Patents by Inventor Andrew J. Ries

Andrew J. Ries has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150196867
    Abstract: Frame structures, assemblies and methods for use in implantable medical devices. The frames may include one or more first polymeric portions and one or more second polymeric portions coupled to the one or more first polymeric portions. The one or more first polymeric portions may have a higher durometer than the one or more second polymeric portions. The one or more second polymeric portions may provide an interference fit between the one or more second polymeric portions and the housing and/or between the one or more second polymeric portions and one or more components disposed in the housing.
    Type: Application
    Filed: January 9, 2015
    Publication date: July 16, 2015
    Inventors: Andrew J. Ries, SuPing Lyu, Catherine M. Asgian, David Engmark, Ananta Pandey, Todd Schaefer, Erik Scott, Joachim Hossick-Schott
  • Patent number: 9079014
    Abstract: A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: July 14, 2015
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
  • Publication number: 20150165196
    Abstract: An implantable medical device includes two conductive enclosures that are attached together, wherein the first enclosure contains electronics, and the second enclosure contains a power source. The second enclosure, all or a portion of which is located outside the first enclosure, includes an inner layer, an outer layer, and a header plate, all of which are configured to provide redundant sealing for the power source. The inner and outer layers, formed by separate metal sheets nested one within the other, are preferably in direct mechanical and electrical contact. The first sheet, which forms the inner layer, approximately conforms to a profile of the power source, located therein, and the second sheet, which forms the outer layer, conforms to a profile of the first sheet. An insulative housing, which contains connector contacts of the device, is directly secured to the first and second conductive enclosures, for example, by mounting brackets.
    Type: Application
    Filed: February 13, 2014
    Publication date: June 18, 2015
    Inventors: Andrew J. Ries, Terrence J. Snyder, Iryna M. Levina, Robert A. Munoz, Eric J. Wengreen, John E. Lovins
  • Patent number: 8996113
    Abstract: Systems and techniques that enable a user to selectively extend the time prior to providing an indication of power source depletion, e.g., allow an extended the recommended replacement time (RRT) prior to providing an elective replacement indication (ERI), are described. The user provides input, which may indicate an acceptable level of implantable medical device performance, e.g., that lesser performance for a period between a default RRT and an extended RRT is acceptable. In response to the input, the time until providing an RRT/ERI notification, or some other indication of depletion of the implantable medical device power source, may be extended.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: March 31, 2015
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, Craig L. Schmidt
  • Patent number: 8945451
    Abstract: Methods for forming an insulative body of an implantable medical device connector module assembly employ an injection molding process, whereby first and second shots of insulative material form core and an overlay portions, respectively. In some methods, a panel portion of an electrical component is mounted between opposing surfaces of a mold such that a finger-like portion of the component extends into a cavity of the mold, with a first side thereof touching another surface of the mold and a second, opposite side exposed within the cavity; following first shot injection, the core portion captures the finger-like portion in relatively rigid relation thereto. When two types of connector bores are formed, a color indicator may be engaged with a feature of the core portion that is located in proximity to a connector bore of the first type, and then the overlay portion is formed over the indicator.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: February 3, 2015
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
  • Publication number: 20150030913
    Abstract: A battery having an electrode assembly located in a housing that efficiently utilizes the space available in many implantable medical devices is disclosed. The battery housing provides a cover and a shallow case a preferably planar, major bottom portion, an open top to receive the cover opposing the bottom portion, and a plurality of sides being radiused at intersections with each other and with the bottom to allow for the close abutting of other components located within the implantable device while also providing for efficient location of the battery within an arcuate edge of the device. The cover and the shallow case being substantially hermetically sealed by a laser weld technique and an insulator member disposed within the case to provide a barrier to incident laser radiation so that during welding radiation does not impinge upon radiation sensitive component(s) disposed within the case.
    Type: Application
    Filed: August 6, 2014
    Publication date: January 29, 2015
    Inventors: Paul B. Aamodt, Franise D. Bartley, Steven M. Bruesehoff, Kurt J. Casby, David P. Haas, Karl E. Hokanson, Thomas M. Nutzman, Andrew J. Ries, Scott J. Robinson, Randy S. Roles, Sonja K. Somdahl, Walter C. Sunderland, Jason T. Papenfuss, William J. Farrell, Kimberly A. Chaffin
  • Patent number: 8916290
    Abstract: A battery having an electrode assembly located in a housing that efficiently utilizes the space available in many implantable medical devices is disclosed. The battery housing provides a cover and a shallow case a preferably planar, major bottom portion, an open top to receive the cover opposing the bottom portion, and a plurality of sides being radiused at intersections with each other and with the bottom to allow for the close abutting of other components located within the implantable device while also providing for efficient location of the battery within an arcuate edge of the device. The cover and the shallow case being substantially hermetically sealed by a laser weld technique and an insulator member disposed within the case to provide a barrier to incident laser radiation so that during welding radiation does not impinge upon radiation sensitive component(s) disposed within the case.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: December 23, 2014
    Assignee: Medtronic, Inc.
