Patents by Inventor Andrew D. Delano

Andrew D. Delano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11930616
    Abstract: A thermal component has a shield portion and a heat exchanger portion. The shield portion includes a plurality of cells adapted to inhibit radio radiation (RF) having a frequency within a target frequency range, while the heat exchanger portion includes a plurality of elongated channels, each one of the elongated channels being physically connected to and in fluid communication with at least one corresponding cell of the plurality of cells.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: March 12, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Rob Huala, Nanqiang Zhu, Donovan D. Van Sleet, Aaron Ray Paff, Andrew Douglas Delano, Patrick Stephen Johnson
  • Patent number: 11477352
    Abstract: Embodiments enable an accessory device coupled to a parent device to transfer heat directly to the parent device via convection thereby enabling the parent device to help cool the accessory device. The electronic device includes a device body housing coupled to and housing a heat-generating component, a device foot coupled to an exterior surface of the device body housing and a first mating element. The parent device includes a planar mounting surface, and a second mating element adapted to engage with the first mating element of the accessory device to mount the accessory device to the parent device, and brings the planar portion of the device foot housing into contact with the planar mounting surface. The heat-generating component is thermally coupled to the parent device via a thermal circuit comprising the device body house, the device foot, the planar portion thereof, and the planar mounting surface of the parent device.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: October 18, 2022
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Lalit Anil Palve, Rhishikesh A. Sathe, Andrew D. Delano
  • Publication number: 20220326591
    Abstract: Embodiments enable an accessory device coupled to a parent device to transfer heat directly to the parent device via convection thereby enabling the parent device to help cool the accessory device. The electronic device includes a device body housing coupled to and housing a heat-generating component, a device foot coupled to an exterior surface of the device body housing and a first mating element. The parent device includes a planar mounting surface, and a second mating element adapted to engage with the first mating element of the accessory device to mount the accessory device to the parent device, and brings the planar portion of the device foot housing into contact with the planar mounting surface. The heat-generating component is thermally coupled to the parent device via a thermal circuit comprising the device body house, the device foot, the planar portion thereof, and the planar mounting surface of the parent device.
    Type: Application
    Filed: April 9, 2021
    Publication date: October 13, 2022
    Inventors: Lalit Anil PALVE, Rhishikesh A. SATHE, Andrew D. DELANO
  • Patent number: 10321615
    Abstract: Described herein is a display module for an electronic device having a thermal management structure integrated on a backside of the display module. Also described herein are techniques for manufacturing a display module with an integrated thermal management structure. By integrating the thermal management structure on the backside of the display module, the display module itself becomes a passive thermal management solution for an electronic device. Accordingly, the thermal management structure described herein can be considered a part of the display component stack.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: June 11, 2019
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Taylor Stellman, Andrew D. Delano, Lincoln Ghioni, Kurt A. Jenkins
  • Publication number: 20170367214
    Abstract: Described herein is a display module for an electronic device having a thermal management structure integrated on a backside of the display module. Also described herein are techniques for manufacturing a display module with an integrated thermal management structure. By integrating the thermal management structure on the backside of the display module, the display module itself becomes a passive thermal management solution for an electronic device. Accordingly, the thermal management structure described herein can be considered a part of the display component stack.
    Type: Application
    Filed: June 16, 2016
    Publication date: December 21, 2017
    Inventors: Taylor Stellman, Andrew D. Delano, Lincoln Ghioni, Kurt A. Jenkins
  • Patent number: 9803125
    Abstract: A thermal interface material comprises a polymeric elastomer material, a thermally conductive filler, and a coupling agent, along with other optional components.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: October 31, 2017
    Assignee: Honeywell International Inc.
    Inventors: Natalie A. Merrill, Andrew D. Delano, David E. Steele
  • Patent number: 9639125
    Abstract: Disclosed herein are computing devices, and methods of manufacturing computing devices, that have a cooling fan and integrated thermal transfer unit. A centrifugal fan unit includes a rotatable hub, a plurality of blades disposed on the rotatable hub, and a motor coupled to the rotatable hub. The motor causes the rotatable hub to rotate about an axis such that airflow proceeds outward from the centrifugal fan unit along trajectories that are perpendicular to the axis. One or more thermal transfer units have first portions that are coupled to the one or more heat sources and second portions that collectively at least partially surround the centrifugal fan unit.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: May 2, 2017
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Andrew D. Delano, Taylor Stellman, Andrew W. Hill
  • Publication number: 20160237332
    Abstract: A thermal interface material comprises a polymeric elastomer material, a thermally conductive filler, and a coupling agent, along with other optional components.
