Abstract: A carrier for supporting a substrate during processing by a meniscus fowled by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening. The opening is slightly larger than the substrate such that a gap exists between the substrate and the opening. Means for reducing a size and frequency of entrance and/or exit marks on substrates is provided, the means aiding and encouraging liquid from the meniscus to evacuate the gap. A method for reducing the size and frequency of entrance and exit marks is also provided.

Abstract: A carrier for supporting a substrate during processing by a meniscus fowled by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening. The opening is slightly larger than the substrate such that a gap exists between the substrate and the opening Means for reducing a size and frequency of entrance and/or exit marks on substrates is provided, the means aiding and encouraging liquid from the meniscus to evacuate the gap. A method for reducing the size and frequency of entrance and exit marks is also provided.

Abstract: A carrier for supporting a substrate during processing by a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening. The opening is slightly larger than the substrate such that a gap exists between the substrate and the opening. Means for reducing a size and frequency of entrance and/or exit marks on substrates is provided, the means aiding and encouraging liquid from the meniscus to evacuate the gap. A method for reducing the size and frequency of entrance and exit marks is also provided.

Abstract: A carrier for supporting a substrate during processing by a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening. The opening is slightly larger than the substrate such that a gap exists between the substrate and the opening. Means for reducing a size and frequency of entrance and/or exit marks on substrates is provided, the means aiding and encouraging liquid from the meniscus to evacuate the gap. A method for reducing the size and frequency of entrance and exit marks is also provided.

Abstract: A carrier for supporting a substrate during processing by a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening. The opening is slightly larger than the substrate such that a gap exists between the substrate and the opening. Means for reducing a size and frequency of entrance and/or exit marks on substrates is provided, the means aiding and encouraging liquid from the meniscus to evacuate the gap. A method for reducing the size and frequency of entrance and exit marks is also provided.

Abstract: A carrier for supporting a substrate during processing by a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening. The opening is slightly larger than the substrate such that a gap exists between the substrate and the opening. Means for reducing a size and frequency of entrance and/or exit marks on substrates is provided, the means aiding and encouraging liquid from the meniscus to evacuate the gap. A method for reducing the size and frequency of entrance and exit marks is also provided.

Abstract: A cylindrical two-dimensional diode-laser assembly includes fractionally-cylindrical dielectric segments bonded in a circular aperture in a metal heat-sink. Diode laser bars are located in gaps between the segments with light from the diode-lasers directed inwardly. The segments are made by cutting slots in one end of a tube of the dielectric material with the width of the slots corresponding to the width of the gaps and the part of the tube between slots providing the segments. The slotted tube is metallized and the slotted end of the tube is inserted into the heat-sink aperture with an unslotted part of the tube outside the aperture. The slotted part of the tube is bonded in the aperture and the unslotted part of the tube separated from the slotted part leaving the segments bonded in the aperture.

Abstract: A cylindrical two-dimensional diode-laser assembly includes fractionally-cylindrical dielectric segments bonded in a circular aperture in a metal heat-sink. Diode laser bars are located in gaps between the segments with light from the diode-lasers directed inwardly. The segments are made by cutting slots in one end of a tube of the dielectric material with the width of the slots corresponding to the width of the gaps and the part of the tube between slots providing the segments. The slotted tube is metallized and the slotted end of the tube is inserted into the heat-sink aperture with an unslotted part of the tube outside the aperture. The slotted part of the tube is bonded in the aperture and the unslotted part of the tube separated from the slotted part leaving the segments bonded in the aperture.