    Inventors: Paul B. Aamodt, Franise D. Bartley, Steve M. Bruesehoff, Kurt J. Casby, David P. Haas, Karl E. Hokanson, Thomas M. Nutzman, Andrew J. Ries, Scott J. Robinson, Randy S. Roles, Sonja K. Somdahl, Walter C. Sunderland, Jason T. Papenfuss, William J. Farrell, Kimberly A. Chaffin
  • Patent number: 8875602
    Abstract: A torque wrench for implantable medical devices is disclosed. The torque wrench comprises a first and a second component. The first component has first and second ends with a bore extending between the first and second ends of the first component. The first component includes a plurality of anti-rotation members extending from an inner surface of the bore at the second end of the first component. A second component includes a middle portion having a first and second ends. A drive shaft extends from the first end and a plurality of fingers extends from an exterior surface of the second end. The second component is received in the bore of the first component such that the fingers are interdigitate with the anti-rotation members.
    Type: Grant
    Filed: July 31, 2009
    Date of Patent: November 4, 2014
    Assignee: Medtronic, Inc.
    Inventors: Eric John Wengreen, Andrew J. Ries, John Eric Lovins
  • Patent number: 8825160
    Abstract: A complex connector and component within an implantable medical device in which the complex connector is positioned within the spacing footprint of the component to optimize packaging within the device.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: September 2, 2014
    Assignee: Medtronic, Inc.
    Inventors: Angela Rodgers, Andrew J Ries, Kurt J Casby, John D Norton, Mark D Breyen, Dan D Erklouts, Brian J Ross, Timothy T Bomstad, Wayne L Appleseth, Michael E Clarke, Jeffrey L Kehn, Scott J Robinson
  • Patent number: 8792984
    Abstract: A device connector assembly includes a plurality of electrical contacts and a sealing member including a corresponding plurality of apertures; each electrical contact extends within a corresponding aperture of the plurality of apertures such that each contact is accessible for coupling with a corresponding connector element of a lead connector. The lead connector elements protrude from a first side of an insulative substrate of the lead connector, and may be coupled to the contacts of the device connector assembly by aligning each connector element with the corresponding aperture of the sealing member, and applying a force to a second side of the insulative substrate, opposite the first side, in order to press each connector element into engagement with the corresponding contact.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: July 29, 2014
    Assignee: Medtronic, Inc.
    Inventors: John E. Kast, Charles E. Peters, Michael J. Baade, James A. Alexander, Andrew J. Ries
  • Patent number: 8750961
    Abstract: The present invention provides a packaging technique and apparatus that incorporates a flexible substrate package with a three-axis magnetic sensor for three-axis sensing in an implantable medical device. The apparatus includes three single-axis magnetic sensor integrated circuits (ICs) that are mounted to a substrate and encapsulated with a polymer mold compound. The substrate is excised around each of the sensor ICs to form panels that are folded to align the three single-axis sensors in the x, y and z axis.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: June 10, 2014
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, Mark E. Henschel, Lawrence C. McClure, Mark S. Ricotta, Lejun Wang
  • Patent number: 8731669
    Abstract: An implantable medical device system includes a medical electrical lead having a connector assembly and a connector bore for receiving the lead connector assembly. The lead includes a distal portion having a first outer diameter and a distal sealing member, an intermediate portion having a second outer diameter smaller than the first outer diameter, and a connector pin extending from the intermediate portion, the connector pin having an outer diameter corresponding to a DF-1 standard.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: May 20, 2014
    Assignee: Medtronic, Inc.
    Inventors: Jordon D. Honeck, Andrew J. Ries, Karel F. A. A. Smits
  • Publication number: 20140123490
    Abstract: A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.
