Patents by Inventor Alexander Heinrich

Alexander Heinrich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210167034
    Abstract: A chip arrangement including: a chip including a chip back side; a substrate including a surface with a plating; and a zinc-based solder alloy which attaches the chip back side to the plating on the surface of the substrate, the zinc-based solder alloy including, by weight, 1% to 30% aluminum, 0.5% to 20% germanium, and 0.5% to 20% gallium, wherein a balance of the zinc-based solder alloy is zinc.
    Type: Application
    Filed: January 15, 2021
    Publication date: June 3, 2021
    Inventors: Manfred MENGEL, Alexander HEINRICH, Steffen ORSO, Thomas BEHRENS, Oliver EICHINGER, Lim FONG, Evelyn NAPETSCHNIG, Edmund RIEDL
  • Publication number: 20210157443
    Abstract: An optical device for controlling light and an optical touch sensing device are formed by direct laser writing in a transparent substrate to manufacture one or more optical waveguides therein.
    Type: Application
    Filed: July 25, 2019
    Publication date: May 27, 2021
    Inventors: Jonas ZEUNER, Philip WALTHER, Alexander SZAMEIT, Matthias HEINRICH, Lukas MACZEWSKY
  • Publication number: 20210145001
    Abstract: Pesticidal mixtures are provided herein, including as active components at least one specific nitrification inhibitor (compound I) and at least one fungicide (compound II). A method is also provided for controlling phytopathogenic harmful fungi, or for improving the nitrification-inhibiting effect, or for increasing the health of a plant using mixtures of at least one compound I and at least one compound II. The use of mixtures including compounds I and compounds II is provided herein for controlling phytopathogenic harmful fungi or for increasing the health of a plant. Agrochemical compositions including these mixtures are also provided herein, as well as plant propagation material including these mixtures or these agrochemical compositions.
    Type: Application
    Filed: July 5, 2018
    Publication date: May 20, 2021
    Inventors: Barbara Nave, Gregor Pasda, Alexander Wissemeier, Maarten Staal, Karl-Heinrich Schneider, Markus Schmid, Wolfram Zerulla, Daniella Lohe, Sascha Shuxia Zhu
  • Publication number: 20210145003
    Abstract: The present disclosure relates to pesticidal mixtures including as active components at least one specific nitrification inhibitor (compound I) and at least one herbicide (compound II). Also disclosed is a method for controlling vegetation on non-crop areas (vegetation of weeds), or for improving the nitrification-inhibiting effect, or for increasing the health of a plant using mixtures of at least one compound I and at least one compound II. Also disclosed are uses of mixtures comprising compounds I and compounds II for controlling vegetation on non-crop areas (vegetation of weeds) or to increasing the health of a plant. Also disclosed are agrochemical compositions including these mixtures, and plant propagation material including these mixtures or these agrochemical compositions.
    Type: Application
    Filed: July 5, 2018
    Publication date: May 20, 2021
    Inventors: Barbara Nave, Gregor Pasda, Alexander Wissemeier, Maarten Staal, Karl-Heinrich Schneider, Markus Schmid, Wolfram Zerulla, Daniella Lohe, Sascha Shuxia Zhu
  • Publication number: 20210143123
    Abstract: A method of batch soldering includes: forming a soldered joint between a metal region of a first semiconductor die and a metal region of a substrate using a solder preform via a soldering process which does not apply pressure directly to the first semiconductor die, the solder preform having a maximum thickness of 30 ?m and a lower melting point than the metal regions; setting a soldering temperature of the soldering process so that the solder preform melts and fully reacts with the metal region of the first semiconductor die and the metal region of the substrate to form one or more intermetallic phases throughout the entire soldered joint, each intermetallic phase having a melting point above the preform melting point and the soldering temperature; and soldering a second semiconductor die to the same or different metal region of the substrate, without applying pressure directly to the second semiconductor die.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 13, 2021
    Inventors: Kirill Trunov, Alexander Heinrich, Konrad Roesl, Arthur Unrau
  • Publication number: 20210140576
    Abstract: A connector arrangement for conducting liquid urea solutions. The connector arrangement includes a distributor, with at least three connecting elements, and a connecting component, located between the connecting elements, with inner channels running within the connecting component. Three individual lines having connecting means are connected to the connecting elements of the distributor by the connecting means, and a housing surrounds the distributor and at least a part of the individual line. The distributor is disposed in the housing together with end sections of the connected individual lines. A channel line inner diameter of the inner channels and a total length of the inner channels and a wall thickness of the distributor in the connecting component are dimensioned such that ice pressure on the distributor, which occurs as a result of the freezing of a liquid within the distributor, does not result in any destruction.
