Abstract: Systems and methods according to one or more embodiments are provided for annealing a chalcogenide lens at an elevated temperature to accelerate release of internal stress within the chalcogenide lens caused during a molding process that formed the chalcogenide lens. In particular, the annealing process includes gradually heating the chalcogenide lens to a dwell temperature, maintaining the chalcogenide lens at the dwell temperature for a predetermined period of time, and gradually cooling the chalcogenide lens from the dwell temperature. The annealing process stabilizes the shape, the effective focal length, and/or the modulation transfer function of the chalcogenide lens. Associated optical assemblies and infrared imaging devices are also described.

Abstract: Various techniques are disclosed to provide for reducing undesired reflections in captured images. In one example, a system includes an optical element configured to pass radiation from a scene. The system also includes an imager configured to capture images in response to the scene radiation and reflect at least a portion of the scene radiation to the optical element. The optical element comprises a surface with a convex radius of curvature facing the imager and configured to receive and return the reflected radiation toward the imager in a distribution pattern to reduce a magnitude of the reflected radiation in the captured images. Additional methods, devices, and systems are also provided.

Abstract: Systems and methods according to one or more embodiments are provided for annealing a chalcogenide lens at an elevated temperature to accelerate release of internal stress within the chalcogenide lens caused during a molding process that formed the chalcogenide lens. In particular, the annealing process includes gradually heating the chalcogenide lens to a dwell temperature, maintaining the chalcogenide lens at the dwell temperature for a predetermined period of time, and gradually cooling the chalcogenide lens from the dwell temperature. The annealing process stabilizes the shape, the effective focal length, and/or the modulation transfer function of the chalcogenide lens. Associated optical assemblies and infrared imaging devices are also described.

Abstract: Aspect ratio modifying imaging systems and methods are provided. In one example, an infrared imaging device includes at least one lens element configured to transmit electromagnetic radiation associated with a portion of a scene. The portion has a first aspect ratio. The electromagnetic radiation includes mid-wave and/or long-wave infrared light. The at least one lens element has a freeform surface having no translational symmetry and no rotational symmetry. The infrared imaging device further includes a detector array configured to receive image data associated with the electromagnetic radiation from the at least one lens element and generate, based on the image data, an image. The image data has a second aspect ratio different from the first aspect ratio. Each of the first and second aspect ratios is a ratio of a size along a first direction and a size along a second direction orthogonal to the first direction.

Abstract: An optoelectronic device package includes an optoelectronic device having an active region on a first surface of a substrate, a bond pad area on the first surface that includes at least one contact pad electrically connected to the active region, and a cap having a first cap surface and a second cap surface, the first cap surface being secured to the first surface of the substrate, the cap covering the optoelectronic device. At least one of the cap and the substrate has an angled sidewall extending at an angle relative to an axis parallel to an optical path. The at least one contact pad is exposed by and adjacent to the angled sidewall. An electrical line extends from each of the at least one contact pad along the angled sidewall and to the second cap surface that does not overlap the active region.

Abstract: Systems and methods according to one or more embodiments are provided for annealing a chalcogenide lens at an elevated temperature to accelerate release of internal stress within the chalcogenide lens caused during a molding process that formed the chalcogenide lens. In particular, the annealing process includes gradually heating the chalcogenide lens to a dwell temperature, maintaining the chalcogenide lens at the dwell temperature for a predetermined period of time, and gradually cooling the chalcogenide lens from the dwell temperature. The annealing process stabilizes the shape, the effective focal length, and/or the modulation transfer function of the chalcogenide lens. Associated optical assemblies and infrared imaging devices are also described.

Abstract: A planar line generator including a first planar surface extending in a first direction, a second planar surface facing the first planar surface, and a beam splitter in front of the second planar surface, the beam splitter configured to output, from light incident thereon, an undeflected beam, a first beam deflected to a first side of the undeflected beam along the first direction, and a second beam deflected to a second side of the undeflected beam along the first direction, wherein the second planar surface includes a line diffuser configured to receive the undeflected beam, and first and second diffusers having a design different from the line diffuser, the first and second diffusers being configured to receive the first and second beams, respectively.

Abstract: An optoelectronic device package includes an optoelectronic device having an active region on a first surface of a substrate, a bond pad area on the first surface that includes at least one contact pad electrically connected to the active region, and a cap having a first cap surface and a second cap surface, the first cap surface being secured to the first surface of the substrate, the cap covering the optoelectronic device. At least one of the cap and the substrate has an angled sidewall extending at an angle relative to an axis parallel to an optical path. The at least one contact pad is exposed by and adjacent to the angled sidewall. An electrical line extends from each of the at least one contact pad along the angled sidewall and to the second cap surface that does not overlap the active region.