    Type: Application
    Filed: January 13, 2014
    Publication date: May 8, 2014
    Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
  • Patent number: 8706229
    Abstract: A connector assembly for detachably connecting a lead to an implantable medical device and an implantable medical device capable of being detachably connected to a lead that include one or more deflectable connector clip and a housing. The connector clip includes a first arm, a second arm, and a top portion extending between the first arm and the second arm, and is capable of being deflected from a first position, corresponding to a first relative position of the first arm and the second arm, to a second position corresponding to a second relative position of the first arm and the second arm. The housing includes a first member and a second member, the first member formed to be fixedly engaged with the second member to enclose the connector clip within the housing with the one or more connector clip being positioned within one of the first member and the second member.
    Type: Grant
    Filed: April 15, 2010
    Date of Patent: April 22, 2014
    Assignee: Medtronic, Inc.
    Inventors: Jay Lahti, Andrew J. Ries, Scott Forsythe
  • Publication number: 20140052225
    Abstract: A device connector assembly includes a plurality of electrical contacts and a sealing member including a corresponding plurality of apertures; each electrical contact extends within a corresponding aperture of the plurality of apertures such that each contact is accessible for coupling with a corresponding connector element of a lead connector. The lead connector elements protrude from a first side of an insulative substrate of the lead connector, and may be coupled to the contacts of the device connector assembly by aligning each connector element with the corresponding aperture of the sealing member, and applying a force to a second side of the insulative substrate, opposite the first side, in order to press each connector element into engagement with the corresponding contact.
    Type: Application
    Filed: March 14, 2013
    Publication date: February 20, 2014
    Applicant: Medtronic, Inc.
    Inventors: John E. Kast, Charles E. Peters, Michael J. Baade, James A. Alexander, Andrew J. Ries
  • Patent number: 8628348
    Abstract: A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: January 14, 2014
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
  • Publication number: 20130309889
    Abstract: A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.
    Type: Application
    Filed: May 17, 2012
    Publication date: November 21, 2013
    Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
  • Publication number: 20130307184
    Abstract: Methods for forming an insulative body of an implantable medical device connector module assembly employ an injection molding process, whereby first and second shots of insulative material form core and an overlay portions, respectively. In some methods, a panel portion of an electrical component is mounted between opposing surfaces of a mold such that a finger-like portion of the component extends into a cavity of the mold, with a first side thereof touching another surface of the mold and a second, opposite side exposed within the cavity; following first shot injection, the core portion captures the finger-like portion in relatively rigid relation thereto. When two types of connector bores are formed, a color indicator may be engaged with a feature of the core portion that is located in proximity to a connector bore of the first type, and then the overlay portion is formed over the indicator.
    Type: Application
    Filed: May 17, 2012
    Publication date: November 21, 2013
    Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
  • Publication number: 20130266844
    Abstract: A battery having an electrode assembly located in a housing that efficiently utilizes the space available in many implantable medical devices is disclosed. The battery housing provides a cover and a shallow case a preferably planar, major bottom portion, an open top to receive the cover opposing the bottom portion, and a plurality of sides being radiused at intersections with each other and with the bottom to allow for the close abutting of other components located within the implantable device while also providing for efficient location of the battery within an arcuate edge of the device. The cover and the shallow case being substantially hermetically sealed by a laser weld technique and an insulator member disposed within the case to provide a barrier to incident laser radiation so that during welding radiation does not impinge upon radiation sensitive component(s) disposed within the case.
    Type: Application
    Filed: March 5, 2013
    Publication date: October 10, 2013
    Inventors: Paul B. Aamodt, Franise D. Bartley, Steve M. Bruesehoff, Kurt J. Casby, David P. Haas, Karl E. Hokanson, Thomas M. Nutzman, Andrew J. Ries, Scott J. Robinson, Randy S. Roles, Sonja K. Somdahl, Walter C. Sunderland, Jason T. Papenfuss, William J. Farrell, Kimberly A. Chaffin
  • Publication number: 20130238071
    Abstract: A complex connector and component within an implantable medical device in which the complex connector is positioned within the spacing footprint of the component to optimize packaging within the device.
    Type: Application
    Filed: February 26, 2013
    Publication date: September 12, 2013
    Applicant: Medtronic, Inc.
    Inventors: Angela Rodgers, Andrew J. Ries, Kurt J. Casby, John D. Norton, Mark D. Breyen, Dan D. Erklouts, Brian J. Ross, Timothy T. Bomstad, Wayne L. Appleseth, Michael E. Clarke, Jeffrey L. Kehn, Scott J. Robinson