    Type: Application
    Filed: June 14, 2019
    Publication date: May 13, 2021
    Inventors: Lukas Röhrig, Alexander Oberdörfer, Eugen Heinrichs
  • Publication number: 20210143120
    Abstract: A method of joining a semiconductor die to a substrate includes: applying a solder preform to a metal region of the semiconductor die or to a metal region of the substrate, the solder preform having a maximum thickness of 30 ?m and a lower melting point than both metal regions; forming a soldered joint between the metal region of the semiconductor die and the metal region of the substrate via a diffusion soldering process and without applying pressure directly to the die; and setting a soldering temperature of the diffusion soldering process so that the solder preform melts and fully reacts with the metal region of the semiconductor die and the metal region of the substrate to form one or more intermetallic phases throughout the entire soldered joint, each intermetallic phase having a melting point above the melting point of the preform and the soldering temperature.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 13, 2021
    Inventors: Alexander Heinrich, Konrad Roesl, Kirill Trunov, Arthur Unrau
  • Patent number: 11004823
    Abstract: A chip assembly includes a carrier and a metal grid array having an opening. The metal grid array is attached to the carrier by an attachment material. The metal grid array and the carrier define a cavity which is formed by the opening and the carrier. The chip assembly further includes an electronic chip mounted in the cavity.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: May 11, 2021
    Assignee: Infineon Technologies AG
    Inventors: Alexander Heinrich, Frank Daeche
  • Publication number: 20210134708
    Abstract: A semiconductor package includes a power semiconductor chip comprising SiC, a leadframe part comprising Cu, wherein the power semiconductor chip is arranged on the leadframe part, and a solder joint electrically and mechanically coupling the power semiconductor chip to the leadframe part, wherein the solder joint comprises at least one intermetallic phase.
    Type: Application
    Filed: October 26, 2020
    Publication date: May 6, 2021
    Inventors: Ralf Otremba, Paul Frank, Alexander Heinrich, Alexandra Ludsteck-Pechloff, Daniel Pedone
  • Publication number: 20210118842
    Abstract: A method of forming an interconnection includes: providing an electronic component having a first main face and a first metallic layer disposed on the first main face; providing an electric component having a second main face and a second metallic layer disposed on the second main face, at least one of the first or second metallic layers including an oxide layer provided on a main face thereof; disposing a reducing agent on one or both of the electronic component and the electric component such that the reducing agent is enabled to remove the oxide layer; and connecting the electronic component to the electric component by directly connecting the first metallic layer of the electronic component with the second metallic layer of the electric component by applying pressure and heat.
    Type: Application
    Filed: October 9, 2020
    Publication date: April 22, 2021
    Inventor: Alexander Heinrich
  • Publication number: 20210118843
    Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 22, 2021
    Applicant: Infineon Technologies AG
    Inventors: Edmund Riedl, Wu Hu Li, Alexander Heinrich, Ralf Otremba, Werner Reiss
  • Publication number: 20210113773
    Abstract: A data collection device including an attachment assembly for attaching the data collection device to a dose setting dial of a medicament administration device, a light source configured to illuminate a portion of a surface of an internal component of the medicament administration device including a pattern of relatively reflective and non-reflecting regions formed on the surface of the internal component, and an optical sensor configured to receive light reflected by at least the relatively reflective regions.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 22, 2021
    Inventors: Christian Rehbein, Sven Hagebusch, Chris Knorr, Maurice Toporek, Matthias Felber, Alexander Heinrich
  • Publication number: 20210111143
    Abstract: A semiconductor device includes a semiconductor die with a metallization layer including a first metal with a comparatively high melting point, a die carrier including a second metal with a comparatively high melting point, a first intermetallic compound arranged between the semiconductor die and the die carrier and including the first metal and a third metal with a comparatively low melting point, a second intermetallic compound arranged between the first intermetallic compound and the die carrier and including the second metal and the third metal, and precipitates of a third intermetallic compound arranged between the first intermetallic compound and the second intermetallic compound and including the third metal and a fourth metal with a comparatively high melting point.
