Patents by Inventor Akiyoshi Yamamoto

Akiyoshi Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9157979
    Abstract: A magnetic resonance imaging (MRI) system includes at least one controller configured to first acquire at least MRI locator image data for different portions of patient anatomy at each of different imaging stations for a defined multi-station locator sequence. An operator may interface with a respectively corresponding displayed locator image for each imaging station to set diagnostic scan sequence parameters for subsequent diagnostic MRI scans of corresponding portions of patient anatomy. Diagnostic MRI scan data is automatically acquired at each of the imaging stations in a multi-station diagnostic scan sequence that, if desired, can be seamlessly continued without operator interruption once begun.
    Type: Grant
    Filed: May 2, 2011
    Date of Patent: October 13, 2015
    Assignee: TOSHIBA MEDICAL SYSTEMS CORPORATION
    Inventors: Mitsue Miyazaki, Katsumi Nakamura, Akiyoshi Yamamoto
  • Patent number: 8650986
    Abstract: It is provided a vehicle operation pedal in which a pedal sheet is integrally fixed to a sheet fixed portion of a pedal arm in such a posture that a depressed face of the pedal sheet, which is depressed by a driver, faces a driver's seat, comprising a fitting hole through which the sheet fixed portion of the pedal arm extends formed in the pedal sheet; and the sheet fixed portion being fitted into the fitting hole from a rear face that is on the side opposite to the depressed face, and a peripheral portion around the fitting hole being integrally fixed to the sheet fixed portion by welding performed from the depressed face side.
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: February 18, 2014
    Assignee: Toyoda Iron Works Co., Ltd.
    Inventor: Akiyoshi Yamamoto
  • Patent number: 8643194
    Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer on the base material; and a film for flip chip type semiconductor back surface, which is provided on the pressure-sensitive adhesive layer, in which at least a part of the pressure-sensitive adhesive layer has been cured beforehand by irradiation with a radiation ray.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: February 4, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Naohide Takamoto, Goji Shiga, Fumiteru Asai, Akiyoshi Yamamoto, Tomokazu Takahashi
  • Publication number: 20140003113
    Abstract: Disclosed herein is a semiconductor device that includes: a plurality of memory arrays disposed in a first direction and a second direction that crosses the first direction; a plurality of row decoders disposed along a first side of the memory arrays; a plurality of first column decoders each disposed along a second side that does not face the first side of an associated one of the memory arrays; and a plurality of second column decoders each disposed along a third side that faces the second side of an associated one of the memory arrays. Each of the memory arrays is sandwiched between a corresponding one of the first column decoders and a corresponding one of the second column decoders.
    Type: Application
    Filed: June 26, 2013
    Publication date: January 2, 2014
    Inventors: Masaki SENO, Akiyoshi YAMAMOTO
  • Publication number: 20120291944
    Abstract: There is provided a method of producing an electronic component capable of preventing electrostatic destruction on a circuit or the like formed on the electronic component by eliminating the electrification charge generated on a pressure-sensitive adhesive sheet efficiently in a short period of time upon producing the electronic component using the pressure-sensitive adhesive sheet.
    Type: Application
    Filed: August 4, 2011
    Publication date: November 22, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuki Higashibeppu, Akiyoshi Yamamoto
  • Patent number: 8309887
    Abstract: A welding torch includes: a contact tip having, on a distal-end inner circumferential surface thereof, a power supply portion that contacts a fed welding wire to supply current; and a wire guide that is provided having a predetermined clearance within the contact tip and guides the fed welding wire, and wherein the arc-welding torch is configured such that axes of the contact tip and the wire guide are relatively changed so as to cause the welding wire fed while guided by the wire guide to contact the power supply portion of the contact tip. The power supply portion of the contact tip is formed to have an axial length with which a welding current can be maintained at least a predetermined lower limit current despite a shift of a power supply point in accordance with wear of the power supply portion, more specifically, formed to have a length of 1 to 4 mm.
    Type: Grant
    Filed: September 5, 2008
    Date of Patent: November 13, 2012
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Akiyoshi Yamamoto, Yoshiharu Isoshima
  • Patent number: 8310890
    Abstract: A device and a method controlling the device are provided. A first command is supplied to the device in synchronization with a clock signal of a first frequency. The first command is to have the device perform a first operation. The frequency of the clock signal is changed from the first frequency to a second frequency higher than the first frequency. The device performs the first operation in synchronization with the clock signal of the second frequency following changing the frequency of the clock signal.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: November 13, 2012
    Assignee: Elpida Memory, Inc.
