Patents by Inventor Amir Roggel

Amir Roggel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit test probe having ridge contact
    Patent number: 6759858
    Abstract: An integrated circuit die test probe has a non-flat tip. In one embodiment, the tip has an elongated pyramid shape that provides a cutting action while probing solder covered conductive pads. The tip shape helps maintain a uniform tip to pad resistance during testing by penetrating the solder layer and avoiding solder residue build up. The test probes significantly reduce the need for cleaning the probe tips to remove residue.
    Type: Grant
    Filed: October 20, 1999
    Date of Patent: July 6, 2004
    Assignee: Intel Corporation
    Inventor: Amir Roggel
  • Integrated passivation process, probe geometry and probing process
    Patent number: 6515358
    Abstract: A method of exposing a bond pad includes: providing an integrated circuit having a bond pad, a first passivation layer overlying an area portion of the bond pad, and a second passivation layer overlying the first passivation layer; removing a portion of the second passivation layer above the area portion of the bond pad exposing an area of the first passivation layer; curing the second passivation; and etching a portion of the exposed area of the first passivation layer to expose the top surface of the bond pad. A method of coupling an integrated circuit chip to a chip package is also disclosed as is a method of probing the bond pads of an integrated circuit. A probe card is further disclosed, including a probe assembly coupled to a printed circuit board, the probe assembly having a sloped sidewall portion with a plurality of probing beams extending from the sidewall portion.
    Type: Grant
    Filed: August 29, 2000
    Date of Patent: February 4, 2003
    Assignee: Intel Corporation
    Inventors: M. Lawrence A. Dass, Kenneth D. Karklin, Krishna Seshan, Amir Roggel
  • INTERGRATED CIRCUIT TEST PROBE HAVING RIDGE CONTACT
    Publication number: 20020017914
    Abstract: An integrated circuit die test probe has a non-flat tip. In one embodiment, the tip has an elongated pyramid shape that provides a cutting action while probing solder covered conductive pads. The tip shape helps maintain a uniform tip to pad resistance during testing by penetrating the solder layer and avoiding solder residue build up. The test probes significantly reduce the need for cleaning the probe tips to remove residue.
    Type: Application
    Filed: October 20, 1999
    Publication date: February 14, 2002
    Inventor: AMIR ROGGEL
  • Process for sort testing C4 bumped wafers
    Patent number: 6162652
    Abstract: A method of testing an integrated circuit device including depositing a solder bump on a surface of a bond pad on an integrated circuit device, heat treating the solder bump, and testing the integrated circuit device by probing the solder bump.
    Type: Grant
    Filed: December 31, 1997
    Date of Patent: December 19, 2000
    Assignee: Intel Corporation
    Inventors: M. Lawrence A. Dass, Amir Roggel, Krishna Seshan
  • KLXX technology with integrated passivation process, probe geometry and probing process
    Patent number: 6143668
    Abstract: A method of exposing a bond pad includes: providing an integrated circuit having a bond pad, a first passivation layer overlying an area portion of the bond pad, and a second passivation layer overlying the first passivation layer; removing a portion of the second passivation layer above the area portion of the bond pad exposing an area of the first passivation layer; curing the second passivation; and etching a portion of the exposed area of the first passivation layer to expose the top surface of the bond pad. A method of coupling an integrated circuit chip to a chip package is also disclosed as is a method of probing the bond pads of an integrated circuit. A probe card is further disclosed, including a probe assembly coupled to a printed circuit board, the probe assembly having a sloped sidewall portion with a plurality of probing beams extending from the sidewall portion.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: November 7, 2000
    Assignee: Intel Corporation
    Inventors: M. Lawrence A. Dass, Kenneth D. Karklin, Krishna Seshan, Amir Roggel