Abstract: A method of controlling shrinkage in aligned green tape stacks during firing comprises providing a topmost layer of a ceramic material having a sintering temperature higher than that of the ceramic used to make the green tapes and firing above the sintering temperature of the green tape ceramic but below the sintering temperature of the topmost layer ceramic. The method of the invention provides improved shrinkage control for green tape stacks on a support substrate.

Abstract: High magnesium-content magnesium aluminosilicate glasses are used to form green tape compositions that are fired stepwise, i.e., first to about 500.degree. C. to remove organic materials, then to a temperature 10-30.degree. C. above the glass transition temperature for a time sufficient to nucleate the glass, and finally to a higher temperature near but below the softening temperature to complete crystallization of the glass. The resultant glass-ceramic may include substantial amounts of the forsterite crystalline phase. Multilayer ceramic printed circuit boards are made that are useful for high frequency, microwave applications. The fired high magnesium oxide content glasses have low dielectric constant and low dissipation loss factors, and they have a thermal coefficient of expansion that is compatible with metal or ceramic support substrates that impart mechanical strength to the printed circuit boards and that are thermally conductive. The boards are compatible with gallium arsenide devices.

Abstract: High magnesium-content magnesium aluminosilicate glasses are used to form green tape compositions that are fired stepwise, i.e., first to about 500.degree. C. to remove organic materials, then to a temperature 10-30.degree. C. above the glass transition temperature for a time sufficient to nucleate the glass, and finally to a higher temperature near but below the softening temperature to complete crystallization of the glass. The resultant glass-ceramic may include substantial amounts of the forsterite crystalline phase. Multilayer ceramic printed circuit boards are made that are useful for high frequency, microwave applications. The fired high magnesium oxide content glasses have low dielectric constant and low dissipation loss factors, and they have a thermal coefficient of expansion that is compatible with metal or ceramic support substrates that impart mechanical strength to the printed circuit boards and that are thermally conductive. The boards are compatible with gallium arsenide devices.

Abstract: A method of controlling shrinkage in aligned green tape stacks during firing comprises providing a topmost layer of a ceramic material having a sintering temperature higher than that of the ceramic used to make the green tapes and firing above the sintering temperature of the green tape ceramic but below the sintering temperature of the topmost layer ceramic. The method of the invention provides improved shrinkage control for green tape stacks on a support substrate.

Abstract: A package for an electronic component includes a metal base plate and a body of an insulating material, such as glass or ceramic, on and bonded to a surface of the base plate. The body is formed of a plurality of layers of the insulating material stacked and bonded to each other and has at least one opening extending therethrough to the base plate. Strips of a conductive material, such as a metal, are on the surface of various layers of the body. An electronic component is mounted in the opening in the body and has terminals which are electrically connected to the conductive strips on the body, preferably by wires. Vias of a conductive material may extend through some of the layers of the body to connect the conductive strips to terminals on the surface of the body. A cover plate of an insulating material may extend over the body and the opening therein to enclose the electronic component in the body.

Abstract: Electrical feedthroughs in printed circuit board support substrates for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide and one or more layers of glass, and then filling the remainder of the feedthroughs with a conductive metal via fill ink. After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate.

Abstract: Electrical feedthroughs in printed circuit board support substrates for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide and one or more layers of glass, and then filling the remainder of the feedthroughs with a conductive metal via fill ink. After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate.

Abstract: There is disclosed the enhancement of the removal of carbon from multilayer ceramic substrate laminate during the sintering thereof. A multilayer ceramic substrate laminate having metallic lines and vias is provided with a reducible metal oxide in close proximity to the substrate laminate. The multilayer ceramic substrate laminate contains a polymeric binder which upon heating depolymerizes into carbon. The substrate laminate is sintered in an atmosphere which is reducing with respect to the reducible metal oxide and which is oxidizing with respect to the carbon.