Patents by Inventor Ala Moradian

Ala Moradian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190338442
    Abstract: An apparatus for controlling heat flow within a melt. The apparatus may include a crucible configured to contain the melt where the melt has an exposed surface. The apparatus may also include a heater disposed below a first side of the crucible and configured to supply heat through the melt to the exposed surface, and a heat diffusion barrier assembly comprising at least one heat diffusion barrier disposed within the crucible and defining an isolation region in the melt and an outer region in the melt.
    Type: Application
    Filed: July 16, 2019
    Publication date: November 7, 2019
    Inventors: Peter L. Kellerman, Frederick M. Carlson, David Morrell, Ala Moradian, Nandish Desai
  • Patent number: 10443934
    Abstract: A system for heating substrates while being transported between the load lock and the platen is disclosed. The system comprises an array of light emitting diodes (LEDs) disposed above the alignment station. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. The LEDs may be arranged so that the rotation of the substrate during alignment results in a uniform temperature profile of the substrate. Further, heating during alignment may also increase throughput and eliminate preheating stations that are currently associated with the processing chamber.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: October 15, 2019
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Morgan D. Evans, Jason M. Schaller, D. Jeffrey Lischer, Ala Moradian, William T. Weaver, Robert Brent Vopat
  • Publication number: 20190284715
    Abstract: An apparatus for controlling heat flow within a melt. The apparatus may include a crucible configured to contain the melt where the melt has an exposed surface. The apparatus may also include a heater disposed below a first side of the crucible and configured to supply heat through the melt to the exposed surface, and a heat diffusion barrier assembly comprising at least one heat diffusion barrier disposed within the crucible and defining an isolation region in the melt and an outer region in the melt.
    Type: Application
    Filed: March 27, 2014
    Publication date: September 19, 2019
    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
    Inventors: Peter L. Kellerman, Frederick M. Carlson, David Morrell, Ala Moradian, Nandish Desai
  • Patent number: 10415151
    Abstract: An apparatus for controlling heat flow within a melt. The apparatus may include a crucible configured to contain the melt where the melt has an exposed surface. The apparatus may also include a heater disposed below a first side of the crucible and configured to supply heat through the melt to the exposed surface, and a heat diffusion barrier assembly comprising at least one heat diffusion barrier disposed within the crucible and defining an isolation region in the melt and an outer region in the melt.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: September 17, 2019
    Assignee: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC
    Inventors: Peter L. Kellerman, Frederick M. Carlson, David Morrell, Ala Moradian, Nandish Desai
  • Publication number: 20190228997
    Abstract: A method and apparatus to determine a temperature of a substrate using a spectrum of radiation is disclosed herein. In one aspect, a process chamber includes a lamp assembly optically coupled to a spectrometer. The spectrometer is used to determine a temperature of a substrate within the process chamber. A controller is coupled to the spectrometer and controls the lamp assembly to selectively heat and cool the substrate. In another aspect, a method of includes exposing a substrate to a radiation source. A spectrum of radiation is detected by a spectrometer across a substrate. The spectrum of radiation passed through the substrate is determined and used to determine a temperature of the substrate.
    Type: Application
    Filed: January 16, 2019
    Publication date: July 25, 2019
    Inventors: Ji-Dih HU, Ala MORADIAN
  • Publication number: 20190170591
    Abstract: An improved system and method of measuring the temperature of a workpiece being processed is disclosed. The temperature measurement system determines a temperature of a workpiece by measuring the amount of expansion in the workpiece due to thermal expansion. The amount of expansion may be measured using a number of different techniques. In certain embodiments, a light source and a light sensor are disposed on opposite sides of the workpiece. The total intensity of the signal received by the light sensor may be indicative of the dimension of the workpiece. In another embodiment, an optical micrometer may be used. In another embodiment, a light sensor may be used in conjunction with a separate device that measures the position of the workpiece.
