Abstract: The present disclosure relates to systems and methods for managing a fleet of ridesharing vehicles. In one implementation, the system may include a communications interface configured to receive requests for shared rides from a plurality of users; a memory configured to store indications of passenger-capacity for specific ridesharing vehicles in the fleet; and at least one processor configured to receive information from the communications interface and access the memory The at least one processor may be further configured to assign, to ridesharing vehicles already transporting users, additional users for simultaneous transportation in the ridesharing vehicles; track a current utilized capacity of each specific ridesharing vehicle; and implement a threshold block that prevents assignment of additional users to a ridesharing vehicle when the ridesharing vehicle's current utilized capacity is above a threshold being less than the ridesharing vehicle's passenger-capacity.

Abstract: The present invention relates to a photon counting detector comprising a plurality of detector tiles. Each detector tile comprises a sensor material layer (20), an integrated circuit (30), an input/output connection or flex (50), a high voltage electrode or foil (60), and an anti scatter grid (10). The input/output connection or flex is connected to the integrated circuit. The integrated circuit is configured to readout signals from the sensor material layer. The anti scatter grid is positioned adjacent to a surface of the sensor material layer. The high voltage electrode or foil extends across the surface of the sensor material layer and is configured to provide a bias voltage to the surface of the sensor material layer. The high voltage electrode or foil comprises at least one tail section (70).

Abstract: The present invention relates to a photon counting detector comprising a plurality of detector tiles. Each detector tile comprises a sensor material layer (20), an integrated circuit (30), an input/output connection or flex (50), a high voltage electrode or foil (60), and an anti scatter grid (10). The input/output connection or flex is connected to the integrated circuit. The integrated circuit is configured to readout signals from the sensor material layer. The anti scatter grid is positioned adjacent to a surface of the sensor material layer. The high voltage electrode or foil extends across the surface of the sensor material layer and is configured to provide a bias voltage to the surface of the sensor material layer. The high voltage electrode or foil comprises at least one tail section (70).

Abstract: A detector signal is corrected by superimposing the detector signal with a correction signal. For providing a valid correction signal, a sampling pulse is periodically or randomly provided. The sampling pulse serves as the initiator for sampling a process signal. During the sampling, the process signal is observed. In case a pulse at the process signal is detected, the sampling is assumed as not being suitable to correct the detector signal, since the pulse affects the process signal. Otherwise, the process signal is further observed during a validation period to validate whether the sampled process value of the process signal has already been influenced by an upcoming pulse at the process signal. In case the sampling is assumed as valid, the sampled process value is used as a basis for providing the correction signal.

Abstract: The present invention relates to a detector module comprising a direct conversion crystal (10) for converting incident photons into electrical signals, said direct conversion crystal having a cathode metallization (100) deposited on a first surface and an anode metallization (101) deposited on a second surface, an integrated circuit (12) in electrical communication with said direct conversion crystal, said integrated circuit having a smaller width than said direct conversion crystal thus forming a recess (120) in width direction at a side surface of the integrated circuit, an interposer (11, 11a) arranged between said direct conversion crystal and said integrated circuit for providing electrical communication there between, wherein said interposer is made as separate element that is glued, soldered or bonded with the anode metallization (101) of said direct conversion crystal facing said integrated circuit, and a multi-lead flex cable (13, 13a, 13b, 13c, 13d) providing a plurality of output paths, said multi-

Abstract: The present disclosure relates to systems and methods for managing a fleet of ridesharing vehicles. In one implementation, the system may include a communications interface configured to receive requests for shared rides from a plurality of users; a memory configured to store indications of passenger-capacity for specific ridesharing vehicles in the fleet; and at least one processor configured to receive information from the communications interface and access the memory The at least one processor may be further configured to assign, to ridesharing vehicles already transporting users, additional users for simultaneous transportation in the ridesharing vehicles; track a current utilized capacity of each specific ridesharing vehicle; and implement a threshold block that prevents assignment of additional users to a ridesharing vehicle when the ridesharing vehicle's current utilized capacity is above a threshold being less than the ridesharing vehicle's passenger-capacity.

