Abstract: A drill head borer is configured to be attached to a rotary auger including a helical blade. The borer includes at least one wing extending radially away from a body centered about a longitudinal axis. An aligning ledge is formed in the drill head borer configured to self-align the drill head borer with the helical blade without the need for substantial measurement by a user. The borer further includes a plurality of teeth arranged in a convex configuration, along the wing when viewed from above. When viewed from the side, the teeth are angled at a lifting pitch angle.

Abstract: A drill head borer is configured to be attached to a rotary auger including a helical blade. The borer includes at least one wing extending radially away from a body centered about a longitudinal axis. An aligning ledge is formed in the drill head borer configured to self-align the drill head borer with the helical blade without the need for substantial measurement by a user. The borer further includes a plurality of teeth arranged in a convex configuration, along the wing when viewed from above. When viewed from the side, the teeth are angled at a lifting pitch angle.

Abstract: Nonionic derivatized starch of varying degrees of substitution may be used as a fluid loss additive for well bore cementing operations. A well bore cementing composition may include a cement and a nonionic derivatized starch, the nonionic derivatized starch in a concentration in the cement to provide a fluid loss of less than 200 cc/30 min. A method for cementing subterranean zones penetrated by a well bore may include: providing a cement slurry including mix water, hydraulic cement and a nonionic derivatized starch as an additive for fluid loss control in well cementing applications; pumping the cement slurry into a well; and holding the cement slurry in place until it sets.

Abstract: An improved circuit board structure and method of forming the same are provided. The circuit board includes an insulating core and has plated through holes connecting the circuitry on both sides and intermediate layers of the core. A permanent dielectric material is applied on at least one surface of the board covering the circuitry and plated through holes. Vias are formed through the dielectric material and signal lines are formed on the top of the dielectric material connected to the circuitry onto the board through the vias. Additional layers of dielectric material with additional wiring and vias can also be formed for multi-level wiring.

Abstract: An electronic package including a first circuitized substrate (e.g., printed circuit board) a second, flexible circuitized substrate (e.g., polyimide), an electronic device (semiconductor chip) and a metallic (e.g., aluminum) heat sink member joined to the first substrate to provide a cover for the package's internal components. A predetermined quantity of liquid material (e.g. wax or oil) is located between a defined surface of the chip and a corresponding internal surface of the heat sink member during assembly of the package, this material possessing a surface tension sufficient to create a suction force between the device and heat sink so as to elevate the device in a spaced position from (e.g., above) the first circuitized substrate during said assembly. Should a liquid material such as oil be utilized, this material remains in the liquid state during package operation to continuously provide the defined suction force sufficient to maintain the device at the elevated position.

Abstract: An improved circuit board structure and method of forming the same are provided. The circuit board includes an insulating core and has plated through holes connecting the circuitry on both sides and intermediate layers of the core. A permanent dielectric material is applied on at least one surface of the board covering the circuitry and plated through holes. Vias are formed through the dielectric material and signal lines are formed on the top of the dielectric material connected to the circuitry onto the board through the vias. Additional layers of dielectric material with additional wiring and vias can also be formed for multi-level wiring.

Abstract: A display system having a scanned CRT provides a full screen layout of alphanumeric characters and at least one additional screen layout, e.g. a split screen layout.A refresh buffer stores data to be displayed in a first sequence of addresses so that when this data is read out by address generator in the first sequence a full screen layout results. A read only translation store may be selectively addressed by the first sequence of addresses to provide a modified sequence of translated addresses. When the refresh buffer is addressed by the sequence of translated addresses, a split screen layout of the data results. A selector is operable to address the refresh buffer with either the first sequence of addresses or the sequence of translated addresses.Logic inhibits character display in a blank area between the two halves of the split screen. Attribute decode logic enables different attributes to control screen halves during split screen operation.