Patents by Inventor Alan Y Arai

Alan Y Arai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10137527
    Abstract: In certain embodiments a method and system for laser-based material processing of a material is disclosed. In at least one preferred implementation temporally overlapping pulse series are generated with separate pulsed laser sources, for example nanosecond (NS) and ultrashort pulse (USP) sources (NS-USP). Pulses are delivered to the material as a series of spatially and temporally overlapping pulse pairs. The material can, but need not, be a transparent material. In some applications of transparent material processing, it was found the combination of pulses both substantially more material modification and high machining quality than obtainable with either individual pulse series taken alone. Other micromachining methods and arrangement are disclosed for formation of fine features on or within a substrate. Such methods and arrangements may generally be applied with a NS-USP combination, or with other sources.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: November 27, 2018
    Assignee: IMRA America, Inc.
    Inventors: Michiharu Ota, Alan Y. Arai, Zhenlin Liu
  • Publication number: 20170326688
    Abstract: The present disclosure provides examples of a laser-based material processing system for liquid-assisted, ultrashort pulse (USP) laser micromachining An example material processing application includes drilling thru-holes or blind holes in a nearly transparent glass workpiece (substrate) using parallel processing with an n×m array of focused laser beams. Methods and systems are disclosed herein which provide for formation of high aspect ratio holes with low taper in fine pitch arrangements.
    Type: Application
    Filed: July 25, 2017
    Publication date: November 16, 2017
    Inventors: Mark Turner, Alan Y. Arai, Michiharu Ota
  • Patent number: 9751154
    Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: September 5, 2017
    Assignee: IMRA AMERICA, INC.
    Inventors: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino
  • Publication number: 20170190000
    Abstract: A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.
    Type: Application
    Filed: March 22, 2017
    Publication date: July 6, 2017
    Applicant: IMRA AMERICA, INC.
    Inventors: James BOVATSEK, Alan Y. ARAI, Fumiyo YOSHINO
  • Patent number: 9636773
    Abstract: A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.
    Type: Grant
    Filed: February 13, 2013
    Date of Patent: May 2, 2017
    Assignee: IMRA AMERICA, INC.
    Inventors: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino
  • Publication number: 20160318122
    Abstract: In certain embodiments a method and system for laser-based material processing of a material is disclosed. In at least one preferred implementation temporally overlapping pulse series are generated with separate pulsed laser sources, for example nanosecond (NS) and ultrashort pulse (USP) sources (NS-USP). Pulses are delivered to the material as a series of spatially and temporally overlapping pulse pairs. The material can, but need not, be a transparent material. In some applications of transparent material processing, it was found the combination of pulses both substantially more material modification and high machining quality than obtainable with either individual pulse series taken alone. Other micromachining methods and arrangement are disclosed for formation of fine features on or within a substrate. Such methods and arrangements may generally be applied with a NS-USP combination, or with other sources.
    Type: Application
    Filed: July 12, 2016
    Publication date: November 3, 2016
    Inventors: Michiharu Ota, Alan Y. Arai, Zhenlin Liu
  • Patent number: 9333900
    Abstract: A display apparatus generates a high visibility optical signal, such as an ICON, the ICON comprising a symbol, shape, or other image-like representation. The ICON becomes visible at an observation point during an illumination ON-state. The ICON may be formed as a portion of display medium, for example as a machined portion of a mirror capable of forming images of a scene by reflection in normal operation. The visibility of the ICON in the illumination OFF-state from an observation point is sufficiently low such that the normal operation of the display medium is maintained. The display apparatus may be used in a blind spot warning system for a vehicle. Visible wavelength LEDs, RGB LEDs and/or diode lasers may be utilized as an illumination source.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: May 10, 2016
    Assignee: IMRA AMERICA, INC.
    Inventor: Alan Y. Arai
  • Publication number: 20160067822
    Abstract: Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating.
    Type: Application
    Filed: August 13, 2015
    Publication date: March 10, 2016
    Applicant: IMRA AMERICA, INC.
    Inventors: Alan Y. ARAI, Gyu C. CHO, Jingzhou XU, Fumiyo YOSHINO, Haibin ZHANG, James BOVATSEK, Makoto YOSHIDA
  • Patent number: 9147989
    Abstract: A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.
    Type: Grant
    Filed: December 9, 2013
    Date of Patent: September 29, 2015
    Assignee: IMRA AMERICA, INC.
