Abstract: A method and apparatus for integrated circuit (IC) thermal throttling is described. In one embodiment, the apparatus comprises a plurality of thermal sensors, each of the plurality of thermal sensors being located in an area in the IC to record a die temperature at a location in its associated area; and a thermal controller coupled to the plurality of thermal sensors to perform thermal throttling of the IC to reduce the temperature of the IC in response to the die temperature recorded by any one temperature sensors of the plurality of thermal sensors being greater than an individual temperature threshold for said any one temperature sensor, the individual temperature threshold for each temperature sensor being based on a maximum temperature allowed for the area in the IC in which said each thermal sensor is located and power supplied to a plurality of areas of the IC.

Abstract: Some embodiments of the invention provide a navigation application that uses a novel traffic notification scheme for providing traffic related notifications during a navigation presentation that is provided by a device. While providing a navigation presentation, the application iteratively monitors traffic conditions along the route. When traffic conditions meet a set of one or more threshold criteria, the application identifies a type of traffic notification that it should provide from several possible traffic notifications types. Next, without receiving any input from outside of the device, the application provides a traffic notification that is associated with the selected traffic notification type. In some embodiments, the traffic notification types include a notification (1) relating to traffic congestion along the current route, (2) relating to one or more faster routes that can replace the current route, and (3) regarding a road closure or extreme delay along the current route.

Abstract: A cold plate with an integrated vapor chamber allows for improved temperature equalization across integrated circuit dies in an integrated circuit component. The cold plate comprises a first chamber and a vapor chamber that share a common inner wall. The cold plate is attached to an integrated circuit component positioned adjacent to the vapor chamber. Heat generated by integrated circuit dies is transferred to the vapor chamber where it is absorbed by a two-phase working fluid as latent heat. Heat is removed from the vapor chamber by a cooling liquid flowing through the cold plate absorbing heat ejected from the working fluid as it condenses. The heated cooling liquid exits the cold plate at a fluid outlet. Cold plates with integrated vapor chambers can be used to equalize temperatures across multiple integrated circuit components in a similar fashion.

Abstract: Some embodiments of the invention provide a navigation application that uses a novel traffic notification scheme for providing traffic related notifications during a navigation presentation that is provided by a device. While providing a navigation presentation, the application iteratively monitors traffic conditions along the route. When traffic conditions meet a set of one or more threshold criteria, the application identifies a type of traffic notification that it should provide from several possible traffic notifications types. Next, without receiving any input from outside of the device, the application provides a traffic notification that is associated with the selected traffic notification type. In some embodiments, the traffic notification types include a notification (1) relating to traffic congestion along the current route, (2) relating to one or more faster routes that can replace the current route, and (3) regarding a road closure or extreme delay along the current route.

Abstract: A method and apparatus for integrated circuit (IC) thermal throttling is described. In one embodiment, the apparatus comprises a plurality of thermal sensors, each of the plurality of thermal sensors being located in an area in the IC to record a die temperature at a location in its associated area; and a thermal controller coupled to the plurality of thermal sensors to perform thermal throttling of the IC to reduce the temperature of the IC in response to the die temperature recorded by any one temperature sensors of the plurality of thermal sensors being greater than an individual temperature threshold for said any one temperature sensor, the individual temperature threshold for each temperature sensor being based on a maximum temperature allowed for the area in the IC in which said each thermal sensor is located and power supplied to a plurality of areas of the IC.

Abstract: A method and apparatus for integrated circuit (IC) thermal throttling is described. In one embodiment, the apparatus comprises a plurality of thermal sensors, each of the plurality of thermal sensors being located in an area in the IC to record a die temperature at a location in its associated area; and a thermal controller coupled to the plurality of thermal sensors to perform thermal throttling of the IC to reduce the temperature of the IC in response to the die temperature recorded by any one temperature sensors of the plurality of thermal sensors being greater than an individual temperature threshold for said any one temperature sensor, the individual temperature threshold for each temperature sensor being based on a maximum temperature allowed for the area in the IC in which said each thermal sensor is located and power supplied to a plurality of areas of the IC.

Abstract: Embodiments of the present disclosure provide techniques and configurations for a computing system with a thermal interface having magnetic particles. In some embodiments, the computing system may include a first part, a second part, and a thermal interface to couple the first and second parts. The thermal interface may comprise a thermal interface material having magnetic particles that are aligned in a defined direction relative to a surface of the first or second part, to provide desired thermal conductivity between the first and second parts. The defined direction of alignment of magnetic particles may comprise an alignment of the particles substantially perpendicularly to the surface of the first or second part. Other embodiments may be described and/or claimed.