Abstract: The present invention relates to a detector module comprising a direct conversion crystal (10) for converting incident photons into electrical signals, said direct conversion crystal having a cathode metallization (100) deposited on a first surface and an anode metallization (101) deposited on a second surface, an integrated circuit (12) in electrical communication with said direct conversion crystal, said integrated circuit having a smaller width than said direct conversion crystal thus forming a recess (120) in width direction at a side surface of the integrated circuit, an interposer (11, 11a) arranged between said direct conversion crystal and said integrated circuit for providing electrical communication there between, wherein said interposer is made as separate element that is glued, soldered or bonded with the anode metallization (101) of said direct conversion crystal facing said integrated circuit, and a multi-lead flex cable (13, 13a, 13b, 13c, 13d) providing a plurality of output paths, said multi-

Abstract: The present invention relates to the correction of a detector signal d by superposing the detector signal with a correction signal. For providing a valid correction signal, a sampling pulse Ps is periodically or randomly provided. This sampling pulse serves as the initiator for sampling a process signal p of a process unit (14), which is configured to process the corrected detector signal. During the sampling of the process signal, the process signal is observed. In case a pulse at the process signal is detected, the sampling is assumed as not being suitable to correct the detector signal, since the pulse affects the process signal. Otherwise, namely in case such a process signal pulse does not occur during the sampling period, the process signal is further observed during a validation period, which is subsequently arranged to the sampling period.

Abstract: An automated ridesharing dispatch system includes a memory configured to store historical data associated with past demand for ridesharing vehicles in a geographical area and a communications interface. The system also includes at least one processor configured to access the memory and to use the historical data to predict imminent demand of ridesharing requests including predicting general zones in the geographical area associated with imminent demand, select a holding zone for prepositioning empty ridesharing vehicles in order to expedite satisfaction of the predicted imminent demand, and send, via the communications interface, to a mobile communications device in a specific ridesharing vehicle, instructions directing the specific ridesharing vehicle to the holding zone.

Abstract: The present invention relates to a sensor device for detecting radiation signals. To enable high signal integrity and cost efficiency while maintaining the capability of being four-sidedly buttable, the proposed sensor device comprises a sensor array (22) comprising a plurality of detectors (11, 11a-d), a sensor element (14) for converting said received radiation signals (74, 74?) into a plurality of corresponding electric signals, an interposer element (16, 16a-d) extending laterally between a first side (28) and a second side (30), and an integrated circuit element (18, 18a-d). The interposer element (16, 16a-d) comprises a front surface (24) facing said sensor element (14) and a back surface (26) parallel to said front surface (24), wherein a front contact arrangement (36) is provided on said front surface (24) for directing said electric signals to a back contact arrangement (40) provided on said back surface (26).

Abstract: The present invention generally relates to a radiation detector element wherein a photodiode is transversely fixed to a detector element substrate through at least one connection comprising two fused solder balls, wherein a first of the two fused solder balls contacts the photodiode and a second of the two fused solder balls (contacts the detector element substrate. The invention further relates to a method of transversally attaching two substrates, in particular constructing the above-mentioned radiation detector element. It also relates to an imaging system comprising at least one radiation detector element.

Abstract: The present invention relates to a sensor device for detecting radiation signals. To enable high signal integrity and cost efficiency while maintaining the capability of being four-sidedly buttable, the proposed sensor device comprises a sensor array (22) comprising a plurality of detectors (11, 11a-d), a sensor element (14) for converting said received radiation signals (74, 74?) into a plurality of corresponding electric signals, an interposer element (16, 16a-d) extending laterally between a first side (28) and a second side (30), and an integrated circuit element (18, 18a-d). The interposer element (16, 16a-d) comprises a front surface (24) facing said sensor element (14) and a back surface (26) parallel to said front surface (24), wherein a front contact arrangement (36) is provided on said front surface (24) for directing said electric signals to a back contact arrangement (40) provided on said back surface (26).

