Patents by Inventor Alexander B. Lostetter
Alexander B. Lostetter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10784235Abstract: A power module includes a case, a first terminal, a second terminal, and a number of silicon carbide semiconductor die. The case has a footprint less than 30 cm2. The silicon carbide semiconductor die are inside the case and coupled between the first terminal and the second terminal. The power module and the silicon carbide semiconductor die are configured such that in a first operating state the silicon carbide semiconductor die are capable of continuously blocking voltages greater than 650V between the first terminal and the second terminal, and in a second operating state the silicon carbide semiconductor die are capable of continuously passing currents greater than 200 A between the first terminal and the second terminal.Type: GrantFiled: January 30, 2018Date of Patent: September 22, 2020Assignee: Cree Fayetteville, Inc.Inventors: Brice McPherson, Sayan Seal, Zachary Cole, Jennifer Stabach, Brandon Passmore, Ty McNutt, Alexander B. Lostetter
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Publication number: 20190237439Abstract: A power module includes a case, a first terminal, a second terminal, and a number of silicon carbide semiconductor die. The case has a footprint less than 30 cm2. The silicon carbide semiconductor die are inside the case and coupled between the first terminal and the second terminal. The power module and the silicon carbide semiconductor die are configured such that in a first operating state the silicon carbide semiconductor die are capable of continuously blocking voltages greater than 650V between the first terminal and the second terminal, and in a second operating state the silicon carbide semiconductor die are capable of continuously passing currents greater than 200 A between the first terminal and the second terminal.Type: ApplicationFiled: January 30, 2018Publication date: August 1, 2019Inventors: Brice McPherson, Sayan Seal, Zachary Cole, Jennifer Stabach, Brandon Passmore, Ty McNutt, Alexander B. Lostetter
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Patent number: 8629783Abstract: In a telemetry system for use in an engine, a circuit structure (34) affixed to a moving part (20) of the engine is disposed for amplifying information sensed about a condition of the part and transmitting the sensed information to a receiver external to the engine. The circuit structure is adapted for the high temperature environment of the engine and includes a differential amplifier (102, 111) having an input for receiving a signal from a sensor (101, 110) disposed on the part. A voltage controlled oscillator (104, 115) with an input coupled to the output of the amplifier produces an oscillatory signal having a frequency representative of the sensed condition. A buffer (105, 116) with an input coupled to the output of the oscillator buffers the oscillatory signal, which is then coupled to an antenna (26) for transmitting the information to the receiver.Type: GrantFiled: June 19, 2012Date of Patent: January 14, 2014Assignees: Siemens Energy, Inc., Arkansas Power Electronics International, Inc.Inventors: David J. Mitchell, Anand A. Kulkarni, Ramesh Subramanian, Edward R. Roesch, Rod Waits, Roberto Schupbach, John R. Fraley, Alexander B. Lostetter, Brice McPherson, Bryon Western
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Patent number: 8525036Abstract: A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.Type: GrantFiled: September 19, 2011Date of Patent: September 3, 2013Assignee: Siemens Energy, Inc.Inventors: David J. Mitchell, Anand A. Kulkarni, Ramesh Subramanian, Edward R. Roesch, Rod Waits, Roberto Schupbach, John R. Fraley, Alexander B. Lostetter, Brice McPherson, Bryon Western
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Patent number: 8519866Abstract: A telemetry system for use in a combustion turbine engine (10) having a compressor (12), a combustor and a turbine (16) that includes a sensor (50, 74) in connection with a turbine blade (18) or vane (22). A telemetry transmitter circuit (210) may be affixed to the turbine blade (18) with a first connecting material (52, 152) deposited on the turbine blade (18) for routing electronic data signals from the sensor (50, 74) to the telemetry transmitter circuit (210), the electronic data signals indicative of a condition of the turbine blade (18). An induction power system for powering the telemetry transmitter circuit (210) may include a rotating data antenna (202) affixed to the turbine blade (18) with a second connecting material (140) deposited on the turbine blade (18) for routing electronic data signals from the telemetry transmitter circuit (210) to the rotating data antenna (202).Type: GrantFiled: November 8, 2007Date of Patent: August 27, 2013Assignee: Siemens Energy, Inc.Inventors: David J. Mitchell, Anand A. Kulkarni, Ramesh Subramanian, Edward R. Roesch, Rod Waits, John R. Fraley, Roberto M. Schupbach, Alexander B. Lostetter
