Abstract: Aluminized optical fiber (11) can be permanently bonded to silicon surfaces by applying both heat and pressure to the optical fiber. Thus, an optical fiber (11) can be bonded within a silicon V-groove (16) simply by applying heat and pressure, thereby to give an extremely accurate predetermined alignment of the central axis of the optical fiber within the V-groove, while avoiding the use of any potentially contaminating adhesives. This method can also be used to bond the aluminized fiber to aluminized V-grooves, as is described below.

Abstract: Elements such as glass spheres (11) and optical fibers (30') are permanently bonded to aluminum surfaces (13) of substrates (12) by applying pressure along with energy to the interface of the element and the aluminum. For example, a glass sphere is bonded by pressing it against aluminum while heating the aluminum. As an alternative to heating, acoustic energy can be applied to the sphere along with the pressure. Glass optical fibers can be bonded to aluminum surfaces in the same manner.

Abstract: An electronic device (10) is surface mounted to bonding pads (11) of a substrate (12) by first mounting the device within an aperture (24) of a glass plate (17). The leads (14) of the electronic device are coated with solder and pressed onto the bonding pads by the reusable glass plate (17). While pressing the plate against the leads, the plate is scanned with a laser beam (16) directly over each row of bonding pads. The laser light is of an appropriate wavelength such that the glass plate converts the laser light to heat, which melts the solder to bond the leads to the bonding pads.

Abstract: An electronic device package is made by first making in a stencil member (11) an opening (12) in the shape of a closed loop that surrounds an inner portion (13) of the stencil member. The closed loop is a continuous opening except for a plurality of web members (15), each of which extends across the opening to secure the inner stencil portion to the remainder of the stencil member. A glass slurry (7) is forced through the opening of the stencil member onto a first substrate (18) so as to form on the substrate a substantially closed loop of glass slurry, which is thereafter glazed to form a glass loop (32) bonded to the first substrate. The first substrate is used as cover plate and placed over a second substrate (24) containing an electronic device (23) such that the glass loop surrounds the electronic device and contacts the second substrate along its entire length. The glass is heated sufficiently to soften it and cause it to bond to the second substrate as well as the first substrate.

Abstract: In one embodiment (FIG. 1) leads (14) are soldered to bonding pads (11) by heating a silica heating member (17) with a laser beam (16). The heating member has a tubular shape and encloses the solder elements to be heated. In another embodiment (FIG. 3), the heating element is a plate (22) overlying elements to be soldered which plate is scanned by a laser beam (28) along a line (31) in close proximity to the elements to be soldered.

Abstract: A fused silica glass tube (26) is extruded from a melt (21) in a chamber (11) pressurized with an inert gas. A shield is placed in close, spaced, relation to the melt (21) surface during the gas pressure extrusion process to substantially eliminate losses from the melt due to vaporization.

Abstract: A glass tube extrusion apparatus (50) is comprised of a chamber (52) having a crucible (72) therein mounted within and spaced from an inductive heating coil (77). As a glass tube (170) is extruded from an annular opening (74) in the bottom of the crucible (72) the tube is monitored for bending. When a bend starts to occur an X-Y motion apparatus (54) is activated to move the crucible (72) laterally within the coil (77) in a direction opposite to the bend to straighten the tube (170).

Abstract: A gas head extrusion apparatus (10), having upper (12) and lower (13) chambers, is arranged to feed glass particulate (60) into the upper chamber (12). The particulate (60) is heated to consolidate the particulate (60) into a first viscous melt (71) as an elevated gas pressure is simultaneously applied within the chamber (12). The first viscous melt (71) is urged through a narrow opening (16) in the bottom (14) of the upper chamber (12) into the lower chamber (13) to form a second viscous melt (73). The lower chamber (13) is pressurized to a second pressure, P.sub.2, where P.sub.1 >P.sub.2. Gas bubbles, having an internal pressure, P.sub.1, formed during the consolidation process in the upper chamber (12), will expand in the lower chamber (13) to facilitate removal thereof from the melt (73). The lower pressure, P.sub.

Abstract: Device leads are compliantly bonded and external leads are directly bonded to a substrate with a single stroke of a bonding tool. The external leads are comprised in a lead frame that includes a compliant medium portion for bonding the device leads.

Abstract: A method of depositing a metal on a surface comprising an electrically non-conductive ferrite is disclosed. The method comprises contacting the surface with a cathodically charged element. The element is then electroplated to deposit a metal thereon and on the contacted surface.

Abstract: A method of forming an integrated circuit assembly is disclosed. The method comprises selectively treating a surface of a carrier to delineate a pattern thereon capable of receiving a metal deposit. The pattern is contacted with a conductive lead of an integrated circuit. The pattern is also contacted with a conductive external element and a metal is then deposited on the pattern to form an assembly having a continuous conductive metal pattern joining the lead and the external element. The resultant metal-deposited assembly may then be encapsulated and removed from the carrier.