Abstract: A mold frame for the production of molded pieces, comprising at least one mold cavity, the at least one mold cavity being defined by a plurality of mold walls, wherein at least one mold wall of the mold cavity is a mold wall that is displaceably attached to the mold frame, and comprising at least one heating element for heating at least a part of the mold frame.

Abstract: A mold frame for the production of molded pieces, comprising at least one mold cavity, the at least one mold cavity being defined by a plurality of mold walls, wherein at least one mold wall of the mold cavity is a mold wall that is displaceably attached to the mold frame, and comprising at least one heating element for heating at least a part of the mold frame.

Abstract: A concrete mold including a mold frame with a frame body and at least two rows of teeth formed on the frame body lying opposite one another and in each case facing a mold insert. The mold insert has an insert body and at least two rows of teeth arranged on the insert body lying opposite one another and in each case facing the mold frame. Recesses are in each case formed on the insert body between teeth of its rows of teeth, in which recesses teeth of the rows of teeth of the frame body in each case engage in the assembled state of the mold. Recesses are in each case formed on the frame body between the teeth of its rows of teeth, in which recesses the teeth of the rows of teeth of the insert body in each case engage in the assembled state of the mold.

Abstract: In summary, the invention concerns a mold frame for the production of molded pieces, comprising: at least one mold cavity, the at least one mold cavity being defined by a plurality of mold walls, wherein at least one mold wall of the mold cavity is a mold wall that is displaceably attached to the mold frame.

Abstract: In summary, the invention concerns a mold frame for the production of molded pieces, comprising: at least one mold cavity, the at least one mold cavity being defined by a plurality of mold walls, wherein at least one mold wall of the mold cavity is a mold wall that is displaceably attached to the mold frame.

Abstract: In various embodiments, an alignment mark arrangement may include a plurality of alignment marks disposed next to each other in a row, wherein at least one of the following holds true: a first alignment mark of the plurality of alignment marks has a first width and a second alignment mark of the plurality of alignment marks has a second width that is different from the first width; a first pair of neighboring alignment marks of the plurality of alignment marks is arranged at a first pitch and a second pair of neighboring alignment marks of the plurality of alignment marks is arranged at a second pitch that is different from the first pitch.

Abstract: A method for diagnosing a state in a vehicle, which has a CAN communications bus to which electronic control units of the vehicle are connected, includes providing a rest state of the vehicle; coupling a diagnostic testing device to at least one diagnostic terminal of the vehicle; monitoring of the CAN communications bus by the diagnostic testing device with regard to CAN messages sent out after entry into the rest state; detecting of a CAN message sent out on the CAN communications bus after entry into the rest state, and assigning of the detected CAN message to an electronic control unit sending out the CAN message; providing information regarding a chronological appearance of the detected CAN message in a series of CAN messages appearing on the CAN communications bus after entry into the rest state; and providing information for identifying the electronic control unit sending out the detected CAN message.

Abstract: The present invention relates to a mold and a pressure piece for producing molded bricks, in particular molded concrete bricks, a process for producing this mold or this pressure piece, an apparatus for producing molded bricks, a vibratable base for producing molded bricks, a metal drawing sheet for producing molded bricks, and also the use of a coating comprising an antiwear matrix and an antiadhesion component for surfaces of molds and/or pressure pieces and/or vibratable bases and/or metal drawing sheets used for producing molded bricks.

Abstract: A method for diagnosing a state in a vehicle, which has a CAN communications bus to which electronic control units of the vehicle are connected, includes providing a rest state of the vehicle; coupling a diagnostic testing device to at least one diagnostic terminal of the vehicle; monitoring of the CAN communications bus by the diagnostic testing device with regard to CAN messages sent out after entry into the rest state; detecting of a CAN message sent out on the CAN communications bus after entry into the rest state, and assigning of the detected CAN message to an electronic control unit sending out the CAN message; providing information regarding a chronological appearance of the detected CAN message in a series of CAN messages appearing on the CAN communications bus after entry into the rest state; and providing information for identifying the electronic control unit sending out the detected CAN message.