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Patent number: 8458899Abstract: A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.Type: GrantFiled: September 19, 2011Date of Patent: June 11, 2013Assignee: Siemens Energy, Inc.Inventors: David J. Mitchell, Anand A. Kulkarni, Ramesh Subramanian, Edward R. Roesch, Rod Waits, Roberto Schupbach, John R. Fraley, Alexander B. Lostetter, Brice McPherson, Bryon Western
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Patent number: 8410600Abstract: Provided are a semiconductor device and a method of fabricating the semiconductor device, the semiconductor device including: a source trace, a drain trace, and a gate trace placed on a substrate; a transistor which is placed on the drain trace and includes a source pad and a gate pad; insulating films placed between the drain and source traces and between the drain and gate traces on the substrate so as to cover sidewall surfaces of the transistor; a source spray electrode which is placed on the insulating film between the source and drain traces and connects the source pad of the transistor and the source trace; and a gate spray electrode placed on the insulating film between the gate and drain traces and connects the gate pad of the transistor and the gate trace.Type: GrantFiled: September 7, 2010Date of Patent: April 2, 2013Assignees: Arkansas Power Electronics International, Inc., Rohm Co., Ltd.Inventors: Alexander B. Lostetter, Jared Hornberger, Takukazu Otsuka
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Publication number: 20120256761Abstract: In a telemetry system for use in an engine, a circuit structure (34) affixed to a moving part (20) of the engine is disposed for amplifying information sensed about a condition of the part and transmitting the sensed information to a receiver external to the engine. The circuit structure is adapted for the high temperature environment of the engine and includes a differential amplifier (102, 111) having an input for receiving a signal from a sensor (101, 110) disposed on the part. A voltage controlled oscillator (104, 115) with an input coupled to the output of the amplifier produces an oscillatory signal having a frequency representative of the sensed condition. A buffer (105, 116) with an input coupled to the output of the oscillator buffers the oscillatory signal, which is then coupled to an antenna (26) for transmitting the information to the receiver.Type: ApplicationFiled: June 19, 2012Publication date: October 11, 2012Inventors: DAVID J. MITCHELL, Anand A. Kulkarni, Ramesh Subramanian, Edward R. Roesch, Rod Waits, Roberto Schupbach, John R. Fraley, Alexander B. Lostetter, Brice Mcpherson, Bryon Westen
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Patent number: 8220990Abstract: A circuit assembly (34) affixed to a moving part (20) of a turbine for receiving information about a condition of the part and transmitting this information external to the engine. The circuit assembly includes a high-temperature resistant package (34A) that attaches to the part. A high temperature resistant PC board (42) supports both active and passive components of the circuit, wherein a first group of the passive components are fabricated with zero temperature coefficient of resistance and a second group of the passive components are fabricated with a positive temperature coefficient of resistance. The active components are fabricated with high temperature metallization. Connectors (40) attached to the PC board pass through a wall of the package (34A) for communication with sensors (30) on the part and with an antenna (26) for transmitting data about the condition of the part to outside the turbine.Type: GrantFiled: August 15, 2008Date of Patent: July 17, 2012Assignees: Siemens Energy, Inc., Arkansas Power Electronics International, Inc.Inventors: David J. Mitchell, Anand A. Kulkarni, Ramesh Subramanian, Edward R. Roesch, Rod Waits, Roberto Schupbach, John R. Fraley, Alexander B. Lostetter, Brice McPherson, Bryon Western
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Patent number: 8223036Abstract: In a telemetry system for use in an engine, a circuit structure (34) affixed to a moving part (20) of the engine is disposed for amplifying information sensed about a condition of the part and transmitting the sensed information to a receiver external to the engine. The circuit structure is adapted for the high temperature environment of the engine and includes a differential amplifier (102, 111) having an input for receiving a signal from a sensor (101, 110) disposed on the part. A voltage controlled oscillator (104, 115) with an input coupled to the output of the amplifier produces an oscillatory signal having a frequency representative of the sensed condition. A buffer (105, 116) with an input coupled to the output of the oscillator buffers the oscillatory signal, which is then coupled to an antenna (26) for transmitting the information to the receiver.Type: GrantFiled: August 15, 2008Date of Patent: July 17, 2012Assignees: Siemens Energy, Inc., Arkansas Power Electronics International, Inc.Inventors: David J. Mitchell, Anand A. Kulkarni, Ramesh Subramanian, Edward R. Roesch, Rod Waits, Roberto Schupbach, John R. Fraley, Alexander B. Lostetter, Brice McPherson, Bryon Western
