beams being alternately arranged in the respective units, with the heat transfer units being arranged at locations spaced apart from each other in the direction of flow of the liquid medium. Vapor releasing ports are formed in positions between the adjacent heat transfer units. Each heat transfer duct has on either side surface thereof a porous material layer providing a heat exchange surface on which a film of the liquid medium is formed for evaporation.
    Type: Grant
    Filed: November 16, 1983
    Date of Patent: April 29, 1986
    Assignee: Hitachi, Ltd.
    Inventors: Wataru Nakayama, Takahiro Daikoku, Tadakatsu Nakajima, Heikichi Kuwahara, Akira Yasukawa
  • Patent number: 4561497
    Abstract: In a heat transfer surface having cavity groups and restricted opening groups in an outer surface region, the cavity groups are composed of a plurality of rows of void strip members. The cavity strip members are arranged in parallel on a base member of the heat transfer surface and are laminated in one or more layers. Each strip member has a number of elongate cavities laterally arranged in parallel. The elongate cavities are closed at upper surfaces and have at both ends openings. The adjacent cavities in the same layer are communicated with each other by communicating portions each provided between the cavity strip members and by the openings. The restricted opening groups are formed on the upper surfaces of the communicating portions. The restricted opening groups render the communicating portions in one layer, the communicating portions in another layer and the outside to communicate with each another. The method of manufacturing such a heat transfer surface is also disclosed.
    Type: Grant
    Filed: December 14, 1983
    Date of Patent: December 31, 1985
    Assignees: Hitachi, Ltd., Hitachi Cable Ltd.
    Inventors: Tadakatsu Nakajima, Wataru Nakayama, Takahiro Daikoku, Heikichi Kuwahara, Akira Yasukawa, Katsuhiko Kasuya, Kazuaki Yokoi, Hideo Nakae, Hiromichi Yoshida