Abstract: A portable object connectable package for an electronic device comprises: semiconductor die package, having a top surface and an opposite bottom surface, and a connector body mechanically supported by the semiconductor die package. The bottom surface includes a plurality of connection elements for connecting to a printed circuit board. The connector body includes a plurality of resilient electrical connecting elements extending over the top surface for contacting with a portable object PO having a contacting area. The portable object connectable package is arranged to be coupled to a portable object positioner for removably positioning the contacting area of the portable object in contact with the plurality of resilient electrical connecting elements when the portable object is present in the portable object positioner.

Abstract: A portable object connectable package 1, 11, 21, 31, 41, 51, 61, 71, 81 for an electronic device comprises: —a semiconductor die package 2, 12, 22, 32, 42, 52, 62, 72, 82 comprising a top surface 2A, 12A, 22A, 32A, 42A, 52A, 62A, 72A, 82A and an opposite bottom surface 2B, 12B, 22B, 32B, 42B, 52B, 62B, 72B, 82B, the bottom surface comprising a plurality of connection elements 3A, 13A, 23A, 33A, 43A, 53A, 63A, 73A, 83A for connecting to a printed circuit board PCB, and—a connector body 4, 14, 24, 34, 44, 54, 64, 74, 84 mechanically supported by the semiconductor die package and comprising a plurality of resilient electrical connecting elements extending over the top surface for contacting with a portable object PO, said circuit comprising a contacting area PO1.