Patents by Inventor Alexander Arthur HIGH

Alexander Arthur HIGH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11815668
    Abstract: A method of fabricating a visible spectrum optical component includes: providing a substrate; forming a resist layer over a surface of the substrate; patterning the resist layer to form a patterned resist layer defining openings exposing portions of the surface of the substrate; performing deposition to form a dielectric film over the patterned resist layer and over the exposed portions of the surface of the substrate, wherein a top surface of the dielectric film is above a top surface of the patterned resist layer; removing a top portion of the dielectric film to expose the top surface of the patterned resist layer and top surfaces of dielectric units within the openings of the patterned resist layer; and removing the patterned resist layer to retain the dielectric units over the substrate.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: November 14, 2023
    Assignees: PRESIDENT AND FELLOWS OF HARVARD COLLEGE, THE CHARLES STARK DRAPER LABORATORY, INC.
    Inventors: Robert C. Devlin, Mohammadreza Khorasaninejad, Federico Capasso, Hongkun Park, Alexander Arthur High
  • Publication number: 20220283411
    Abstract: A method of fabricating a visible spectrum optical component includes: providing a substrate; forming a resist layer over a surface of the substrate; patterning the resist layer to form a patterned resist layer defining openings exposing portions of the surface of the substrate; performing deposition to form a dielectric film over the patterned resist layer and over the exposed portions of the surface of the substrate, wherein a top surface of the dielectric film is above a top surface of the patterned resist layer; removing a top portion of the dielectric film to expose the top surface of the patterned resist layer and top surfaces of dielectric units within the openings of the patterned resist layer; and removing the patterned resist layer to retain the dielectric units over the substrate.
    Type: Application
    Filed: May 25, 2022
    Publication date: September 8, 2022
    Applicant: PRESIDENT AND FELLOWS OF HARVARD COLLEGE
    Inventors: Robert C. DEVLIN, Mohammadreza KHORASANINEJAD, Federico CAPASSO, Hongkun PARK, Alexander Arthur HIGH
  • Patent number: 11366296
    Abstract: A method of fabricating a visible spectrum optical component includes: providing a substrate; forming a resist layer over a surface of the substrate; patterning the resist layer to form a patterned resist layer defining openings exposing portions of the surface of the substrate; performing deposition to form a dielectric film over the patterned resist layer and over the exposed portions of the surface of the substrate, wherein a top surface of the dielectric film is above a top surface of the patterned resist layer; removing a top portion of the dielectric film to expose the top surface of the patterned resist layer and top surfaces of dielectric units within the openings of the patterned resist layer; and removing the patterned resist layer to retain the dielectric units over the substrate.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: June 21, 2022
    Assignees: PRESIDENT AND FELLOWS OF HARVARD COLLEGE, THE CHARLES STARK DRAPER LABORATORY, INC.
    Inventors: Robert C. Devlin, Mohammadreza Khorasaninejad, Federico Capasso, Hongkun Park, Alexander Arthur High
  • Publication number: 20180341090
    Abstract: A method of fabricating a visible spectrum optical component includes: providing a substrate; forming a resist layer over a surface of the substrate; patterning the resist layer to form a patterned resist layer defining openings exposing portions of the surface of the substrate; performing deposition to form a dielectric film over the patterned resist layer and over the exposed portions of the surface of the substrate, wherein a top surface of the dielectric film is above a top surface of the patterned resist layer; removing a top portion of the dielectric film to expose the top surface of the patterned resist layer and top surfaces of dielectric units within the openings of the patterned resist layer; and removing the patterned resist layer to retain the dielectric units over the substrate.
    Type: Application
    Filed: November 23, 2016
    Publication date: November 29, 2018
    Applicant: PRESIDENT AND FELLOWS OF HARVARD COLLEGE
    Inventors: Robert C. DEVLIN, Mohammadreza KHORASANINEJAD, Federico CAPASSO, Hongkun PARK, Alexander Arthur HIGH