Patents by Inventor AN-HUN CHENG
AN-HUN CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240061110Abstract: A radar system includes an ultrasonic radar unit and a warning device. The ultrasonic radar unit is configured to be detachably mounted on a vehicle, and is configured to output a pairing signal when a pairing function is activated and output a warning signal upon detecting an object that is within a range. The warning device is configured to be electrically connected to the ultrasonic radar unit and to be mounted inside the vehicle. The warning device is configured to wirelessly communicate with the ultrasonic radar unit to receive the warning signal and the pairing signal; when receiving the pairing signal, couple the ultrasonic radar unit to one of a plurality of warning areas that is on the warning device according to the pairing signal; control one of the warning areas that is coupled to the ultrasonic radar unit to output a visual warning upon receiving the warning signal.Type: ApplicationFiled: July 3, 2023Publication date: February 22, 2024Inventors: TIEN-BOU WAN, CHUNG-HSIAO LO, CHIEN-LIANG PAN, AN-HUN CHENG, CHIA-HUNG WU
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Patent number: 9424076Abstract: The present invention provides a method and system for the dynamic distribution of an array in a parallel computing environment. The present invention obtains a criterion for distributing an array and performs flexible portioning based on the obtained criterion. In some embodiment analysis may be performed based on the criterion. The flexible portioning is then performed based on the analysis.Type: GrantFiled: August 30, 2013Date of Patent: August 23, 2016Assignee: The MathWorks, Inc.Inventors: Penelope Anderson, Cleve Moler, Sheung Hun Cheng, Patrick D Quillen
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Patent number: 9244729Abstract: The present invention provides a method and system for the dynamic distribution of an array in a parallel computing environment. The present invention obtains a criterion for distributing an array and performs flexible portioning based on the obtained criterion. In some embodiment analysis may be performed based on the criterion. The flexible portioning is then performed based on the analysis.Type: GrantFiled: July 31, 2013Date of Patent: January 26, 2016Assignee: The MathWorks, Inc.Inventors: Penelope Anderson, Cleve Moler, Sheung Hun Cheng, Patrick D Quillen
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Patent number: 8832177Abstract: The present invention provides a method and system for the dynamic distribution of an array in a parallel computing environment. The present invention obtains a criterion for distributing an array and performs flexible portioning based on the obtained criterion. In some embodiment analysis may be performed based on the criterion. The flexible portioning is then performed based on the analysis.Type: GrantFiled: August 30, 2013Date of Patent: September 9, 2014Assignee: The MathWorks, Inc.Inventors: Penelope Anderson, Cleve Moler, Sheung Hun Cheng, Patrick D Quillen
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Publication number: 20130299869Abstract: A light-emitting module includes a light-emitting diode package structure and an insulating support structure. The light-emitting diode package structure includes a package base and at least two leads. The package base has a first surface, and each lead has a bonding surface. The insulating support structure has a second surface and a third surface opposite to each other, and the insulating support structure is disposed under the package base, so that the first surface is in contact with the second surface. The bonding surfaces and the third surface are located in different planes.Type: ApplicationFiled: July 19, 2013Publication date: November 14, 2013Inventors: Chieh-Jen Cheng, Chia-Hun Cheng
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Patent number: 8510366Abstract: The present invention provides a method and system for the dynamic distribution of an array in a parallel computing environment. The present invention obtains a criterion for distributing an array and performs flexible portioning based on the obtained criterion. In some embodiment analysis may be performed based on the criterion. The flexible portioning is then performed based on the analysis.Type: GrantFiled: June 17, 2011Date of Patent: August 13, 2013Assignee: The MathWorks, Inc.Inventors: Penelope Anderson, Cleve Moler, Sheung Hun Cheng, Patrick D. Quillen
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Patent number: 8376604Abstract: A frame structure of a backlight module includes a body and a mold frame. A side wall surrounds a bearing surface of the body, and the side wall has at least one stopper and at least one positioning hole. A side edge of the mold frame has at least one positioning post. When the mold frame is disposed on the side wall, the side edge of the mold frame leans against the stopper, and the positioning post of the mold frame is embedded in the positioning hole.Type: GrantFiled: October 4, 2010Date of Patent: February 19, 2013Assignee: AU Optronics CorpInventors: Ming-Ji Hsu, Chia-Hun Cheng, Chieh-Jen Cheng, Hsin-An Chang