    Inventors: Lawrence Shah, James M. Bovatsek, Alan Y. Arai, Tadashi Yamamoto, Rajesh S. Patel, Donald J. Harter
  • Patent number: 9138913
    Abstract: Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are presented, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create multiple scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces different types of sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination through either light scattering or light reflection and nearly invisible without illumination. Transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: September 22, 2015
    Assignee: IMRA AMERICA, INC.
    Inventors: Alan Y. Arai, Gyu C. Cho, Jingzhou Xu, Fumiyo Yoshino, Haibin Zhang, James Bovatsek, Makoto Yoshida
  • Publication number: 20150136744
    Abstract: Examples of methods and systems for laser processing of materials are disclosed. Methods and systems for singulation of a wafer comprising a coated substrate can utilize a laser outputting light that has a wavelength that is transparent to the wafer substrate but which may not be transparent to the coating layer(s). Using techniques for managing fluence and focal condition of the laser beam, the coating layer(s) and the substrate material can be processed through ablation and internal modification, respectively. The internal modification can result in die separation.
    Type: Application
    Filed: January 28, 2015
    Publication date: May 21, 2015
    Inventors: Alan Y. Arai, Gyu Cheon Cho, Jingzhou Xu
  • Patent number: 8969220
    Abstract: Examples of methods and systems for laser processing of materials are disclosed. Methods and systems for singulation of a wafer comprising a coated substrate can utilize a laser outputting light that has a wavelength that is transparent to the wafer substrate but which may not be transparent to the coating layer(s). Using techniques for managing fluence and focal condition of the laser beam, the coating layer(s) and the substrate material can be processed through ablation and internal modification, respectively. The internal modification can result in die separation.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: March 3, 2015
    Assignee: IMRA America, Inc.
    Inventors: Alan Y. Arai, Gyu Cheon Cho, Jingzhou Xu
  • Publication number: 20140092927
    Abstract: A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.
    Type: Application
    Filed: December 9, 2013
    Publication date: April 3, 2014
    Applicant: IMRA AMERICA, INC.
    Inventors: Lawrence Shah, James M. Bovatsek, Alan Y. Arai, Tadashi Yamamoto, Rajesh S. Patel, Donald J. Harter
  • Patent number: 8644356
    Abstract: A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: February 4, 2014
    Assignee: Imra America, Inc.
    Inventors: Lawrence Shah, James M. Bovatsek, Alan Y. Arai, Tadashi Yamamoto, Rajesh S. Patel, Donald J. Harter
  • Publication number: 20140004318
    Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.
    Type: Application
    Filed: August 26, 2013
    Publication date: January 2, 2014
    Applicant: IMRA AMERICA, INC.
    Inventors: James BOVATSEK, Alan Y. Arai, Fumiyo Yoshino
  • Patent number: 8530786
    Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: September 10, 2013
    Assignee: IMRA America, Inc.
    Inventors: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino
  • Patent number: 8389891
    Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: March 5, 2013
    Assignee: IMRA America, Inc.
    Inventors: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino
  • Publication number: 20130003065
    Abstract: A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.
    Type: Application
    Filed: September 12, 2012
    Publication date: January 3, 2013
    Applicant: IMRA AMERICA, INC.
    Inventors: Lawrence SHAH, James M. BOVATSEK, Alan Y. ARAI, Tadashi YAMAMOTO, Rajesh S. PATEL, Donald J. HARTER
  • Patent number: 8314359
    Abstract: Methods and systems for ultrashort pulse laser processing of optically transparent materials are disclosed. At least one embodiment includes a method for welding materials with ultrashort laser pulses to create a bond through localized heating, at least one material being transparent at a laser wavelength. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating sufficiently high fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines. In various implementations the laser is focused near the sub-surface interface between two materials, generating high fluence at the region proximate to the laser focus with minimal modification to the surrounding region, including areas above and below the laser beam waist.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: November 20, 2012
    Assignee: IMRA America, Inc.
    Inventors: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino
  • Patent number: 8279903
    Abstract: A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: October 2, 2012
    Assignee: Imra America, Inc.
    Inventors: Lawrence Shah, James M. Bovatsek, Alan Y. Arai, Tadashi Yamamoto, Rajesh S. Patel, Donald J. Harter