Patents by Inventor Alfred Haimerl

Alfred Haimerl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070054530
    Abstract: A plastic housing composition for embedding semiconductor devices in a plastic housing includes a multicomponent plastic material, where at least one component is distributed in the plastic material in drop-shaped and/or spherical units. The drop-shaped and/or spherical units are surrounded by dimensionally stable sheaths made from a plastic sheath material. The multicomponent plastic further includes a reactive curing system that cures when the plastic sheaths are torn open. The dimensionally stable plastic sheath material is deformation-sensitive, so that the sheaths tear open under mechanical deformation loading, which initiates and/or accelerates the curing process.
    Type: Application
    Filed: August 29, 2006
    Publication date: March 8, 2007
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Publication number: 20070034997
    Abstract: The invention relates to a semiconductor device with conductor tracks between a semiconductor chip and a circuit carrier, and to a method for producing the same. The conductor tracks extend from contact areas on the top side of the semiconductor chip to contact pads on the circuit carrier. The conductor tracks include an electrically conductive polymer in the semiconductor device.
    Type: Application
    Filed: August 3, 2006
    Publication date: February 15, 2007
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Publication number: 20060273420
    Abstract: A semiconductor sensor component including a sensor chip and methods for the manufacturing thereof is disclosed. In one embodiment, the semiconductor sensor component includes a package which itself includes a transparent plastic material. The sensor chip has an active top side and a back side, wherein a sensor area is arranged on the active top side and flipchip contacts are provided outside of the sensor area on the active top side. These flipchip contacts are electrically connected to a circuit structure, wherein the circuit structure allows free access to the sensor area. The sensor chip including the sensor area and the flipchip contacts and a part of the circuit structure which is electrically connected to the flipchip contacts are embedded in the transparent plastic material, wherein the transparent plastic material includes a rubber-elastic substance.
    Type: Application
    Filed: June 2, 2006
    Publication date: December 7, 2006
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Publication number: 20060175583
    Abstract: A method of joining a thermoplastic material to a thermoset material, and a resultant thermoplastic-thermoset composite formed from such method are provided. At least one of the thermoplastic material and the thermoset material includes particles that melt when the thermoplastic material and the thermoset material are heated during the joining operation. The particles further produce a solid bond between the materials after the particles have solidified in the course of cooling after the joining operation.
    Type: Application
    Filed: February 7, 2006
    Publication date: August 10, 2006
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Patent number: 6956287
    Abstract: An electronic component with an electronic circuit and electrical contacts, disposed at least on a first surface of the electronic component, for the electrical bonding of the electronic circuit includes at least one flexible elevation of an insulating material disposed on the first surface, at least one electrical contact disposed on the flexible elevation, and a conduction path disposed on the surface or in the interior of the flexible elevation between the electrical contact and the electronic circuit. A method for producing the electronic component is also provided.
    Type: Grant
    Filed: December 17, 2001
    Date of Patent: October 18, 2005
    Assignee: Infineon Technologies AG
    Inventors: Harry Hedler, Alfred Haimerl
  • Patent number: 6949820
    Abstract: The invention relates to a substrate-based chip package, comprising a substrate on which a chip is fastened by a die-attach material. The substrate is provided with a solder resist (on both sides) and, on the side that is opposite from the chip, has conductor tracks which are provided with solder balls and are connected to the chip by means of wire bridges which extend through a bonding channel which is sealed with a glob top. The chip and the substrate on the chip side being encapsulated by a molded cap.
    Type: Grant
    Filed: June 2, 2004
    Date of Patent: September 27, 2005
    Assignee: Infineon Technologies AG
    Inventors: Martin Reiss, Alfred Haimerl, Steffen Kroehnert
  • Publication number: 20050208703
    Abstract: A method for producing an electronic component with an electronic circuit and electrical contacts, disposed at least on a first surface of the electronic component, for the electrical bonding of the electronic circuit includes at least one flexible elevation of an insulating material disposed on the first surface, at least one electrical contact disposed on the flexible elevation, and a conduction path disposed on the surface or in the interior of the flexible elevation between the electrical contact and the electronic circuit.
    Type: Application
    Filed: May 6, 2005
    Publication date: September 22, 2005
    Inventors: Harry Hedler, Alfred Haimerl
  • Patent number: 6914328
    Abstract: An electronic component and a method of producing it, with at least one insulating layer is encompassed by the invention. The insulating layer includes a polymer including norbornene monomers. The polymer retains a double ring structure of the monomer C7H10 while there is breaking of a carbon double bond of the norbornene monomer. This breaking of the carbon double bond is created by a homopolymerization of the monomers to form crosslinked norbornene monomers with polar fluorocarbon bonds.