Abstract: A planar line generator including a first planar surface extending in a first direction, a second planar surface facing the first planar surface, and a beam splitter in front of the second planar surface, the beam splitter configured to output, from light incident thereon, an undeflected beam, a first beam deflected to a first side of the undeflected beam along the first direction, and a second beam deflected to a second side of the undeflected beam along the first direction, wherein the second planar surface includes a line diffuser configured to receive the undeflected beam, and first and second diffusers having a design different from the line diffuser, the first and second diffusers being configured to receive the first and second beams, respectively.

Abstract: A method for transmitting a signal in an optical system includes generating an optical signal along an optical axis for transmission through an optical element, positioning the optical element so that a surface discontinuity is positioned along the optical axis such that the optical signal defines a substantially radially symmetric intensity profile, and launching the optical signal into an input face of an optical fiber such that the intensity profile is substantially null proximate an optical axis associated with the optical fiber.

Abstract: A method for transmitting a signal in an optical system includes generating an optical signal along an optical axis for transmission through an optical element, positioning the optical element so that a surface discontinuity is positioned along the optical axis such that the optical signal defines a substantially radially symmetric intensity profile, and launching the optical signal into an input face of an optical fiber such that the intensity profile is substantially null proximate an optical axis associated with the optical fiber.

Abstract: A method for transmitting a signal in an optical system includes generating an optical signal along an optical axis for transmission through an optical element, positioning the optical element so that a surface discontinuity is positioned along the optical axis such that the optical signal defines a substantially radially symmetric intensity profile, and launching the optical signal into an input face of an optical fiber such that the intensity profile is substantially null proximate an optical axis associated with the optical fiber.

Abstract: A spectrometer for use with a desired wavelength range includes an array of filters. Each filter outputs at least two non-contiguous wavelength peaks within the desired wavelength range. The array of filters is spectrally diverse over the desired wavelength range, and each filter in the array of filters outputs a spectrum of a first resolution. An array of detectors has a detector for receiving an output of a corresponding filter. A processor receives signals from each detector, and outputs a reconstructed spectrum having a second resolution, the second resolution being higher than any of the first resolution of each filter. Filters and detectors may be arranged into a plurality of imaging units, each imaging unit including first and second filters and first and second photosensing regions. A processor receives signals from each imaging unit, and generates a reconstructed spatial image comprised of discrete spatial units corresponding to each imaging unit.

Abstract: An assembly for an image capturing device may include a blade configured to pass light without modification when in a first position and, when in a second position, provide one of an aperture blocking a portion of the light, a low power lens, and a transparent film, and an actuator configured to move the blade between the first and second positions.

Abstract: An optical chassis includes a mount substrate an optoelectronic device on the mount substrate, a spacer substrate, and a sealer substrate. The mount substrate, the spacer substrate and the sealer substrate are vertically stacked and hermetically sealing the optoelectronic device. An external electrical contact for the optoelectronic device is provided outside the sealing. At least part of the optical chassis may be made on a wafer level. A passive optical element may be provided on the sealer substrate or on another substrate stacked and secured thereto.

Abstract: A device having an optical system including first and second substrates, a first optical element on a first surface of the first substrate, and a second optical element on a second surface of the second substrate, the first and second surfaces being parallel and the first and second optical elements being substantially centered along an optical axis of the optical system, and an active element positioned in optical communication with the optical system, wherein an imaging function of the optical system is distributed over at least the first and second optical elements.

Abstract: An integrated optical imaging system includes a first substrate having first and second opposing surfaces, a second substrate having third and fourth opposing surfaces, a spacer between a substantially planar portion of the third surface of the second substrate and a substantially planar portion of the second surface of the first substrate, at least two of the spacer, the first substrate and the second substrate sealing an interior space between the third surface of the second substrate and the second surface of the first substrate, and an optical imaging system having n surfaces, where n is greater than or equal to two, at least two of the n surfaces of the optical imaging system are on respective ones of the first, second, third and fourth surfaces.

Abstract: A method for transmitting a signal in an optical system includes generating an optical signal along an optical axis for transmission through an optical element, positioning the optical element so that a surface discontinuity is positioned along the optical axis such that the optical signal defines a substantially radially symmetric intensity profile, and launching the optical signal into an input face of an optical fiber such that the intensity profile is substantially null proximate an optical axis associated with the optical fiber.

Abstract: An integrated micro-optical system includes at least two wafers with at least two optical elements provided on respective surfaces of the at least two wafers, at least one of the two optical elements being a spherical lens. The resulting optical system presents a high numerical aperture. One of the optical elements may be a refractive element formed in a material having a high index of refraction.