Patents by Inventor Alphonso P. Lanzetta

Alphonso P. Lanzetta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8832936
    Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.
    Type: Grant
    Filed: July 31, 2009
    Date of Patent: September 16, 2014
    Assignee: International Business Machines Corporation
    Inventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
  • Patent number: 8582648
    Abstract: A video processing method and system for generating a foveated video display with sections having different resolutions uses a network channel for communicating video images having video sections of different resolutions, and includes a video transmission system for processing and transmitting the received video images over the network channel. The system assigns a larger portion of the network channel's bandwidth to a video section with higher resolution. Further, the system includes a video receiving system for receiving and seamlessly combining the first and second video sections of different resolutions to form an output video image on a display device, and a control unit for sending one or more video control parameters to the video transmission system to control capturing, transmitting and processing of the video images.
    Type: Grant
    Filed: February 17, 2009
    Date of Patent: November 12, 2013
    Assignee: International Business Machines Corporation
    Inventors: Steven T. Berman, Paul F. Greier, Kenneth C. Ho, Richard I. Kaufman, Alphonso P. Lanzetta, Michael P. Mastro, Steven Edward Millman, Ron Ridgeway, Kai Schleupen, Steven Lorenz Wright
  • Patent number: 8278745
    Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
    Type: Grant
    Filed: August 18, 2009
    Date of Patent: October 2, 2012
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Shawn A. Hall, Gareth G. Hougham, Alphonso P. Lanzetta, Rick A. Rand
  • Patent number: 8174106
    Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: May 8, 2012
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Shawn A. Hall, Gareth G. Hougham, Alphonso P. Lanzetta, Rick A. Rand
  • Patent number: 8054095
    Abstract: A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: November 8, 2011
    Assignee: International Business Machines Corporation
    Inventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
  • Patent number: 7771208
    Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.
    Type: Grant
    Filed: May 27, 2008
    Date of Patent: August 10, 2010
    Assignee: International Business Machines Corporation
    Inventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
  • Publication number: 20090315168
    Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
    Type: Application
    Filed: August 18, 2009
    Publication date: December 24, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Paul W. Coteus, Shawn A. Hall, Gareth G. Hougham, Alphonso P. Lanzetta, Rick A. Rand
  • Publication number: 20090300914
    Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.
    Type: Application
    Filed: July 31, 2009
    Publication date: December 10, 2009
    Applicant: International Business Machines Corporation
    Inventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
  • Patent number: 7613368
    Abstract: Integrated optoelectronic chips or collections of chips on a module that have both electrical as well as optical interconnects offer many advantages in speed, power consumption and heat generation. Mixed signal types, however, pose significant packaging challenges. This invention describes a land grid array (LGA) interposer which can simultaneously connect electrical and optical signals from a module to a printed circuit board.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: November 3, 2009
    Assignee: International Business Machines Corporation
    Inventors: Gareth G. Hougham, Russell A. Budd, Punit P. Chiniwalla, Paul W. Coteus, Alphonso P. Lanzetta, Frank R. Libsch
  • Publication number: 20090167948
    Abstract: A video processing method and system for generating a foveated video display with sections having different resolutions uses a network channel for communicating video images having video sections of different resolutions, and includes a video transmission system for processing and transmitting the received video images over the network channel. The system assigns a larger portion of the network channel's bandwidth to a video section with higher resolution. Further, the system includes a video receiving system for receiving and seamlessly combining the first and second video sections of different resolutions to form an output video image on a display device, and a control unit for sending one or more video control parameters to the video transmission system to control capturing, transmitting and processing of the video images.
    Type: Application
    Filed: February 17, 2009
    Publication date: July 2, 2009
    Inventors: Steven T. Berman, Paul F. Greier, Kenneth C. Ho, Richard I. Kaufman, Alphonso P. Lanzetta, Michael P. Mastro, Steven Edward Millman, Ron Ridgeway, Kai Schleupen, Steven Lorenz Wright
  • Publication number: 20090053908
    Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.
    Type: Application
    Filed: May 27, 2008
    Publication date: February 26, 2009
    Applicant: International Business Machines Corporation
    Inventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
  • Patent number: 7492821
    Abstract: A video processing method and system for generating a foveated video display with sections having different resolutions uses a network channel for communicating video images having video sections of different resolutions, and includes a video transmission system for processing and transmitting the received video images over the network channel. The system assigns a larger portion of the network channel's bandwidth to a video section with higher resolution. Further, the system includes a video receiving system for receiving and seamlessly combining the first and second video sections of different resolutions to form an output video image on a display device, and a control unit for sending one or more video control parameters to the video transmission system to control capturing, transmitting and processing of the video images.