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Patent number: 8345179Abstract: A flat panel display module is introduced herein, which principally includes an upper bezel, a liquid crystal panel, a frame, an optical film set and a printed circuit board assembly (PCBA), wherein various types electrical components mounted on the PCBA are capable of being completely or mostly accommodated within a caved structure constructed within the inside of the flat panel display module so as to reduce a thickness of the whole flat panel display module. Simultaneously, a better structural strength for the whole flat panel display module can be achieved therefore by closely stacking up the above-mentioned elements of the whole flat panel display module.Type: GrantFiled: October 19, 2009Date of Patent: January 1, 2013Assignee: AU Optronics Corp.Inventors: Yao-An Mo, Chieh-Jen Cheng, Chia-Chang Yang, Hsin-An Chang, Chia-Hun Cheng
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Publication number: 20120161191Abstract: A light-emitting module includes a light-emitting diode package structure and an insulating support structure. The light-emitting diode package structure includes a package base and at least two leads. The package base has a first surface, and each lead has a bonding surface. The insulating support structure has a second surface and a third surface opposite to each other, and the insulating support structure is disposed under the package base, so that the first surface is in contact with the second surface. The bonding surfaces and the third surface are located in different planes.Type: ApplicationFiled: June 16, 2011Publication date: June 28, 2012Inventors: Chieh-Jen Cheng, Chia-Hun Cheng
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Patent number: 8064007Abstract: The present disclosure is a backlight module including a light guide plate, a supporter, and a light source module. The light guide plate has a light incident side. The supporter has a bottom plate, a sidewall, and a top plate corresponding to the bottom plate. The bottom plate extends from a first end of the sidewall toward the light guide plate, and the top plate extends along a second end of the sidewall toward the light guide plate. The length of the sidewall is longer than the length of the top plate, such that the top plate corresponding to the sidewall forms at least one breach to expose the second end of the sidewall. The bottom plate, the top plate, and the sidewall together form an accommodating space, and the light incident side of the light guide plate is disposed between the top plate and the bottom plate. The light source module is disposed in the accommodating space and partially exposed through the at least one breach.Type: GrantFiled: November 16, 2009Date of Patent: November 22, 2011Assignee: AU Optronics CorporationInventors: Yao-An Mo, Ta-Jen Huang, Kang-Wei Cheng, Hsin-An Chang, Chia-Hun Cheng, Chieh-Jen Cheng
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Patent number: 8049834Abstract: A display device and a backlight module thereof are provided. The display device further includes a display panel having a display area. The backlight module is disposed under the display panel and includes a light source holder, a light source, and a light guide plate. The light source holder has a sidewall, a top plate, and a bottom plate, wherein the bottom plate partially overlaps the display area of the display device. The light guide plate is disposed corresponding to the display area of the display device and has one end located in an opening between the top plate and the bottom plate. A thermal isolating layer is interposed between the light guide plate and a portion of the bottom plate which corresponds to the display area. The perpendicular distance between the light guide plate and the portion of the bottom plate overlapping the thermal isolating layer is greater than a perpendicular distance between the light guide plate and the other portion of the bottom plate.Type: GrantFiled: November 17, 2009Date of Patent: November 1, 2011Assignee: Au Optronics CorporationInventors: Yao-An Mo, Chieh-Jen Cheng, Hsin-An Chang, Chia-Hun Cheng, Hung-Chuo Lee
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Patent number: 7987227Abstract: The present invention provides a method and system for the dynamic distribution of an array in a parallel computing environment. The present invention obtains a criterion for distributing an array and performs flexible portioning based on the obtained criterion. In some embodiment analysis may be performed based on the criterion. The flexible portioning is then performed based on the analysis.Type: GrantFiled: May 12, 2010Date of Patent: July 26, 2011Assignee: The MathWorks, Inc.Inventors: Penelope Anderson, Cleve Moler, Sheung Hun Cheng, Patrick D. Quillen
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Publication number: 20110085353Abstract: A frame structure of a backlight module includes a body and a mold frame. A side wall surrounds a bearing surface of the body, and the side wall has at least one stopper and at least one positioning hole. A side edge of the mold frame has at least one positioning post. When the mold frame is disposed on the side wall, the side edge of the mold frame leans against the stopper, and the positioning post of the mold frame is embedded in the positioning hole.Type: ApplicationFiled: October 4, 2010Publication date: April 14, 2011Applicant: AU OPTRONICS CORPORATIONInventors: Ming Ji Hsu, Chia Hun Cheng, Chieh Jen Cheng, Hsin An Chang