    Type: Application
    Filed: October 5, 2020
    Publication date: April 15, 2021
    Inventor: Alexander Heinrich
  • Patent number: 10930614
    Abstract: A chip arrangement including a chip comprising a chip back side; a back side metallization on the chip back side, the back side metallization including a plurality of layers; a substrate comprising a surface with a metal layer; a zinc-based solder alloy configured to attach the back side metallization to the metal layer, the zinc-based solder alloy having by weight 8% to 20% aluminum, 0.5% to 20% magnesium, 0.5% to 20% gallium, and the balance zinc; wherein the metal layer is configured to provide a good wettability of the zinc-based solder alloy on the surface of the substrate. The plurality of layers may include one or more of a contact layer configured to contact a semiconductor material of the chip back side; a barrier layer; a solder reaction, and an oxidation protection layer configured to prevent oxidation of the solder reaction layer.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: February 23, 2021
    Assignee: Infineon Technologies AG
    Inventors: Manfred Mengel, Alexander Heinrich, Steffen Orso, Thomas Behrens, Oliver Eichinger, Lim Fong, Evelyn Napetschnig, Edmund Riedl
  • Publication number: 20210043603
    Abstract: A method of forming a semiconductor package includes providing a panel, providing one or more metal layers on an upper surface of the panel, forming a die pad and bond pads from the one or more metal layers, the die pad being adjacent to and spaced apart from the bond pads, attaching a die to the die pad, forming electrical connections between the die and the bond pads, encapsulating the die and the electrical connections with an electrically insulating mold compound, removing portions of the panel, and exposing the die pad and the bond pads after encapsulating the die.
    Type: Application
    Filed: October 23, 2020
    Publication date: February 11, 2021
    Inventors: Thorsten Meyer, Gerald Ofner, Stephan Bradl, Stefan Miethaner, Alexander Heinrich, Horst Theuss, Peter Scherl
  • Publication number: 20210035945
    Abstract: An arrangement is disclosed. In one example, the arrangement of a conductor and an aluminum layer soldered together comprises a substrate and the aluminum layer disposed over the substrate. The aluminum forms a first bond metal. An intermetallic compound layer is disposed over the aluminum layer. A solder layer is disposed over the intermetallic compound layer, wherein the solder comprises a low melting majority component. The conductor is disposed over the solder layer, wherein the conductor has a soldering surface which comprises a second bond metal. The intermetallic compound comprises aluminum and the second bond metal and is predominantly free of the low melting majority component.
    Type: Application
    Filed: July 30, 2020
    Publication date: February 4, 2021
    Applicant: Infineon Technologies AG
    Inventors: Alexander Heinrich, Ralf Otremba, Stefan Schwab
  • Patent number: 10896893
    Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: January 19, 2021
    Assignee: Infineon Technologies AG
    Inventors: Edmund Riedl, Wu Hu Li, Alexander Heinrich, Ralf Otremba, Werner Reiss
  • Patent number: 10892247
    Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: January 12, 2021
    Assignee: Infineon Technologies AG
    Inventors: Edmund Riedl, Wu Hu Li, Alexander Heinrich, Ralf Otremba, Werner Reiss
  • Patent number: 10874802
    Abstract: A data collection device comprises: a first portion having one or more features configured for attaching of the first portion to a dosage knob of an injection device; a second portion rotatably coupled with the first portion, wherein at least part of the second portion is movable axially relative to the first portion; a sensor arrangement configured to detect rotation of the first portion relative to the second portion; and a processor arrangement configured to, based on said detected movement, determine a medicament amount expelled by the injection device, wherein the coupling arrangement is configured to provide a non-permanent coupling between the first portion and the dosage knob of the injection device.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: December 29, 2020
    Assignee: Sanofi-Aventis Deustschland GMBH
    Inventors: Maurice Toporek, Matthias Felber, Christoph Matthias Gugl, Marcus-Meinolf Dittrich, Christian Nessel, Stephan Riedel, Armin Koller, Alexander Heinrich, Florian Eberli, Philipp Muller, Sven Zwicker
  • Publication number: 20200384205
    Abstract: A data collection device comprises: a first portion having one or more features configured for attaching of the first portion to a dosage knob of an injection device; a second portion rotatably coupled with the first portion, wherein at least part of the second portion is movable axially relative to the first portion; a sensor arrangement configured to detect rotation of the first portion relative to the second portion; and a processor arrangement configured to, based on said detected movement, determine a medicament amount expelled by the injection device, wherein the coupling arrangement is configured to provide a non-permanent coupling between the first portion and the dosage knob of the injection device.
    Type: Application
    Filed: August 24, 2020
    Publication date: December 10, 2020
    Inventors: Maurice Toporek, Matthias Felber, Christoph Matthias Gugl, Marcus-Meinolf Dittrich, Christian Nessel, Stephan Riedel, Armin Koller, Alexander Heinrich, Florian Eberli, Philipp Muller, Sven Zwicker