    Inventor: Akiyoshi Yamamoto
  • Publication number: 20120283549
    Abstract: A magnetic resonance imaging (MRI) system includes at least one controller configured to first acquire at least MRI locator image data for different portions of patient anatomy at each of different imaging stations for a defined multi-station locator sequence. An operator may interface with a respectively corresponding displayed locator image for each imaging station to set diagnostic scan sequence parameters for subsequent diagnostic MRI scans of corresponding portions of patient anatomy. Diagnostic MRI scan data is automatically acquired at each of the imaging stations in a multi-station diagnostic scan sequence that, if desired, can be seamlessly continued without operator interruption once begun.
    Type: Application
    Filed: May 2, 2011
    Publication date: November 8, 2012
    Applicant: TOSHIBA MEDICAL SYSTEMS CORPORATION
    Inventors: MITSUE MIYAZAKI, Katsumi Nakamura, Akiyoshi Yamamoto
  • Publication number: 20120176852
    Abstract: A device and a method controlling the device are provided. A first command is supplied to the device in synchronization with a clock signal of a first frequency. The first command is to have the device perform a first operation. The frequency of the clock signal is changed from the first frequency to a second frequency higher than the first frequency. The device performs the first operation in synchronization with the clock signal of the second frequency following changing the frequency of the clock signal.
    Type: Application
    Filed: March 16, 2012
    Publication date: July 12, 2012
    Applicant: ELPIDA MEMORY, INC.
    Inventor: Akiyoshi Yamamoto
  • Patent number: 8174915
    Abstract: A device and a method controlling the device are provided. A first command is supplied to the device in synchronization with a clock signal of a first frequency. The first command is to have the device perform a first operation. The frequency of the clock signal is changed from the first frequency to a second frequency higher than the first frequency. The device performs the first operation in synchronization with the clock signal of the second frequency following changing the frequency of the clock signal.
    Type: Grant
    Filed: February 2, 2010
    Date of Patent: May 8, 2012
    Assignee: Elpida Memory, Inc.
    Inventor: Akiyoshi Yamamoto
  • Publication number: 20120058319
    Abstract: The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.
    Type: Application
    Filed: September 1, 2011
    Publication date: March 8, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Akiyoshi YAMAMOTO, Takashi HABU, Fumiteru ASAI, Tomokazu TAKAHASHI, Eiichi IMOTO, Yuta SHIMAZAKI
  • Publication number: 20110254176
    Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer on the base material; and a film for flip chip type semiconductor back surface, which is provided on the pressure-sensitive adhesive layer, in which at least a part of the pressure-sensitive adhesive layer has been cured beforehand by irradiation with a radiation ray.
    Type: Application
    Filed: April 18, 2011
    Publication date: October 20, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naohide TAKAMOTO, Goji SHIGA, Fumiteru ASAI, Akiyoshi YAMAMOTO, Tomokazu TAKAHASHI
  • Publication number: 20110151252
    Abstract: An adhesive tape or sheet comprises an adhesive layer which contains 0.3 to 10 parts by weight of an polyether polyol compound, and 0.005 to 2 parts by weight of at least one alkali metal salt for 100 parts by weight of an acrylic adhesive which is formed with a copolymer of methyl acrylate monomer, ethyl acrylate monomer, or methyl acrylate monomer and ethyl acrylate monomer, acrylate monomer, and 2-ethylhexyl acrylate monomer.
    Type: Application
    Filed: August 20, 2009
    Publication date: June 23, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Toshio Shintani, Akiyoshi Yamamoto, Tsubasa Miki
  • Publication number: 20110132133
    Abstract: It is provided a vehicle operation pedal in which a pedal sheet is integrally fixed to a sheet fixed portion of a pedal arm in such a posture that a depressed face of the pedal sheet, which is depressed by a driver, faces a driver's seat, comprising a fitting hole through which the sheet fixed portion of the pedal arm extends formed in the pedal sheet; and the sheet fixed portion being fitted into the fitting hole from a rear face that is on the side opposite to the depressed face, and a peripheral portion around the fitting hole being integrally fixed to the sheet fixed portion by welding performed from the depressed face side.
    Type: Application
    Filed: November 29, 2010
    Publication date: June 9, 2011
    Applicant: TOYODA IRON WORKS CO., LTD.