    Type: Application
    Filed: February 21, 2018
    Publication date: June 6, 2019
    Inventors: Klaus Petry, Jason M. Schaller, Ala Moradian, Morgan D. Evans
  • Patent number: 9957636
    Abstract: A crystallizer for growing a crystalline sheet from a melt may include a cold block having a cold block surface that faces an exposed surface of the melt, the cold block configured to generate a cold block temperature at the cold block surface that is lower than a melt temperature of the melt at the exposed surface. The system may also include a nozzle disposed within the cold block and configured to deliver a gas jet to the exposed surface, wherein the gas jet and the cold block are interoperative to generate a process zone that removes heat from the exposed surface at a first heat removal rate that is greater than a second heat removal rate from the exposed surface in outer regions outside of the process zone.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: May 1, 2018
    Assignee: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
    Inventors: Peter L. Kellerman, Brian Mackintosh, Frederick M. Carlson, David Morrell, Ala Moradian, Nandish Desai, Dawei Sun, Frank Sinclair
  • Patent number: 9933314
    Abstract: An improved system and method of measuring the temperature of a workpiece being processed is disclosed. The temperature measurement system determines a temperature of a workpiece by measuring the amount of expansion in the workpiece due to thermal expansion. The amount of expansion may be measured using a number of different techniques. In certain embodiments, a light source and a light sensor are disposed on opposite sides of the workpiece. The total intensity of the signal received by the light sensor may be indicative of the dimension of the workpiece. In another embodiment, an optical micrometer may be used. In another embodiment, a light sensor may be used in conjunction with a separate device that measures the position of the workpiece.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: April 3, 2018
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Klaus Petry, Jason M. Schaller, Ala Moradian, Morgan D. Evans
  • Patent number: 9899242
    Abstract: A system for heating substrates while being transported between processing chambers is disclosed. The system comprises an array of light emitting diodes (LEDs) disposed in the transfer chamber. The LEDs may be GaN LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. A controller is in communication with the LEDs. The LEDs may be independently controllable, so that the LEDs that are disposed above the substrate as it is moved from one processing chamber to another are illuminated. In other words, the illumination of the LEDs and the movements of the substrate handling robot may be synchronized by the controller.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: February 20, 2018
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Jason M. Schaller, Morgan D. Evans, Ala Moradian, Robert Brent Vopat, David Blahnik, William T. Weaver
  • Publication number: 20180047864
    Abstract: A crystallizer for growing a crystalline sheet from a melt may include a cold block having a cold block surface that faces an exposed surface of the melt, the cold block configured to generate a cold block temperature at the cold block surface that is lower than a melt temperature of the melt at the exposed surface. The system may also include a nozzle disposed within the cold block and configured to deliver a gas jet to the exposed surface, wherein the gas jet and the cold block are interoperative to generate a process zone that removes heat from the exposed surface at a first heat removal rate that is greater than a second heat removal rate from the exposed surface in outer regions outside of the process zone.
    Type: Application
    Filed: March 27, 2014
    Publication date: February 15, 2018
    Applicant: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Peter L. Kellerman, Brian Mackintosh, Frederick M. Carlson, David Morrell, Ala Moradian, Nandish Desai, Dawei Sun, Frank Sinclair
  • Publication number: 20180003567
    Abstract: An improved system and method of measuring the temperature of a workpiece being processed is disclosed. The temperature measurement system determines a temperature of a workpiece by measuring the amount of expansion in the workpiece due to thermal expansion. The amount of expansion may be measured using a number of different techniques. In certain embodiments, a light source and a light sensor are disposed on opposite sides of the workpiece. The total intensity of the signal received by the light sensor may be indicative of the dimension of the workpiece. In another embodiment, an optical micrometer may be used. In another embodiment, a light sensor may be used in conjunction with a separate device that measures the position of the workpiece.
    Type: Application
    Filed: June 30, 2016
    Publication date: January 4, 2018
    Inventors: Klaus Petry, Jason M. Schaller, Ala Moradian, Morgan D. Evans
  • Publication number: 20170247810
    Abstract: A sheet-forming apparatus including a crucible for holding a melt of material and a solid sheet of the material disposed within the melt, a crystallizer disposed above the crucible and configured to form the sheet from the melt, and an ultrasonic measurement system disposed adjacent the crystallizer, the ultrasonic measurement system comprising at least one ultrasonic measurement device including a waveguide coupled to an ultrasonic transducer for directing an ultrasonic pulse through the melt.
    Type: Application
    Filed: October 16, 2015
    Publication date: August 31, 2017
    Inventors: Peter L. Kellerman, Ala Moradian, Frank Sinclair
  • Patent number: 9728430
    Abstract: An electrostatic chuck with LED heating is disclosed. The electrostatic chuck with LED heating comprises a first subassembly, which comprises a LED heater, and a second subassembly, which comprises an electrostatic chuck. The LED substrate heater subassembly includes a base having a recessed portion. A plurality of light emitting diodes (LEDs) is disposed within the recessed portion. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. The second subassembly, which comprises an electrostatic chuck, is disposed on the LED substrate heater subassembly. The electrostatic chuck includes a top dielectric layer and an interior layer that are transparent at the wavelength emitted by the LEDs. One or more electrodes are disposed between the top dielectric layer and the interior layer to create the electrostatic force.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: August 8, 2017
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Jason M. Schaller, William T. Weaver, Morgan D. Evans, Robert Brent Vopat, Paul E. Pergande, Julian G. Blake, David Blahnik, Ala Moradian
  • Patent number: 9685303
    Abstract: A system and method for heating a substrate while that substrate is being processed by an ion beam is disclosed. The system comprises two arrays of light emitting diodes (LEDs) disposed above and below the ion beam. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. The LED arrays may be arranged so that the ion beam passes between the two LED arrays and strikes the substrate. As the substrate is translated relative to the ion beam, the LEDs from the LED arrays provide heating to the substrate.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: June 20, 2017
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Morgan D. Evans, Jason M. Schaller, D. Jeffrey Lischer, Ala Moradian
  • Patent number: 9633886
    Abstract: An electrostatic clamp having improved temperature uniformity is disclosed. The electrostatic clamp includes an LED array mounted along an annular ring so as to illuminate the outer edge of the workpiece. The LEDs in the LED array may emit light at a wavelength readily absorbed by the workpiece, such as between 0.4 ?m and 1.0 ?m. The center portion of the workpiece is heated using conductive heating provided by the heated electrostatic clamp. The outer portion of the workpiece is heated by light energy from the LED array. The LED array may be disposed on the base of the electrostatic clamp, or may be disposed on a separate ring. The diameter of the upper dielectric layer of the electrostatic clamp may be modified to accommodate the LED array.