Abstract: A thermal management solution may be provided for a microelectronic system including a flexible integrated heat spreader, wherein the flexible integrated heat spreader may comprise a plurality of thermally conductive structures having a flexible thermally conductive film attached to and extending between each of the plurality of thermally conductive structures. The flexible integrated heat spreader may be incorporated into multi-chip package by providing a microelectronic substrate having a plurality of microelectronic devices attached thereto and by thermally contacting each of the plurality of thermally conductive structures of the flexible integrated heat spreader to its respective microelectronic device on the microelectronic substrate.

Abstract: Embodiments of the present disclosure provide techniques and configurations for a computing system with a thermal interface having magnetic particles. In some embodiments, the computing system may include a first part, a second part, and a thermal interface to couple the first and second parts. The thermal interface may comprise a thermal interface material having magnetic particles that are aligned in a defined direction relative to a surface of the first or second part, to provide desired thermal conductivity between the first and second parts. The defined direction of alignment of magnetic particles may comprise an alignment of the particles substantially perpendicularly to the surface of the first or second part. Other embodiments may be described and/or claimed.

Abstract: A thermal management solution may be provided for a microelectronic system including a flexible integrated heat spreader, wherein the flexible integrated heat spreader may comprise a plurality of thermally conductive structures having a flexible thermally conductive film attached to and extending between each of the plurality of thermally conductive structures. The flexible integrated heat spreader may be incorporated into multi-chip package by providing a microelectronic substrate having a plurality of microelectronic devices attached thereto and by thermally contacting each of the plurality of thermally conductive structures of the flexible integrated heat spreader to its respective microelectronic device on the microelectronic substrate.

Abstract: A method and apparatus for integrated circuit (IC) thermal throttling is described. In one embodiment, the apparatus comprises a plurality of thermal sensors, each of the plurality of thermal sensors being located in an area in the IC to record a die temperature at a location in its associated area; and a thermal controller coupled to the plurality of thermal sensors to perform thermal throttling of the IC to reduce the temperature of the IC in response to the die temperature recorded by any one temperature sensors of the plurality of thermal sensors being greater than an individual temperature threshold for said any one temperature sensor, the individual temperature threshold for each temperature sensor being based on a maximum temperature allowed for the area in the IC in which said each thermal sensor is located and power supplied to a plurality of areas of the IC.

Abstract: Some embodiments of the invention provide a navigation application that uses a novel traffic notification scheme for providing traffic related notifications during a navigation presentation that is provided by a device. While providing a navigation presentation, the application iteratively monitors traffic conditions along the route. When traffic conditions meet a set of one or more threshold criteria, the application identifies a type of traffic notification that it should provide from several possible traffic notifications types. Next, without receiving any input from outside of the device, the application provides a traffic notification that is associated with the selected traffic notification type. In some embodiments, the traffic notification types include a notification (1) relating to traffic congestion along the current route, (2) relating to one or more faster routes that can replace the current route, and (3) regarding a road closure or extreme delay along the current route.

Abstract: Provided are an electronic assembly and method for forming the same, comprising a first element having a first surface and a second element having a second surface. Electrical connections are provided between the first and the second elements formed by heating solder bumps. At least one collapse limiter structure is coupled to at least one of the first and the second surfaces, wherein the at least one collapse limiter structure is between at least two of the electrical connections.

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic structures, wherein a microelectronic package may be attached to a microelectronic substrate with a hybrid solder interconnect. The hybrid solder interconnect may comprise a homogenous mixture of low temperature solder and a high temperature solder extending between at least one bond pad on a microelectronic package and at least one bond pad on a microelectronic substrate, wherein the relatively low reflow temperature used during the formation of the hybrid solder interconnect may prevent solder defects caused by warpage which may occur during the attachment of the microelectronic package to the microelectronic substrate.

Abstract: Provided are an electronic assembly and method for forming the same, comprising a first element having a first surface and a second element having a second surface. Electrical connections are provided between the first and the second elements formed by heating solder bumps. At least one collapse limiter structure is coupled to at least one of the first and the second surfaces, wherein the at least one collapse limiter structure is between at least two of the electrical connections.