    Type: Application
    Filed: April 27, 2016
    Publication date: August 18, 2016
    Inventors: Natalie A. Merrill, Andrew D. Delano, David E. Steele
  • Patent number: 9311909
    Abstract: Sounds sensed by a microphone of a device include sounds from a cooling fan of the device that varies based on the speed of the cooling fan, and other sounds used by a program of the device such as voice inputs. The sound level of sounds used by the program is determined, and the speed of the fan is adjusted so that a desired cooling level is attained while keeping the fan speed low enough that the noise from the fan does not interfere with the sounds used by the program.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: April 12, 2016
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Edward C. Giaimo, III, Yi He, Duane Martin Evans, Andrew D. Delano
  • Publication number: 20150116928
    Abstract: Disclosed herein are computing devices, and methods of manufacturing computing devices, that have a cooling fan and integrated thermal transfer unit. A centrifugal fan unit includes a rotatable hub, a plurality of blades disposed on the rotatable hub, and a motor coupled to the rotatable hub. The motor causes the rotatable hub to rotate about an axis such that airflow proceeds outward from the centrifugal fan unit along trajectories that are perpendicular to the axis. One or more thermal transfer units have first portions that are coupled to the one or more heat sources and second portions that collectively at least partially surround the centrifugal fan unit.
    Type: Application
    Filed: October 31, 2013
    Publication date: April 30, 2015
    Applicant: Microsoft Corporation
    Inventors: Andrew D. Delano, Taylor Stellman, Andrew W. Hill
  • Publication number: 20140094973
    Abstract: Sounds sensed by a microphone of a device include sounds from a cooling fan of the device that varies based on the speed of the cooling fan, and other sounds used by a program of the device such as voice inputs. The sound level of sounds used by the program is determined, and the speed of the fan is adjusted so that a desired cooling level is attained while keeping the fan speed low enough that the noise from the fan does not interfere with the sounds used by the program.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 3, 2014
    Applicant: MICROSOFT CORPORATION
    Inventors: Edward C. Giaimo, III, Yi He, Duane Martin Evans, Andrew D. Delano
  • Publication number: 20140041827
    Abstract: Techniques involving management of a heat transfer device are described. In one or more implementations, a device includes a housing, a heat-generating device disposed within the housing, and a heat transfer device disposed within the housing. The heat transfer device has a powered active cooling device. The device also includes one or more modules that are configured to adjust operation of the powered active cooling device based on a likely orientation of the heat transfer device.
    Type: Application
    Filed: August 8, 2012
    Publication date: February 13, 2014
    Inventors: Edward C. Giaimo, III, Yi He, Robert D. Young, Andrew D. Delano
  • Publication number: 20100129648
    Abstract: Electronic components described herein include a heat generating component surface; a heat sink having a top surface and a bottom surface; and a thermal interface material comprising a phase change material, wherein the heat generating component surface is coupled to the bottom surface of the heat sink by the thermal interface material. Methods of forming an electronic component include: a) providing a heat-generating component surface; b) providing at least one thermal interface material; c) providing a heat sink component having a top surface and a bottom surface; d) depositing the at least one thermal interface material onto at least part of at least one of the surfaces of the heat sink component, and e) coupling the surface of the heat sink component with the thermal interface material layer with the heat generating component surface to produce the electronic component.
    Type: Application
    Filed: November 26, 2008
    Publication date: May 27, 2010
    Inventors: Jun Xu, Andrew D. Delano
  • Publication number: 20100112360
    Abstract: A layered thermal interface system is described herein that comprises: at least one deposition layer of metal, at least one layer of thermal interface material, at least one plated layer of metal, and at least one heat spreader. Another layered thermal interface system is described herein that comprises: a silicon layer, at least one deposition layer of metal, at least one layer of thermal interface material, at least one plated layer of metal, and at least one heat spreader Methods of forming contemplated layered thermal system comprise: a) providing at least one deposition layer of metal, b) providing at least one plated layer of metal, c) providing at least one thermal interface material, and d) layering the at least one deposition layer of metal, the at least one thermal interface material, and the at least one plated layer of metal to produce the layered thermal system.