    Type: Grant
    Filed: January 30, 2002
    Date of Patent: July 5, 2005
    Assignee: Infineon Technologies AG
    Inventor: Alfred Haimerl
  • Publication number: 20050142933
    Abstract: The present invention describes a rewiring plate for components with connection grids of between approx. 100 nm and 10 ?m, which rewiring plate includes a base body and passages with carbon nanotubes, the lower end of the passages opening out into contact connection surfaces, and the carbon nanotubes forming an electrically conductive connection from the contact connection surfaces to the front surface of the base body.
    Type: Application
    Filed: December 16, 2004
    Publication date: June 30, 2005
    Inventors: Gottfried Beer, Jochen Dangelmaier, Alfred Haimerl, Manfred Mengel, Klaus Mueller, Klaus Pressel
  • Publication number: 20050127527
    Abstract: An electronic component has an electronic circuit and a rubber-elastic elevation. The rubber-elastic elevation is formed of an insulating rubber-elastic material disposed on a surface of the electronic component and has a conductive land on its crest. The rubber-elastic elevation also has on its sloping side or in its volume a conduction path between the land and the electronic circuit.
    Type: Application
    Filed: October 12, 2004
    Publication date: June 16, 2005
    Inventors: Alfred Haimerl, Harry Hedler, Jens Pohl
  • Patent number: 6897568
    Abstract: An electronic component has an electronic circuit and a rubber-elastic elevation. The rubber-elastic elevation is formed of an insulating rubber-elastic material disposed on a surface of the electronic component and has a conductive land on its crest. The rubber-elastic elevation also has on its sloping side or in its volume a conduction path between the land and the electronic circuit.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: May 24, 2005
    Assignee: Infineon Technologies AG
    Inventors: Alfred Haimerl, Harry Hedler, Jens Pohl
  • Publication number: 20050104149
    Abstract: The invention relates to a semiconductor component and a sensor component with data transmission devices, for wireless transmission the semiconductor component having a main coupling element and the sensor component having a sensor coupling element. The invention affords the possibility of multiple sensor applications without direct electrical contact between sensor component and semiconductor component, which may have a logic chip.
    Type: Application
    Filed: October 4, 2004
    Publication date: May 19, 2005
    Inventors: Michael Bauer, Thomas Engling, Alfred Haimerl, Joachim Mahler, Wolfgang Schober
  • Publication number: 20050006741
    Abstract: The invention relates to a substrate-based chip package, comprising a substrate on which a chip is fastened by a die-attach material. The substrate is provided with a solder resist (on both sides) and, on the side that is opposite from the chip, has conductor tracks which are provided with solder balls and are connected to the chip by means of wire bridges which extend through a bonding channel which is sealed with a glob top. The chip and the substrate on the chip side being encapsulated by a molded cap.
    Type: Application
    Filed: June 2, 2004
    Publication date: January 13, 2005
    Inventors: Martin Reiss, Alfred Haimerl, Steffen Kroehnert
  • Publication number: 20030067755
    Abstract: An electronic component has an electronic circuit and a rubber-elastic elevation. The rubber-elastic elevation is formed of an insulating rubber-elastic material disposed on a surface of the electronic component and has a conductive land on its crest. The rubber-elastic elevation also has on its sloping side or in its volume a conduction path between the land and the electronic circuit.
    Type: Application
    Filed: September 30, 2002
    Publication date: April 10, 2003
    Inventors: Alfred Haimerl, Harry Hedler, Jens Pohl
  • Publication number: 20020103318
    Abstract: An electronic component and a method of producing it, with at least one insulating layer is encompassed by the invention. The insulating layer includes a polymer including norbornene monomers. The polymer retains a double ring structure of the monomer C7H10 while there is breaking of a carbon double bond of the norbornene monomer. This breaking of the carbon double bond is created by a homopolymerization of the monomers to form crosslinked norbornene monomers with polar fluorocarbon bonds.
    Type: Application
    Filed: January 30, 2002
    Publication date: August 1, 2002
    Inventor: Alfred Haimerl
  • Publication number: 20020089058
    Abstract: An electronic component with an electronic circuit and electrical contacts, disposed at least on a first surface of the electronic component, for the electrical bonding of the electronic circuit includes at least one flexible elevation of an insulating material disposed on the first surface, at least one electrical contact disposed on the flexible elevation, and a conduction path disposed on the surface or in the interior of the flexible elevation between the electrical contact and the electronic circuit. A method for producing the electronic component is also provided.
    Type: Application
    Filed: December 17, 2001
    Publication date: July 11, 2002
    Inventors: Harry Hedler, Alfred Haimerl