    Inventor: Akiyoshi YAMAMOTO
  • Patent number: 7943235
    Abstract: An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer is formed using a multifunctional acrylate oligomer and/or monomer having a double bond, and is blended so as to result in 1 double bond per total average molecular weight of 225 to 8000 as determined on the basis of the weight average molecular weight of the multifunctional acrylate oligomer and/or monomer.
    Type: Grant
    Filed: January 3, 2008
    Date of Patent: May 17, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Akiyoshi Yamamoto, Toshio Shintani, Fumiteru Asai, Kouichi Hashimoto
  • Publication number: 20110006045
    Abstract: A welding torch includes: a contact tip having, on a distal-end inner circumferential surface thereof, a power supply portion that contacts a fed welding wire to supply current; and a wire guide that is provided having a predetermined clearance within the contact tip and guides the fed welding wire, and wherein the arc-welding torch is configured such that axes of the contact tip and the wire guide are relatively changed so as to cause the welding wire fed while guided by the wire guide to contact the power supply portion of the contact tip. The power supply portion of the contact tip is formed to have an axial length with which a welding current can be maintained at at least a predetermined lower limit current despite a shift of a power supply point in accordance with wear of the power supply portion, more specifically, formed to have a length of 1 to 4 mm.
    Type: Application
    Filed: September 5, 2008
    Publication date: January 13, 2011
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Akiyoshi Yamamoto, Yoshiharu Isoshima
  • Publication number: 20100195426
    Abstract: A device and a method controlling the device are provided. A first command is supplied to the device in synchronization with a clock signal of a first frequency. The first command is to have the device perform a first operation. The frequency of the clock signal is changed from the first frequency to a second frequency higher than the first frequency. The device performs the first operation in synchronization with the clock signal of the second frequency following changing the frequency of the clock signal.
    Type: Application
    Filed: February 2, 2010
    Publication date: August 5, 2010
    Applicant: ELPIDA MEMORY, INC.
    Inventor: Akiyoshi Yamamoto
  • Publication number: 20100028662
    Abstract: An object of the present invention is to provide a stable adhesive sheet in which the disappearance of the laser-printings prevents almost entirely, without leaving adhesive residue whatsoever during the cut of the substrate. An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer has a thickness of 7 to 15 ?m.
    Type: Application
    Filed: December 20, 2007
    Publication date: February 4, 2010
    Applicant: Nitto Denko Corporation
    Inventors: Toshio Shintani, Akiyoshi Yamamoto, Fumiteru Asai, Kouichi Hashimoto
  • Publication number: 20090314417
    Abstract: The present invention provides a method of grinding a back side of a semiconductor wafer, which includes applying an adhesive sheet including a substrate and an adhesive layer formed on one side of the substrate to a front side of a semiconductor wafer to provisionally fix the semiconductor wafer to the adhesive sheet, followed by grinding the back side of the semiconductor wafer, in which the adhesive layer contains 100 parts by weight of a base polymer for radiation-curable adhesives, 0.02 to 10 parts by weight of a phosphoric ester compound having an alkyl group having 10 or more carbon atoms, and more than 10 parts by weight but 200 parts by weight or less of at least one polyfunctional acrylate oligomer and/or monomer having one or more carbon-carbon double bonds, the polyfunctional acrylate oligomer and/or monomer having a weight-average molecular weight per carbon-carbon double bond of 250 to 6,500.
    Type: Application
    Filed: June 19, 2009
    Publication date: December 24, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takatoshi SASAKI, Toshio SHINTANI, Fumiteru ASAI, Akiyoshi YAMAMOTO
  • Publication number: 20090311474
    Abstract: An object of the present invention is to provide an adhesive sheet which, through improvement in the permeability of liquids originating in a liquid stream during water jet laser dicing, allows chips, IC components, or the like to be detached, prevents machining precision from being compromised such as by chipping or the scattering of chips and the like, and allows extremely thin semiconductor wafers or materials to be processed. The adhesive sheet for water jet laser dicing of the present invention comprises an adhesive layer laminated on a base film, the base film made of mesh fiber.
    Type: Application
    Filed: April 15, 2008
    Publication date: December 17, 2009
    Inventors: Tomokazu Takahashi, Fumiteru Asai, Toshio Shintani, Takatoshi Sasaki, Akiyoshi Yamamoto, Tsubasa Miki