Abstract: In various embodiments, an alignment mark arrangement may include a plurality of alignment marks disposed next to each other in a row, wherein at least one of the following holds true: a first alignment mark of the plurality of alignment marks has a first width and a second alignment mark of the plurality of alignment marks has a second width that is different from the first width; a first pair of neighboring alignment marks of the plurality of alignment marks is arranged at a first pitch and a second pair of neighboring alignment marks of the plurality of alignment marks is arranged at a second pitch that is different from the first pitch.

Abstract: An alignment mark may include: an elongate pattern having first and second end portions and a central portion located between the first and second end portions, wherein at least one of the first and second end portions has a larger width than the central portion.

Abstract: An apparatus includes a substrate and a photoresist material structure arranged adjacent to the substrate so that a cavity is formed between the substrate and the photoresist material structure. The cavity has an opening. The photoresist material structure includes a frame portion disposed on a main side of the substrate and a cap portion spanning over a part of the main side of the substrate at a distance to the main side. The cap portion is formed in the first photoresist layer and the frame portion is formed in the second photoresist layer.

Abstract: An apparatus includes a substrate and a photoresist material structure arranged adjacent to the substrate so that a cavity is formed between the substrate and the photoresist material structure. The cavity has an opening. The photoresist material structure includes a frame portion disposed on a main side of the substrate and a cap portion spanning over a part of the main side of the substrate at a distance to the main side. The cap portion is formed in the first photoresist layer and the frame portion is formed in the second photoresist layer.

Abstract: A multichip module for leads-on-chip mounting is described. The multichip module has a lead-frame, a common, contiguous part of a wafer slice disposed in the lead-frame, and a number of semiconductor chips disposed next to one another in the lead-frame. At least some of the semiconductor chips disposed in the lead-frame are disposed on the common, contiguous part of the wafer slice.

Abstract: The invention relates to a plastic package (14) with a plurality of semiconductor chips (3) and also a wiring board (11), on which the semiconductor chips (3) are arranged, and to an injection mold for producing the plastic package (14) and also to an electronic component which can be produced with the aid of the combination of the injection mold, wiring board (11) and plastic package (14). Furthermore, the invention relates to a method which, using the wiring board (11) according to the invention and the two-part injection mold, makes it possible to produce a plastic package (14) of this type with a plurality of semiconductor chips (3) for a plurality of electronic components.

Abstract: An electronic device having stacked modules and method for producing it are described. Each module has a chip. Each chip is mounted on a stack intermediate plane. The stack intermediate planes of a stack have identical layouts, while chip select circuits which can be set irreversibly via contact areas are disposed on the chips, which chip select circuits enable an irreversible assignment of the contact areas to the stack intermediate planes.

Abstract: The leadframe interposer is provided with an upset which is formed by shaping in a central region and enlarges the vertical dimension of the interposer there in such a way that, during the assembly of a housing stack of a plurality of semiconductor chips, the upset presses against a topside or underside of a chip housing in such a way that a compensating torque is exerted on the interposer, which prevents a possible strain or deformation when the leads are pressed onto the contact regions of the interposer. The contact regions are laterally offset with respect to one another.

Abstract: A configuration of at least two TSOP memory chip housings stacked one on another, is described. Each of the TSOP memory chip housings has at least one memory chip with a number of pins disposed in an interior of the TSOP memory chip housing. The pins leading out of a respective TSOP memory chip housing and, via a rewiring configuration, are connected to pins leading out of a respectively directly adjacent TSOP memory chip housing of the same TSOP memory chip housing stack. In order to be able to produce such a housing stack as cost-effectively and simply as possible by an automated mounting method, the rewiring configuration is implemented in the form of leadframes respectively disposed between or at the side between the individual TSOP memory chip housings.

Abstract: A multichip module for leads-on-chip mounting is described. The multichip module has a lead-frame, a common, contiguous part of a wafer slice disposed in the lead-frame, and a number of semiconductor chips disposed next to one another in the lead-frame. At least some of the semiconductor chips disposed in the lead-frame are disposed on the common, contiguous part of the wafer slice.