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Publication number: 20120005891Abstract: A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.Type: ApplicationFiled: September 19, 2011Publication date: January 12, 2012Inventors: David J. Mitchell, Anand A. Kulkarni, Ramesh Subramanian, Edward R. Roesch, Rod Waits, Roberto Schupbach, John R. Fraley, Alexander B. Lostetter, Brice McPherson, Bryon Western
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Patent number: 8092080Abstract: A circuit affixed to a moving part of an engine for sensing and processing the temperature of the part. The circuit generates a signal representative of the temperature sensed by a thermocouple (110) and amplified by an amplifier (112). A square wave oscillator (113) with a temperature sensitive capacitor (C8) varies its frequency in response to changes of a local temperature of the circuit. A chopper (114, J27) converts the output of the amplifier into an alternating current signal. The chopper is gated by the square wave oscillator and a second input is coupled to an output of the amplifier. Thus, the chopper has an output signal having a frequency representative of the local temperature and an amplitude representative of the thermocouple temperature, whereby the combined signals represent the true temperature of the part.Type: GrantFiled: August 15, 2008Date of Patent: January 10, 2012Assignee: Siemens Energy, Inc.Inventors: David J. Mitchell, Anand A. Kulkarni, Ramesh Subramanian, Edward R. Roesch, Rod Waits, Roberto Schupbach, John R. Fraley, Alexander B. Lostetter, Brice McPherson, Bryon Western
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Patent number: 8023269Abstract: A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.Type: GrantFiled: August 15, 2008Date of Patent: September 20, 2011Assignees: Siemens Energy, Inc., Arkansas Power Electronics International, Inc.Inventors: David J. Mitchell, Anand A. Kulkarni, Ramesh Subramanian, Edward R. Roesch, Rod Waits, Roberto Schupbach, John R. Fraley, Alexander B. Lostetter, Brice McPherson, Bryon Western
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Publication number: 20110079792Abstract: Provided are a semiconductor device and a method of fabricating the semiconductor device, the semiconductor device including: a source trace, a drain trace, and a gate trace placed on a substrate; a transistor which is placed on the drain trace and includes a source pad and a gate pad; insulating films placed between the drain and source traces and between the drain and gate traces on the substrate so as to cover sidewall surfaces of the transistor; a source spray electrode which is placed on the insulating film between the source and drain traces and connects the source pad of the transistor and the source trace; and a gate spray electrode placed on the insulating film between the gate and drain traces and connects the gate pad of the transistor and the gate trace.Type: ApplicationFiled: September 7, 2010Publication date: April 7, 2011Applicants: ARKANSAS POWER ELECTRONICS INTERNATIONAL, INC., ROHM CO., LTD.Inventors: Alexander B. Lostetter, Jared Hornberger, Takukazu Otsuka
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Publication number: 20100039290Abstract: In a telemetry system for use in an engine, a circuit structure (34) affixed to a moving part (20) of the engine is disposed for amplifying information sensed about a condition of the part and transmitting the sensed information to a receiver external to the engine. The circuit structure is adapted for the high temperature environment of the engine and includes a differential amplifier (102, 111) having an input for receiving a signal from a sensor (101, 110) disposed on the part. A voltage controlled oscillator (104, 115) with an input coupled to the output of the amplifier produces an oscillatory signal having a frequency representative of the sensed condition. A buffer (105, 116) with an input coupled to the output of the oscillator buffers the oscillatory signal, which is then coupled to an antenna (26) for transmitting the information to the receiver.Type: ApplicationFiled: August 15, 2008Publication date: February 18, 2010Applicants: Siemens Power Generation, Inc., Arkansas Power Electronics International, Inc.Inventors: DAVID J. MITCHELL, ANAND A. KULKARNI, RAMESH SUBRAMANIAN, EDWARD R. ROESCH, ROD WAITS, ROBERTO SCHUPBACH, JOHN R. FRALEY, ALEXANDER B. LOSTETTER, BRICE MCPHERSON, BRYON WESTERN
