Patents by Inventor Alexander Heinrich

Alexander Heinrich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220031958
    Abstract: A data collection device including an attachment assembly for attaching the data collection device to a dose setting dial of a medicament administration device, a light source configured to illuminate a portion of a surface of an internal component of the medicament administration device including a pattern of relatively reflective and non-reflecting regions formed on the surface of the internal component, and an optical sensor configured to receive light reflected by at least the relatively reflective regions.
    Type: Application
    Filed: October 14, 2021
    Publication date: February 3, 2022
    Inventors: Christian Rehbein, Sven Hagebusch, Chris Knorr, Maurice Toporek, Matthias Felber, Alexander Heinrich
  • Publication number: 20220001111
    Abstract: A data collection device comprises: a first portion having one or more features configured for attaching of the first portion to a dosage knob of an injection device; a second portion rotatably coupled with the first portion, wherein at least part of the second portion is movable axially relative to the first portion; a sensor arrangement configured to detect rotation of the first portion relative to the second portion; and a processor arrangement configured to, based on said detected movement, determine a medicament amount expelled by the injection device, wherein the coupling arrangement is configured to provide a non-permanent coupling between the first portion and the dosage knob of the injection device.
    Type: Application
    Filed: September 16, 2021
    Publication date: January 6, 2022
    Inventors: Maurice Toporek, Matthias Felber, Christoph Matthias Gugl, Marcus-Meinolf Dittrich, Christian Nessel, Stephan Riedel, Armin Koller, Alexander Heinrich, Florian Eberli, Philipp Muller, Sven Zwicker
  • Patent number: 11217047
    Abstract: The invention relates to a method for verifying a prescribed maximum physical distance (MAX) of a radio key (11) in relation to a motor vehicle (10), wherein a control apparatus (26) uses a radio device (21) of the motor vehicle (10) to transmit at least one electromagnetic radio signal to the radio key (11) and subsequently receives a respective electromagnetic response signal and, for each radio signal, takes the radio signal and the associated response signal as a basis in each case for using a signal propagation delay measurement to ascertain a respective signal propagation delay and checks whether the signal propagation delay fails to satisfy a predetermined propagation delay criterion (27), and signals a transgression above the propagation delay (28) when the propagation delay criterion (27) is not satisfied.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: January 4, 2022
    Inventors: Franz Plattner, Stefan Hermann, Alexander Heinrich
  • Patent number: 11192525
    Abstract: An access arrangement for a vehicle comprises a vehicle-side unlocking device for unlocking a locking mechanism. Furthermore, it comprises a vehicle-side rechargeable electrical energy storage device which is set up to supply the unlocking device with energy independently of the on-board power supply of the vehicle. Moreover, the access arrangement has a vehicle-side energy supply device comprising a first section for receiving wirelessly transmitted energy and for converting the transmitted energy into electrical energy, and a second section for charging the vehicle-side rechargeable electrical energy storage device. In particular, the access arrangement also comprises a vehicle-side authentication device for checking access authorization, which is supplied with energy independently of the on-board power supply by means of the vehicle-side rechargeable electrical energy storage device.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: December 7, 2021
    Assignee: Continental Automotive GmbH
    Inventors: Ulrich Emmerling, Annette Hebling, Christine Igl, Georg Käufl, Stefan Hermann, Alexander Heinrich
  • Publication number: 20210375824
    Abstract: An electronic device includes: a first semiconductor die having a metal region; a substrate having a plurality of metal regions; a first soldered joint between the metal region of the first semiconductor die and a first metal region of the substrate, the first soldered joint having one or more intermetallic phases throughout the entire soldered joint, each of the one or more intermetallic phases formed from a solder preform diffused into the metal region of the first semiconductor die and the first metal region of the substrate; and a second semiconductor die soldered to the first or different metal region of the substrate.
