Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

Abstract: An I/O system and device for use with superconducting device provides multi-stage filtering using superconducting electrical pathways, while providing good thermal conductivity to maintain low temperature of the various components and allowing the easy mounting and dismounting of a device sample from a refrigerated environment. Filtering may include a lumped element filter assembly including multiple plates each carrying a number of lumped element filters. Filtering may include a metal powder filter assembly including multiple metal power filters formed in passages of a substantially non-magnetic portions. A device sample holder assembly secures a device sample, for example a superconducting quantum processor, and provides signals, ground and good thermal conduction.

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

Abstract: An I/O system and device for use with superconducting device provides multi-stage filtering using superconducting electrical pathways, while providing good thermal conductivity to maintain low temperature of the various components and allowing the easy mounting and dismounting of a device sample from a refrigerated environment. Filtering may include a lumped element filter assembly including multiple plates each carrying a number of lumped element filters. Filtering may include a metal powder filter assembly including multiple metal power filters formed in passages of a substantially non-magnetic portions. A device sample holder assembly secures a device sample, for example a superconducting quantum processor, and provides signals, ground and good thermal conduction.

Abstract: An electrical filter includes a circuit board with an insulative substrate of alternating wide and narrow portions between input and output ends. Capacitors received in through-holes in the wide portions are electrically coupled to signal traces on a signal surface and ground traces on a ground surface of the circuit board. Conductive coils about narrow portions may form inductors, electrically coupled between the signal traces and an input and/or output. The circuit board, capacitors and inductors may be positioned in a first enclosure, (e.g., tube), with sealed electrical connections to an exterior. The first enclosure may be positioned in a second enclosure (e.g., tube). The filter may also include a high frequency dissipation filter section employing a metal powder filter, with metal powder and epoxy. Non-magnetic and/or superconducting materials may be employed.

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

Abstract: An electrical filter includes a circuit board with an insulative substrate of alternating wide and narrow portions between input and output ends. Capacitors received in through-holes in the wide portions are electrically coupled to signal traces on a signal surface and ground traces on a ground surface of the circuit board. Conductive coils about narrow portions may form inductors, electrically coupled between the signal traces and an input and/or output. The circuit board, capacitors and inductors may be positioned in a first enclosure, (e.g., tube), with sealed electrical connections to an exterior. The first enclosure may be positioned in a second enclosure (e.g., tube). The filter may also include a high frequency dissipation filter section employing a metal powder filter, with metal powder and epoxy. Non-magnetic and/or superconducting materials may be employed.