Abstract: A high density electronic circuit for use in an implantable stimulation device that comprises a flexible substrate that has the advantage of integrating “chip-and-wire” microelectronic circuits and flexible interconnections that are adapted to conform to the body compatible housing into a single structure. The flexible substrate has die attach pads, each die attach pad having a set of wire bond pads therearound, each wire bond pad being connected to conductors formed within the substrate according to circuit function. A plurality of chip-and-wire integrated circuit (IC) chips are mounted by epoxy die attachment on the die attach pads, each IC chip has a plurality of contact pads formed on a top surface thereof, and gold wire bonds electrically connect the plurality of contact pads to the wire bonds pads. The wire bonds include a primary bond and, optionally, a safety bond for reinforcement. Other techniques are disclosed to enable the use of the gold wire bonds on a flexible substrate.

Abstract: An electronic package having vertically integrated components placed upon a substrate surface is configured to increase packing density of the components. Integrated circuits which are vertically-stacked and attached to the substrate surface communicate with surrounding components through connection to bond pads on the substrate surface. The bond pads can be placed entirely about a perimeter of the integrated circuits to achieve optimal packing density. Individual bond pads may be shared by two or more integrated circuits by connection therewith. In an alternative embodiment, a separate integrated circuit is attached to the substrate adjacent to the stacked integrated circuits with a row of shared bond pads positioned therebetween. Individual passive or active components may be placed between bond pads for incorporation into the circuit structure.

Abstract: A circuit module for use in an implantable cardiac stimulation device contains a plurality of stacked substrate platforms. Electrical components of a hybrid circuit structure are attached to respective mounting surfaces of the substrate platforms. Electrical connectivity between components mounted on separate platform levels is established by connecting the components via wire bonds or other means. The wire bonds pass through a slot formed in an upper level substrate and are attached to electrical contacts of an associated lower level substrate.

Abstract: A wireless feedthrough assembly, for coupling leads received in the receptacles of a connector assembly to the electronic circuit within a cardiac pacemaker, includes a weld ring mounted in hermetically sealed fashion within a housing wall of the pacemaker and itself hermetically sealed to an intermediate portion of an elongated, multilayered structure. The multilayered structure includes layers of electrically insulating ceramic material on opposite sides of a planar array of printed conductors extending between a first portion of the structure within the connector assembly and an opposite second portion of the structure within the pacemaker. Connector pads at the ends of the printed conductors within the first portion are coupled to the receptacles of the connector assembly, while contact pads at the exterior of the second portion and coupled by vias to connector pads at the ends of the printed conductors are coupled to the electronic circuits within the pacemaker.

Abstract: A cardiac stimulation device contains an electronics package having a hybrid circuit structure enclosed by a contoured lid design. The contoured lid of the electronics package has a multi-level surface structure which conforms to a multi-level design of the hybrid circuit structure. Mounting the electronics package within a housing of the cardiac stimulation device creates an isolated region formed between the contoured lid of the electronics package and an interior surface of the housing. An activity sensor, or other component of the cardiac stimulation device, may be placed within the isolated region to reduce the overall size of the device.

Abstract: An vertically-integrated electronic assembly containing integral passive components is combined with an integrated circuit creating a three-dimensional package. The electronic assembly is formed as a multi-layered structure having deposited passive components on a substrate layer. Contact pads for the passive components extend to an edge of the substrate layer and are exposed for contact with surrounding circuitry and with the combined integrated circuit.

Abstract: A wireless feedthrough assembly, for coupling leads received in the receptacles of a connector assembly to the electronic circuit within a cardiac pacemaker, includes a weld ring mounted in hermetically sealed fashion within a housing wall of the pacemaker and itself hermetically sealed to an intermediate portion of an elongated, multilayered structure. The multilayered structure includes layers of electrically insulating ceramic material on opposite sides of a planar array of printed conductors extending between a first portion of the structure within the connector assembly and an opposite second portion of the structure within the pacemaker. Connector pads at the ends of the printed conductors within the first portion are coupled to the receptacles of the connector assembly, while contact pads at the exterior of the second portion and coupled by vias to connector pads at the ends of the printed conductors are coupled to the electronic circuits within the pacemaker.