    Type: Application
    Filed: August 16, 2021
    Publication date: December 2, 2021
    Inventors: Kirill Trunov, Alexander Heinrich, Konrad Roesl, Arthur Unrau
  • Patent number: 11158602
    Abstract: A method of batch soldering includes: forming a soldered joint between a metal region of a first semiconductor die and a metal region of a substrate using a solder preform via a soldering process which does not apply pressure directly to the first semiconductor die, the solder preform having a maximum thickness of 30 ?m and a lower melting point than the metal regions; setting a soldering temperature of the soldering process so that the solder preform melts and fully reacts with the metal region of the first semiconductor die and the metal region of the substrate to form one or more intermetallic phases throughout the entire soldered joint, each intermetallic phase having a melting point above the preform melting point and the soldering temperature; and soldering a second semiconductor die to the same or different metal region of the substrate, without applying pressure directly to the second semiconductor die.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: October 26, 2021
    Assignee: Infineon Technologies Austria AG
    Inventors: Kirill Trunov, Alexander Heinrich, Konrad Roesl, Arthur Unrau
  • Patent number: 11155240
    Abstract: An access arrangement for a vehicle comprises a vehicle-side unlocking device for unlocking a locking mechanism. Furthermore, it comprises a vehicle-side rechargeable electrical energy storage device which is set up to supply the unlocking device with energy independently of the on-board power supply of the vehicle. Moreover, the access arrangement has a vehicle-side energy supply device comprising a first section for receiving wirelessly transmitted energy and for converting the transmitted energy into electrical energy, and a second section for charging the vehicle-side rechargeable electrical energy storage device. In particular, the access arrangement also comprises a vehicle-side authentication device for checking access authorization, which is supplied with energy independently of the on-board power supply by means of the vehicle-side rechargeable electrical energy storage device.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: October 26, 2021
    Assignee: Continental Automotive GmbH
    Inventors: Ulrich Emmerling, Annette Hebling, Christine Igl, Georg Käufl, Stefan Hermann, Alexander Heinrich
  • Publication number: 20210290854
    Abstract: Data Collection Apparatus for Attachment to an Injection Device A data collection device comprising a first portion configured for attachment to a rotatable dosage knob of an injection device in which the dosage knob is configured to rotate as medicament is expelled from the injection device, a second portion rotatably coupled with the first portion, wherein at least part of the second portion is movable axially relative to the first portion. The second portion comprises a button which is rotationally fixed relative to the second portion, and moveable between an extended position and a depressed position. The button and second portion are configured such that moving the button to the depressed position causes the second portion to move axially relative to the first portion. A sensor arrangement is configured to detect rotation of the first portion relative to the second portion.
    Type: Application
    Filed: August 9, 2019
    Publication date: September 23, 2021
    Inventors: Alexander Heinrich, Sven Zwicker
  • Publication number: 20210225795
    Abstract: A SiC power semiconductor device includes: a power semiconductor die including SiC and a metallization layer, wherein the metallization layer includes a first metal; a die carrier, wherein the power semiconductor die is arranged over the die carrier such that the metallization layer faces the die carrier, the die carrier being at least partially covered by a plating that includes Ni; and a first intermetallic compound arranged between the power semiconductor die and the plating and including Ni3Sn4.
    Type: Application
    Filed: January 15, 2021
    Publication date: July 22, 2021
    Inventors: Ralf Otremba, Gregor Langer, Paul Frank, Alexander Heinrich, Alexandra Ludsteck-Pechloff, Daniel Pedone
  • Patent number: 11069644
    Abstract: A semiconductor device and method is disclosed. In one embodiment, the semiconductor device comprises a semiconductor die comprising a first surface and a second surface opposite to the first surface, a first metallization layer disposed on the first surface of the semiconductor die, a first solder layer disposed on the first metallization layer, wherein the first solder layer contains the compound Sn/Sb, and a first contact member comprising a Cu-based base body and a Ni-based layer disposed on a main surface of the Cu-based base body, wherein the first contact member is connected with the Ni-based layer to the first solder layer.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: July 20, 2021
    Assignee: Infineon Technologies AG
    Inventors: Thomas Behrens, Alexander Heinrich, Evelyn Napetschnig, Bernhard Weidgans, Catharina Wille, Christina Yeong
  • Publication number: 20210183804
    Abstract: A solder material may include nickel and tin. The nickel may include first and second amounts of particles. A sum of the particle amounts is a total amount of nickel or less. The first amount is between 5 at % and 60 at % of the total amount of nickel. The second amount is between 10 at % and 95 at % of the total amount of nickel. The particles of the first amount have a first size distribution, the particles of the second amount have a second size distribution, 30% to 70% of the first amount have a particle size in a range of about 5 ?m around a particle size the highest number of particles have according to the first size distribution, and 30% to 70% of the second amount have a particle size in a range of about 5 ?m around a particle size the highest number of particles have according to the second size distribution.
    Type: Application
    Filed: December 10, 2020
    Publication date: June 17, 2021
    Inventors: Alexander Heinrich, Alexander Roth, Catharina Wille
  • Publication number: 20210167034
    Abstract: A chip arrangement including: a chip including a chip back side; a substrate including a surface with a plating; and a zinc-based solder alloy which attaches the chip back side to the plating on the surface of the substrate, the zinc-based solder alloy including, by weight, 1% to 30% aluminum, 0.5% to 20% germanium, and 0.5% to 20% gallium, wherein a balance of the zinc-based solder alloy is zinc.