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Publication number: 20110019121Abstract: A flat panel display module is introduced herein, which principally includes an upper bezel, a liquid crystal panel, a frame, an optical film set and a printed circuit board assembly (PCBA), wherein various types electrical components mounted on the PCBA are capable of being completely or mostly accommodated within a caved structure constructed within the inside of the flat panel display module so as to reduce a thickness of the whole flat panel display module. Simultaneously, a better structural strength for the whole flat panel display module can be achieved therefore by closely stacking up the above-mentioned elements of the whole flat panel display module.Type: ApplicationFiled: October 19, 2009Publication date: January 27, 2011Applicant: AU Optronics Corp.Inventors: Yao-An Mo, Chieh-Jen Cheng, Chia-Chang Yang, Hsin-An Chang, Chia-Hun Cheng
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Publication number: 20100245716Abstract: A display device and a backlight module thereof are provided. The display device further includes a display panel having a display area. The backlight module is disposed under the display panel and includes a light source holder, a light source, and a light guide plate. The light source holder has a sidewall, a top plate, and a bottom plate, wherein the bottom plate partially overlaps the display area of the display device. The light guide plate is disposed corresponding to the display area of the display device and has one end located in an opening between the top plate and the bottom plate. A thermal isolating layer is interposed between the light guide plate and a portion of the bottom plate which corresponds to the display area. The perpendicular distance between the light guide plate and the portion of the bottom plate overlapping the thermal isolating layer is greater than a perpendicular distance between the light guide plate and the other portion of the bottom plate.Type: ApplicationFiled: November 17, 2009Publication date: September 30, 2010Applicant: AU OPTRONICS CORPORATIONInventors: Yao-An Mo, Chieh-Jen Cheng, Hsin-An Chang, Chia-Hun Cheng, Hung-Chuo Lee
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Patent number: 7743087Abstract: The present invention provides a method and system for the dynamic distribution of an array in a parallel computing environment. The present invention obtains a criterion for distributing an array and performs flexible portioning based on the obtained criterion. In some embodiment analysis may be performed based on the criterion. The flexible portioning is then performed based on the analysis.Type: GrantFiled: March 22, 2006Date of Patent: June 22, 2010Assignee: The Math Works, Inc.Inventors: Penelope Anderson, Cleve Moler, Sheung Hun Cheng, Patrick D. Quillen
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Publication number: 20100123851Abstract: The present disclosure is a backlight module including a light guide plate, a supporter, and a light source module. The light guide plate has a light incident side. The supporter has a bottom plate, a sidewall, and a top plate corresponding to the bottom plate. The bottom plate extends from a first end of the sidewall toward the light guide plate, and the top plate extends along a second end of the sidewall toward the light guide plate. The length of the sidewall is longer than the length of the top plate, such that the top plate corresponding to the sidewall forms at least one breach to expose the second end of the sidewall. The bottom plate, the top plate, and the sidewall together form an accommodating space, and the light incident side of the light guide plate is disposed between the top plate and the bottom plate. The light source module is disposed in the accommodating space and partially exposed through the at least one breach.Type: ApplicationFiled: November 16, 2009Publication date: May 20, 2010Applicant: AU OPTRONICS CORPORATIONInventors: Yao-An Mo, Ta-Jen Huang, Kang-Wei Cheng, Hsin-An Chang, Chia-Hun Cheng, Chieh-Jen Cheng
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Publication number: 20090188657Abstract: A combined assembly of a fixing base and heat pipes includes a fixing base and at least one heat pipe. The fixing base has a plate body. The bottom surface of the plate body is formed with a transverse opening trough. The opening trough is provided with a through-hole penetrating the plate body. A longitudinal groove is provided in the opening trough at a position corresponding to that of the through-hole. One end of the longitudinal groove does not penetrate the plate body and is formed into a loose-proof section on the bottom section of the opening trough. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-releasing section penetrates to the outside of the through-hole, and the heat-absorbing section is accommodated in the opening trough. A portion of the heat-absorbing section is inserted into the longitudinal groove and stopped by the loose-proof section, and the other portion thereof is formed with a plane that is in flush with the bottom surface of the plate body.Type: ApplicationFiled: April 6, 2009Publication date: July 30, 2009Inventors: Chi-Hun Cheng, Ken Hsu