    Type: Grant
    Filed: February 8, 2005
    Date of Patent: February 17, 2009
    Assignee: International Business Machines Corporation
    Inventors: Steven T. Berman, Paul F. Greier, Kenneth C. Ho, Richard I. Kaufman, Alphonso P. Lanzetta, Michael P. Mastro, Steven Edward Millman, Ron Ridgeway, Kai Schleupen, Steven Lorenz Wright
  • Patent number: 7452212
    Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: November 18, 2008
    Assignee: International Business Machines Corporation
    Inventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
  • Publication number: 20080054430
    Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
    Type: Application
    Filed: August 29, 2006
    Publication date: March 6, 2008
    Applicant: International Business Machines Corporation
    Inventors: Paul W. Coteus, Shawn A. Hall, Gareth G. Hougham, Alphonso P. Lanzetta, Rick A. Rand
  • Patent number: 6276844
    Abstract: A data processing system including an improved method and apparatus for the arrangement and interconnection between electronic devices to improve system cycle time. The apparatus possesses a) a plurality of: memory SIMMs, memory devices on the noted memory SIMMs and registers; b) a clock; c) means for connecting signals between the memory devices on the memory SIMMs and the registers; and d) means for connecting signals between the memory devices on the memory SIMMs and the clocks.
    Type: Grant
    Filed: October 30, 1996
    Date of Patent: August 21, 2001
    Assignee: International Business Machines Corporation
    Inventors: Paul William Coteus, Ralph Herman Genz, Alphonso P. Lanzetta, Warren Edward Maule, Daniel Julius Phipps, James K. Tam, James Donald Wagoner
  • Patent number: 5583510
    Abstract: A multilayer antenna includes a first layer which is a ground plane and which has a plurality of first clearance holes. A first dielectric layer is positioned over the first layer and a second layer is positioned over the first dielectric layer and has a plurality of quarter wave transformers. A second dielectric layer is positioned over the second layer and a third layer ground plane is positioned over the second dielectric layer and has a plurality of second clearance holes for a feed structure. A third dielectric layer is positioned over the third layer and a fourth layer is positioned over the third dielectric layer and has a cross shape. The first and third layers are coupled together via plated-through holes.
    Type: Grant
    Filed: November 16, 1994
    Date of Patent: December 10, 1996
    Assignee: International Business Machines Corporation
    Inventors: Saila Ponnapalli, Alphonso P. Lanzetta, Brian P. Gaucher
  • Patent number: 5581576
    Abstract: A radio information broadcasting and receiving system consisting of three major parts: an FM transmitter station with subcarrier multiplexing capability, an FM receiver apparatus with subcarrier demodulation capability, and a computer connected in combination with the receiver apparatus. The FM transmitter station includes sources of main programming signals first digital data signals and second digital data signals. The first and second digital data signals are modulated by subcarrier 1 and subcarrier 2 frequencies respectively and are mixed with the main program signal and then transmitted. The transmitted signals are received by a receiver apparatus including an FM receiver circuit and an FM demodulator circuit for receiving the broadcast signal and demodulating it. The demodulated main program audio frequency signal is applied through a filter/deemphasis circuit and amplifier to speaker to provide an audio output.
    Type: Grant
    Filed: January 12, 1995
    Date of Patent: December 3, 1996
    Assignee: International Business Machines Corp.
    Inventors: Alphonso P. Lanzetta, Lawrence S. Mok
  • Patent number: 5559670
    Abstract: The invention is a convertible display computer structure in which the display is centrally pivoted in a frame that in turn is hinged on one side on the keyboard so that the display can be positioned to face toward the user when the frame is positioned to be essentially vertical with respect to the keyboard and when it is desired to provide graphic information entry, the display can be turned over so as to serve as a writing surface when the hinged frame is positioned over the keyboard. The conversion from keyboard to graphic stylus input is accomplished by rotating the display on the pivot mountings and then closing the frame over the keyboard with the display surface up and in the proper orientation.
    Type: Grant
    Filed: October 18, 1994
    Date of Patent: September 24, 1996
    Assignee: International Business Machines Corporation
    Inventors: Ephraim B. Flint, Alphonso P. Lanzetta, Lawrence S. Mok
  • Patent number: 5558523
    Abstract: A pad on pad type contact, and technology therefor, for electronic apparatus wherein a spring member, that by its shape and material in the motion when the contact comes together wipes the mating pad surfaces across each other and then retains them under permanent compressive force in service. In high density and high performance electronic apparatus interwiring, array quantities of the spring member of contact are fabricated in unitary assembly elements for connection assemblies between both rigid and flexible type wiring.
    Type: Grant
    Filed: July 15, 1994
    Date of Patent: September 24, 1996
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Alphonso P. Lanzetta
  • Patent number: 5546655
    Abstract: A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.
    Type: Grant
    Filed: October 25, 1994
    Date of Patent: August 20, 1996
    Assignee: International Business Machines Corporation
    Inventors: Claudius Feger, Teresita O. Graham, Kurt R. Grebe, Alphonso P. Lanzetta, John J. Liutkus, Linda C. Matthew, Michael J. Palmer, Nelson R. Tanner, Ho-Ming Tong, Charles H. Wilson, Helen L. Yeh