Abstract: The present invention generally relates to a radiation detector element wherein a photodiode is transversely fixed to a detector element substrate through at least one connection comprising two fused solder balls, wherein a first of the two fused solder balls contacts the photodiode and a second of the two fused solder balls (contacts the detector element substrate. The invention further relates to a method of transversally attaching two substrates, in particular constructing the above-mentioned radiation detector element. It also relates to an imaging system comprising at least one radiation detector element.

Abstract: A method includes generating higher resolution image data based on undersampled higher resolution projection data and incomplete lower resolution projection data. The undersampled higher resolution projection data and the incomplete lower resolution projection data are acquired during different acquisition intervals of the same scan. A system includes a radiation source configured to alternately modulate emission radiation flux between higher and lower fluxes during different integration periods of a scan, a detector array configured to alternately switch detector pixel multiplexing between higher and lower resolutions in coordination with modulation of the fluxes, and a reconstructor configured to reconstruct higher resolution image data based on projection data corresponding to undersampled higher resolution projection data and incomplete lower resolution projection data.

Abstract: A vertical radiation sensitive detector array (114) includes at least one detector leaf (118). The detector leaf includes a scintillator array (210, 502, 807, 907), including, at least, a top side (212) which receives radiation, a bottom side (218) and a rear side (214) and a photo-sensor circuit board (200, 803, 903), including a photo-sensitive region (202, 508, 803, 903), optically coupled to the rear side of the scintillator array. The detector leaf further includes processing electronics (406) disposed below the scintillator array, a flexible circuit board (220) electrically coupling the photo-sensitive region and the processing electronics, and a radiation shield (236) disposed below the bottom of the scintillator array, between the scintillator and the processing electronics, thereby shielding the processing electronics from residual radiation passing through the scintillator array. Some embodiments incorporate rare earth iodides such as SrI 2 (Eu).

Abstract: A detector array (110) includes a detector (112) configured to detect ionizing radiation and output a signal indicative of the detected radiation, wherein the detector at least includes a semiconductor element (118) and an illumination subsystem (120) configured to generate and transfer sub-band-gap illuminating radiation to selectively illuminate only a sub-portion of the semiconductor element in order to produce a spatially patterned illumination distribution inside the element.

Abstract: A fan-to-parallel beam re-binner includes a time deflection determiner that determines time deflections for a plurality of integration periods for different detector pixels of an imaging system, a data shifter that shifts fan beam data acquired for the integration periods by the system by time offsets corresponding to the time deflections; and a data re-sorter that parallelizes the data.

Abstract: A detector array (110) includes a detector (112) configured to detect ionizing radiation and output a signal indicative of the detected radiation, wherein the detector at least includes a semiconductor element (118) and an illumination subsystem (120) configured to generate and transfer sub-band-gap illuminating radiation to selectively illuminate only a sub-portion of the semiconductor element in order to produce a spatially patterned illumination distribution inside the element.

Abstract: A method and apparatus for detecting low and high x-ray densities is provided for use in CT imaging. Two photodetectors, one having a relatively low dynamic range and the other having a relatively high dynamic range, are coupled to the same transducer. The first photodetector may be, for example, a SiPM which is passively quenched.

Abstract: A vertical radiation sensitive detector array (114) includes at least one detector leaf (118). The detector leaf includes a scintillator array (210, 502, 807, 907), including, at least, a top side (212) which receives radiation, a bottom side (218) and a rear side (214) and a photo-sensor circuit board (200, 803, 903), including a photo-sensitive region (202, 508, 803, 903), optically coupled to the rear side of the scintillator array. The detector leaf further includes processing electronics (406) disposed below the scintillator array, a flexible circuit board (220) electrically coupling the photo-sensitive region and the processing electronics, and a radiation shield (236) disposed below the bottom of the scintillator array, between the scintillator and the processing electronics, thereby shielding the processing electronics from residual radiation passing through the scintillator array. Some embodiments incorporate rare earth iodides such as SrI 2 (Eu).