Abstract: Method and apparatus are disclosed for protection of a circuit against process-induced electrical discharge. The method includes forming a diode in close proximity to a charge collector structure capable of exhibiting the antenna effect, and connecting the diode to the charge collector structure by means of local interconnect techniques during the intermediate processing steps. Additionally, the diode may be formed beneath a connecting pad to educe or eliminate antenna effect problems without significant loss of a die area.

Abstract: Method and apparatus are disclosed for protection of a circuit against process-induced electrical discharge. The method includes forming a diode in close proximity to a charge collector structure capable of exhibiting the antenna effect, and connecting the diode to the charge collector structure by means of local interconnect techniques during the intermediate processing steps. Additionally, the diode may be formed beneath a connecting pad to educe or eliminate antenna effect problems without significant loss of a die area.

Abstract: A highly flexible, heterogeneous architecture for portable, high density, high performance standard cell and gate array applications is disclosed. The architecture is based on the three basic cells and their derivatives, particularly a transmission gate cell, a logic cell, and a drive cell. For gate array implementations, the cells are arranged in a pre-determined regular array format. For standard cell implementations, the arrangement of the cells may be optimized to suit each target logic gate. Optimized transistor sizing is achievable through leaf cells, software sizing, or both.

Abstract: Method and apparatus are disclosed for protection of a circuit against process-induced electrical discharge. The method includes forming a diode in close proximity to a charge collector structure capable of exhibiting the antenna effect, and connecting the diode to the charge collector structure by means of local interconnect techniques during intermediate processing steps. Additionally, the diode may be formed beneath a connecting pad to reduce or eliminate antenna effect problems without significant loss of die area.

Abstract: Method and apparatus are disclosed for protection of a circuit against process-induced electrical discharge. The method includes forming a diode in close proximity to a charge collector structure capable of exhibiting the antenna effect, and connecting the diode to the charge collector structure by means of local interconnect techniques during intermediate processing steps. Additionally, the diode may be formed beneath a connecting pad to reduce or eliminate antenna effect problems without significant loss of die area.

Abstract: Method and apparatus are disclosed for a low power, high density cell based array structure that permits implementation of designs having compute/drive cell ratios of N:1. The improved performance is provided in part by relocating the substrate and well taps within the compute cell, and in at least some instances by removing the well tap from the drive cell. Further, a extra routing track may be provided by not sharing source/drain areas of adjacent drive cells. Still further, a power mesh may be provided which simplifies routing and improves flexibility.

Abstract: A bipolar transistor is provided whose emitter surrounds the base. The transistor has in some embodiments a high ratio of the emitter area to the base area and low collector and emitter resistances. Further, a transistor is provided in which a collector contact region is surrounded by the base. Consequently, a low collector resistance is obtained in some embodiments.

Abstract: A bipolar transistor is provided whose emitter surrounds the base. The transistor has in some embodiments a high ratio of the emitter area to the base area and low collector and emitter resistances. Further, a transistor is provided in which a collector contact region is surrounded by the base. Consequently, a low collector resistance is obtained in some embodiments.

Abstract: A bipolar transistor is provided whose emitter surrounds the base. The transistor has in some embodiments a high ratio of the emitter area to the base area and low collector and emitter resistances. Further, a transistor is provided in which a collector contact region is surrounded by the base. Consequently, a low collector resistance is obtained in some embodiments.