Abstract: The present invention includes a body implantable lead having a multipolar proximal connector, at least a first conductor coupled to at least one stimulating electrode, a sensor for sensing at least one physiologic parameter of the body, and a second and a third conductor coupled to the sensor. The sensor is hermetically sealed in a D-shaped housing. Sensor components are mounted onto a microelectronic substrate which is advantageously placed on an inner flat portion of the D-shaped housing. End caps having sealing rings, either glass frit or metal, are used to seal the ends of the shell. A hermetic seal is easily achieved by heating the sealing material until they re-flow between the end caps and the shell. Advantageously, the sensor terminals are sized to fit snugly within a narrow bore of the end cap which is then circumferentially welded closed. The D-shaped sensor is placed on a carrier having at least two lumens.

Abstract: The present invention includes a body implantable lead having a multipolar proximal connector, at least a first conductor coupled to at least one stimulating electrode, a sensor for sensing at least one physiologic parameter of the body, and a second and a third conductor coupled to the sensor. The sensor is hermetically sealed in a D-shaped housing. Sensor components are mounted onto a microelectronic substrate which is advantageously placed on an inner flat portion of the D-shaped housing. End caps having sealing rings, either glass frit or metal, are used to seal the ends of the shell. A hermetic seal is easily achieved by heating the sealing material until they re-flow between the end caps and the shell. Advantageously, the sensor terminals are sized to fit snugly within a narrow bore of the end cap which is then circumferentially welded closed. The D-shaped sensor is placed on a carrier having at least two lumens.

Abstract: The present invention includes a body implantable lead having a multi-polar proximal connector, at least a first conductor coupled to at least one stimulating electrode, a sensor for sensing at least one physiologic parameter of the body, and a second and a third conductor coupled to the sensor. The sensor is hermetically sealed in a D-shaped housing. Sensor components are mounted onto a microelectronic substrate which is advantageously placed on an inner flat portion of the D-shaped housing. End caps having glass frit sealing rings are used to seal the ends of the shell. A hermetic seal is easily achieved by heating the glass frit such that the glass frit reflows between the end caps and the shell. Advantageously, the sensor terminals are sized to fit snugly within a narrow bore of the end cap which is then welded closed. The D-shaped sensor is placed on a carrier having at least two lumens.

Abstract: A pacemaker having a single integrated interconnect structure is disclosed which combines the functions of a flexible interconnect cable and a protective lid for a hybrid substrate. The integrated interconnect structure is a molded three-dimensional part having a lid portion and a feedthrough portion. An electronic substrate can be mounted onto the integrated interconnect structure wherein electrical conductors formed within the integrated interconnect structure connect the electronic substrate to the battery terminals and to the pacemaker feedthroughs. In one embodiment, the integrated interconnect structure may be adapted to have additional electronic circuitry mounted directly onto a flat inner cavity within the lid portion, thereby enabling electronic components to be easily added or modified without complicating the assembly operations of the pacemaker.

Abstract: An arrangement is provided which enables the rapid and effective termination of electrical junctions for an implantable medical device such as a heart pacemaker, a defibrillator, or a cardioverter. A circuit board supporting electronic circuitry is receivable in a housing for the medical device and is provided with a plurality of female connectors on its outer surface. The female connectors are positioned and shaped to receive and guide mating male components into abutting engagement therewith. The mating male components include feedthrough wires which extend between the interior and the exterior of the housing and conductive pins from a battery used to power the medical device. When the male components and female connectors are in abutting engagement, they are fusion welded as by a laser or electron beam.

Abstract: The implantable pulse generator herein may take the form of a cardiac pacer. The generator includes a pulse generator circuit including passive and active chips. These are mounted on a chip carrier with the active chips located in a hermetically sealed cavity in one major surface of the carrier and the passive chips are mounted on the other major surface. Conductive means internally of the carrier provide electrical paths interconnecting the active and passive chips.

Abstract: The human implantable pulse generator herein may serve as a cardiac pacer. The housing for the generator is minimized in size by mounting integrated circuit chips, forming the pulse generator circuit, in a hermetically sealed cavity in a chip carrier.