    Type: Application
    Filed: October 31, 2008
    Publication date: May 6, 2010
    Inventor: Andrew D. Delano
  • Patent number: 7480143
    Abstract: A method of transferring heat from a heat source to a heat sink using a variable-gap thermal-interface device is provided. The method comprises providing and rotating a multi-axis rotary spherical joint to an orientation to compensate for misalignment between the heat source and heat sink. The method further comprises providing a shim of thickness sufficient to fill a gap between the heat source and multi-axis rotary spherical joint, and inserting the shim to fill the gap.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: January 20, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Andrew D. Delano, Brandon A. Rubenstein, Eugene Miksch
  • Patent number: 7344384
    Abstract: Systems, methodologies, methods of manufacture, and other embodiments associated with semiconductor/processor module assemblies are described. One exemplary system embodiment includes a bolster plate assembly for a semiconductor module assembly that includes a bolster plate and a leaf spring pre-loaded onto the bolster plate. The example system may also include the leaf spring being releasably attached to the bolster plate and positioned to provide a force in a direction generally away from the bolster plate. The leaf spring can be configured to release from the bolster plate upon attaching the semiconductor module assembly to the bolster plate that causes the leaf spring to exert the force in the direction generally away from the bolster plate and against a semiconductor module assembly.
    Type: Grant
    Filed: October 25, 2004
    Date of Patent: March 18, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Brandon Aaron Rubenstein, Andrew D. Delano, Bradley E. Clements
  • Publication number: 20080050974
    Abstract: A multi-directional electrical interconnect device having mating male and female terminals disposed in, attached to, or coupled to male and female housings. The housings and terminals are configured to allow mating at any angle between two orthogonal directions, i.e., from either of two directions that are disposed at 90 degrees relative to one another, or any angle therebetween.
    Type: Application
    Filed: August 27, 2006
    Publication date: February 28, 2008
    Inventor: Andrew D. Delano
  • Publication number: 20080047694
    Abstract: Liquid heat exchangers and methods for removing heat from a central processing unit. An exemplary heat exchanger comprises a body having an open cavity whose periphery is sealable to the central processing unit from which heat is to be removed, a cooling liquid inlet port coupled through the body to the open cavity, and a liquid outlet port coupled through the body to the open cavity. Cooling liquid is pumped through the cavity when the body is sealed to the central processing unit, thereby contacting the central processing unit and removing heat from the central processing unit. A plurality of heat conducting elements may be provided that extend from an inner surface of the body into the open cavity, at least some of which have a length that is operative to contact the central processing unit. The heat conducting elements allow convective cooling of the central processing unit.
    Type: Application
    Filed: August 27, 2006
    Publication date: February 28, 2008
    Inventors: Andrew D. Delano, Christian L. Belady
  • Patent number: 7120023
    Abstract: A variable-height thermal-interface assembly for transferring heat from a heat source to a heat sink comprises a slidable interface between two contacting surfaces, the slidable interface inclined diagonally relative to the z-axis. The two contacting surfaces slide relative to one another parallel to the incline direction to provide z-axis expansion of the assembly. The assembly further comprises a spring clip, which when released applies a shear force across the slidable interface, causing the two contacting surfaces to slide relative to one another, coupling the sliding to provide z-axis expansion. The assembly further comprises a reversible locking device, which when locked prevents the two contacting surfaces from sliding relative to one another, such that the spring clip remains retracted, and when unlocked allows the two contacting surfaces to slide relative to one another, such that the spring clip is released.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: October 10, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Joseph M. Whit, Andrew D. Delano
  • Patent number: 6985359
    Abstract: A variable-gap thermal-interface device for transferring heat from a heat source to a heat sink is provided. The device comprises a multi-axis rotary spherical joint comprising a spherically concave surface having a first radius of curvature in slideable contact with a spherically convex surface having the same first radius of curvature. The device further comprises a block having a proximal end rotatably coupled with the heat sink through the rotary spherical joint and having a distal end opposite the proximal end. The device further comprises a wedge having a variable thickness separating a first surface and a second surface opposite and inclined relative to the first surface, such that the first surface is thermally coupled with the distal end of the block, and the second surface is thermally coupled with the heat source.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: January 10, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Andrew D. Delano, Bradley E. Clements, Brandon A. Rubenstein