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Publication number: 20100039288Abstract: A circuit affixed to a moving part of an engine for sensing and processing the temperature of the part. The circuit generates a signal representative of the temperature sensed by a thermocouple (110) and amplified by an amplifier (112). A square wave oscillator (113) with a temperature sensitive capacitor (C8) varies its frequency in response to changes of a local temperature of the circuit. A chopper (114, J27) converts the output of the amplifier into an alternating current signal. The chopper is gated by the square wave oscillator and a second input is coupled to an output of the amplifier. Thus, the chopper has an output signal having a frequency representative of the local temperature and an amplitude representative of the thermocouple temperature, whereby the combined signals represent the true temperature of the part.Type: ApplicationFiled: August 15, 2008Publication date: February 18, 2010Applicants: Siemens Power Generation, Inc., Arkansas Power Electronics International, Inc.Inventors: DAVID J. MITCHELL, ANAND A. KULKARNI, RAMESH SUBRAMANIAN, EDWARD R. ROESCH, ROD WAITS, ROBERTO SCHUPBACH, JOHN R. FRALEY, ALEXANDER B. LOSTETTER, BRICE MCPHERSON, BRYON WESTERN
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Publication number: 20100039779Abstract: A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.Type: ApplicationFiled: August 15, 2008Publication date: February 18, 2010Applicants: Siemens Power Generation, Inc., Arkansas Power Electronics International, Inc.Inventors: DAVID J. MITCHELL, ANAND A. KULKARNI, RAMESH SUBRAMANIAN, EDWARD R. ROESCH, ROD WAITS, ROBERTO SCHUPBACH, JOHN R. FRALEY, ALEXANDER B. LOSTETTER, BRICE MCPHERSON, BRYON WESTERN
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Publication number: 20100039289Abstract: A circuit assembly (34) affixed to a moving part (20) of a turbine for receiving information about a condition of the part and transmitting this information external to the engine. The circuit assembly includes a high-temperature resistant package (34A) that attaches to the part. A high temperature resistant PC board (42) supports both active and passive components of the circuit, wherein a first group of the passive components are fabricated with zero temperature coefficient of resistance and a second group of the passive components are fabricated with a positive temperature coefficient of resistance. The active components are fabricated with high temperature metallization. Connectors (40) attached to the PC board pass through a wall of the package (34A) for communication with sensors (30) on the part and with an antenna (26) for transmitting data about the condition of the part to outside the turbine.Type: ApplicationFiled: August 15, 2008Publication date: February 18, 2010Applicants: Siemens Power Generation, Inc., Arkansas Power Electronics International, Inc.Inventors: David J. Mitchell, Anand A. Kulkarni, Ramesh Subramanian, Edward R. Roesch, Rod Waits, Roberto Schupbach, John R. Fraley, Alexander B. Lostetter, Brice McPherson, Bryon Western
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Publication number: 20090121896Abstract: A telemetry system for use in a combustion turbine engine (10) having a compressor (12), a combustor and a turbine (16) that includes a sensor (50, 74) in connection with a turbine blade (18) or vane (22). A telemetry transmitter circuit (210) may be affixed to the turbine blade (18) with a first connecting material (52, 152) deposited on the turbine blade (18) for routing electronic data signals from the sensor (50, 74) to the telemetry transmitter circuit (210), the electronic data signals indicative of a condition of the turbine blade (18). An induction power system for powering the telemetry transmitter circuit (210) may include a rotating data antenna (202) affixed to the turbine blade (18) with a second connecting material (140) deposited on the turbine blade (18) for routing electronic data signals from the telemetry transmitter circuit (210) to the rotating data antenna (202).Type: ApplicationFiled: November 8, 2007Publication date: May 14, 2009Applicants: SIEMENS POWER GENERATION, INC., ARKANSAS POWER ELECTRONICS INTERNATIONAL, INC.Inventors: David J. Mitchell, Anand A. Kulkarni, Ramesh Subramanian, Edward R. Roesch, Rod Waits, John R. Fraley, Roberto M. Schupbach, Alexander B. Lostetter
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Patent number: D909310Type: GrantFiled: September 17, 2018Date of Patent: February 2, 2021Assignee: Cree, Fayetteville, Inc.Inventors: Brice McPherson, Sayan Seal, Zachary Cole, Jennifer Stabach, Brandon Passmore, Ty McNutt, Alexander B. Lostetter