    Type: Application
    Filed: January 15, 2021
    Publication date: June 3, 2021
    Inventors: Manfred MENGEL, Alexander HEINRICH, Steffen ORSO, Thomas BEHRENS, Oliver EICHINGER, Lim FONG, Evelyn NAPETSCHNIG, Edmund RIEDL
  • Publication number: 20210143120
    Abstract: A method of joining a semiconductor die to a substrate includes: applying a solder preform to a metal region of the semiconductor die or to a metal region of the substrate, the solder preform having a maximum thickness of 30 ?m and a lower melting point than both metal regions; forming a soldered joint between the metal region of the semiconductor die and the metal region of the substrate via a diffusion soldering process and without applying pressure directly to the die; and setting a soldering temperature of the diffusion soldering process so that the solder preform melts and fully reacts with the metal region of the semiconductor die and the metal region of the substrate to form one or more intermetallic phases throughout the entire soldered joint, each intermetallic phase having a melting point above the melting point of the preform and the soldering temperature.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 13, 2021
    Inventors: Alexander Heinrich, Konrad Roesl, Kirill Trunov, Arthur Unrau
  • Publication number: 20210143123
    Abstract: A method of batch soldering includes: forming a soldered joint between a metal region of a first semiconductor die and a metal region of a substrate using a solder preform via a soldering process which does not apply pressure directly to the first semiconductor die, the solder preform having a maximum thickness of 30 ?m and a lower melting point than the metal regions; setting a soldering temperature of the soldering process so that the solder preform melts and fully reacts with the metal region of the first semiconductor die and the metal region of the substrate to form one or more intermetallic phases throughout the entire soldered joint, each intermetallic phase having a melting point above the preform melting point and the soldering temperature; and soldering a second semiconductor die to the same or different metal region of the substrate, without applying pressure directly to the second semiconductor die.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 13, 2021
    Inventors: Kirill Trunov, Alexander Heinrich, Konrad Roesl, Arthur Unrau
  • Patent number: 11004823
    Abstract: A chip assembly includes a carrier and a metal grid array having an opening. The metal grid array is attached to the carrier by an attachment material. The metal grid array and the carrier define a cavity which is formed by the opening and the carrier. The chip assembly further includes an electronic chip mounted in the cavity.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: May 11, 2021
    Assignee: Infineon Technologies AG
    Inventors: Alexander Heinrich, Frank Daeche
  • Publication number: 20210134708
    Abstract: A semiconductor package includes a power semiconductor chip comprising SiC, a leadframe part comprising Cu, wherein the power semiconductor chip is arranged on the leadframe part, and a solder joint electrically and mechanically coupling the power semiconductor chip to the leadframe part, wherein the solder joint comprises at least one intermetallic phase.
    Type: Application
    Filed: October 26, 2020
    Publication date: May 6, 2021
    Inventors: Ralf Otremba, Paul Frank, Alexander Heinrich, Alexandra Ludsteck-Pechloff, Daniel Pedone
  • Publication number: 20210118842
    Abstract: A method of forming an interconnection includes: providing an electronic component having a first main face and a first metallic layer disposed on the first main face; providing an electric component having a second main face and a second metallic layer disposed on the second main face, at least one of the first or second metallic layers including an oxide layer provided on a main face thereof; disposing a reducing agent on one or both of the electronic component and the electric component such that the reducing agent is enabled to remove the oxide layer; and connecting the electronic component to the electric component by directly connecting the first metallic layer of the electronic component with the second metallic layer of the electric component by applying pressure and heat.
    Type: Application
    Filed: October 9, 2020
    Publication date: April 22, 2021
    Inventor: Alexander Heinrich
  • Publication number: 20210113773
    Abstract: A data collection device including an attachment assembly for attaching the data collection device to a dose setting dial of a medicament administration device, a light source configured to illuminate a portion of a surface of an internal component of the medicament administration device including a pattern of relatively reflective and non-reflecting regions formed on the surface of the internal component, and an optical sensor configured to receive light reflected by at least the relatively reflective regions.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 22, 2021
    Inventors: Christian Rehbein, Sven Hagebusch, Chris Knorr, Maurice Toporek, Matthias Felber, Alexander Heinrich
  • Publication number: 20210118843
    Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 22, 2021
    Applicant: Infineon Technologies AG
    Inventors: Edmund Riedl, Wu Hu Li, Alexander Heinrich, Ralf Otremba, Werner Reiss
  • Publication number: 20210111143
    Abstract: A semiconductor device includes a semiconductor die with a metallization layer including a first metal with a comparatively high melting point, a die carrier including a second metal with a comparatively high melting point, a first intermetallic compound arranged between the semiconductor die and the die carrier and including the first metal and a third metal with a comparatively low melting point, a second intermetallic compound arranged between the first intermetallic compound and the die carrier and including the second metal and the third metal, and precipitates of a third intermetallic compound arranged between the first intermetallic compound and the second intermetallic compound and including the third metal and a fourth metal with a comparatively high melting point.
    Type: Application
    Filed: October 5, 2020
    Publication date: April 15, 2021
    Inventor: Alexander Heinrich