    Type: Grant
    Filed: April 16, 2015
    Date of Patent: April 25, 2017
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Morgan D. Evans, Jason M. Schaller, Ala Moradian, D. Jeffrey Lischer, Gregory D. Thronson
  • Publication number: 20160379853
    Abstract: An electrostatic chuck with LED heating is disclosed. The electrostatic chuck with LED heating comprises a first subassembly, which comprises a LED heater, and a second subassembly, which comprises an electrostatic chuck. The LED substrate heater subassembly includes a base having a recessed portion. A plurality of light emitting diodes (LEDs) is disposed within the recessed portion. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. The second subassembly, which comprises an electrostatic chuck, is disposed on the LED substrate heater subassembly. The electrostatic chuck includes a top dielectric layer and an interior layer that are transparent at the wavelength emitted by the LEDs. One or more electrodes are disposed between the top dielectric layer and the interior layer to create the electrostatic force.
    Type: Application
    Filed: June 29, 2015
    Publication date: December 29, 2016
    Inventors: Jason M. Schaller, William T. Weaver, Morgan D. Evans, Robert Brent Vopat, Paul E. Pergande, Julian G. Blake, David Blahnik, Ala Moradian
  • Publication number: 20160329190
    Abstract: A system and method for heating a substrate while that substrate is being processed by an ion beam is disclosed. The system comprises two arrays of light emitting diodes (LEDs) disposed above and below the ion beam. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. The LED arrays may be arranged so that the ion beam passes between the two LED arrays and strikes the substrate. As the substrate is translated relative to the ion beam, the LEDs from the LED arrays provide heating to the substrate.
    Type: Application
    Filed: May 8, 2015
    Publication date: November 10, 2016
    Inventors: Morgan D. Evans, Jason M. Schaller, D. Jeffrey Lischer, Ala Moradian
  • Publication number: 20160329458
    Abstract: A system for heating substrates while being transported between the load lock and the platen is disclosed. The system comprises an array of light emitting diodes (LEDs) disposed above the alignment station. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. The LEDs may be arranged so that the rotation of the substrate during alignment results in a uniform temperature profile of the substrate. Further, heating during alignment may also increase throughput and eliminate preheating stations that are currently associated with the processing chamber.
    Type: Application
    Filed: May 8, 2015
    Publication date: November 10, 2016
    Inventors: Morgan D. Evans, Jason M. Schaller, D. Jeffrey Lischer, Ala Moradian, William T. Weaver, Robert Brent Vopat
  • Publication number: 20160307786
    Abstract: An electrostatic clamp having improved temperature uniformity is disclosed. The electrostatic clamp includes an LED array mounted along an annular ring so as to illuminate the outer edge of the workpiece. The LEDs in the LED array may emit light at a wavelength readily absorbed by the workpiece, such as between 0.4 ?m and 1.0 ?m. The center portion of the workpiece is heated using conductive heating provided by the heated electrostatic clamp. The outer portion of the workpiece is heated by light energy from the LED array. The LED array may be disposed on the base of the electrostatic clamp, or may be disposed on a separate ring. The diameter of the upper dielectric layer of the electrostatic clamp may be modified to accommodate the LED array.
    Type: Application
    Filed: April 16, 2015
    Publication date: October 20, 2016
    Inventors: Morgan D. Evans, Jason M. Schaller, Ala Moradian, D. Jeffrey Lischer, Gregory D. Thronson
  • Publication number: 20160302966
    Abstract: A phacoemulsification needle includes a hub for connection to an ultrasonic handpiece. An elongated shaft is formed with the hub and extends from the hub. A distal end of the shaft breaks-up tissue when the distal end is caused to be vibrated by the handpiece. At least a distal portion of the shaft is formed of a material that has properties providing advantages compared to a metal needle. Example properties include a substantially lower density, a substantially higher electrical resistivity, a substantially lower thermal conductivity, a substantially lower mechanical lateral stiffness, a substantially higher efficiency of converting electrical energy powering the handpiece into motion of the distal end, a substantially lower acoustical impedance, a substantially higher Poisson's ratio, and a substantially higher mechanical gain.
    Type: Application
    Filed: April 20, 2015
    Publication date: October 20, 2016
    Inventors: Ala Moradian, Brian D. McCary, Toh Seng Goh, Matthew J. Fitzgerald