Patents by Inventor Angela Kessler

Angela Kessler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7911039
    Abstract: A component arrangement comprising a carrier, a component in a housing with electrical contacts and a moulding compound that encloses the carrier, the semiconductor component in the housing and the electrical contacts, wherein the component is applied on the carrier, and wherein the carrier is provided with holes, and a method for producing a component arrangement, wherein the carrier is provided with holes, the component is positioned on the carrier, the component is connected to the carrier, the component with the carrier is positioned in the leadframe, and this arrangement is enclosed by a moulding compound.
    Type: Grant
    Filed: September 25, 2007
    Date of Patent: March 22, 2011
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Patent number: 7880300
    Abstract: A semiconductor chip (1) has a metal coating structure (2) which has on an active upper side (3) of the semiconductor chip (1) at least one lower metal layer (8) with copper or copper alloy, on which a central metal layer (9) with nickel is arranged. The metal coating structure (2) is terminated by an upper metal layer (10) of palladium and/or a precious metal. The central metal layer (9) with nickel and/or nickel phosphide has a rough interface (11) with respect to the plastic package molding compound surrounding the metal coating structure (2).
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: February 1, 2011
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Patent number: 7834467
    Abstract: A layer improves adhesion between interfaces of different components in semiconductor devices. The interface of a first component includes surfaces of a circuit carrier and the interface of a second component includes contact surfaces of a plastic package molding compound. The adhesion-improving layer includes a mixture of polymeric chain molecules and carbon nanotubes.
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: November 16, 2010
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Alfred Haimerl, Khalil Hosseini, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Patent number: 7795727
    Abstract: The invention relates to a semiconductor module comprising stacked discrete components and a method for producing the same. In one embodiment, the semiconductor module has a semiconductor chip arranged on a wiring substrate. The discrete components are arranged and wired on an intermediate carrier, which is electrically connected to the wiring substrate and/or the semiconductor chip. The wiring substrate carries the semiconductor chip, the semiconductor chip carries the intermediate carrier and the intermediate carrier carries the discrete components.
    Type: Grant
    Filed: April 5, 2007
    Date of Patent: September 14, 2010
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler
  • Publication number: 20100207277
    Abstract: A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another.
    Type: Application
    Filed: February 9, 2005
    Publication date: August 19, 2010
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Michael Bauer, Thomas Engling, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Patent number: 7768107
    Abstract: A semiconductor component includes at least one semiconductor chip arranged on a mounting substrate and connected thereto via bonding wires. For effective dissipation of heat, a solderable interlayer is arranged on the active upper side of the semiconductor chip and a heat sink is soldered onto the solderable interlayer. A method is also described for producing a semiconductor component with a solderable interlayer disposed on an active upper side of a semiconductor chip and with a heat sink soldered to the solderable interlayer.
    Type: Grant
    Filed: November 13, 2006
    Date of Patent: August 3, 2010
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Patent number: 7749797
    Abstract: A semiconductor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening. The sensor chip is mechanically decoupled from the cavity housing. In one embodiment, the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the cavity housing.
    Type: Grant
    Filed: August 18, 2005
    Date of Patent: July 6, 2010
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Patent number: 7728053
    Abstract: A plastic housing composition for embedding semiconductor devices in a plastic housing includes a multicomponent plastic material, where at least one component is distributed in the plastic material in drop-shaped and/or spherical units. The drop-shaped and/or spherical units are surrounded by dimensionally stable sheaths made from a plastic sheath material. The multicomponent plastic further includes a reactive curing system that cures when the plastic sheaths are torn open. The dimensionally stable plastic sheath material is deformation-sensitive, so that the sheaths tear open under mechanical deformation loading, which initiates and/or accelerates the curing process.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: June 1, 2010
    Assignee: Infineon Technologies, AG
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Patent number: 7714422
    Abstract: An electronic module includes a component housing and at least one semiconductor chip. The semiconductor chip is arranged on a circuit carrier in the component housing. The semiconductor chip is connected to an upper face of the circuit carrier via connection elements. In this case, the semiconductor chip, the connection elements and, partially, the circuit carrier are embedded in a plastic housing compound. A metal plate which is structured into lead interconnects and contact connecting pads is provided on the upper face of the component housing.
    Type: Grant
    Filed: May 22, 2007
    Date of Patent: May 11, 2010
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Patent number: 7705436
    Abstract: A semiconductor chip has at least one first contact and one second contact on its top side and has connecting elements which are arranged jointly on a structure element and which connect the first contact and the second contact of the top side of the semiconductor chip to the external contacts.
    Type: Grant
    Filed: August 6, 2007
    Date of Patent: April 27, 2010
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Alfred Haimerl, Angela Kessler, Michael Bauer, Wolfgang Schober
  • Patent number: 7645642
    Abstract: A method of joining a thermoplastic material to a thermoset material, and a resultant thermoplastic-thermoset composite formed from such method are provided. At least one of the thermoplastic material and the thermoset material includes particles that melt when the thermoplastic material and the thermoset material are heated during the joining operation. The particles further produce a solid bond between the materials after the particles have solidified in the course of cooling after the joining operation.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: January 12, 2010
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Patent number: 7629660
    Abstract: A semiconductor sensor component including a sensor chip and methods for the manufacturing thereof is disclosed. In one embodiment, the semiconductor sensor component includes a package which itself includes a transparent plastic material. The sensor chip has an active top side and a back side, wherein a sensor area is arranged on the active top side and flipchip contacts are provided outside of the sensor area on the active top side. These flipchip contacts are electrically connected to a circuit structure, wherein the circuit structure allows free access to the sensor area. The sensor chip including the sensor area and the flipchip contacts and a part of the circuit structure which is electrically connected to the flipchip contacts are embedded in the transparent plastic material, wherein the transparent plastic material includes a rubber-elastic substance.
    Type: Grant
    Filed: June 2, 2006
    Date of Patent: December 8, 2009
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Publication number: 20090280314
    Abstract: Composite with a first part composed of a thermoset material and with a second part composed of a thermoplastic material, and with an adhesion-promoter layer located between these, where the first part has been bonded by way of the adhesion-promoter layer to the second part, and where the adhesion-promoter layer comprises pyrolytically deposited semiconductor oxides and/or pyrolytically deposited metal oxides.
    Type: Application
    Filed: April 26, 2006
    Publication date: November 12, 2009
    Inventors: Joachim Mahler, Alfred Haimerl, Wolfgang Schober, Michael Bauer, Angela Kessler
  • Patent number: 7589403
    Abstract: A lead structure for a semiconductor component includes: external leads for external connections outside a plastic housing composition, internal leads for electrical connections within the plastic housing composition, and a chip mounting island composed of the lead material. While leaving free contact pads of the internal leads, the top sides of the chip mounting island and the internal leads are equipped with nanotubes as an anchoring layer. The plastic housing composition is arranged in the interspaces between the nanotubes arranged on the internal leads, while an adhesive composition for the semiconductor chip is arranged in the interspaces between the nanotubes arranged on the chip mounting island. The adhesive composition and the plastic housing composition fill the interspaces in a manner free of voids.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: September 15, 2009
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Angela Kessler, Wolfgang Schober, Alfred Haimerl, Joachim Mahler
  • Publication number: 20090039484
    Abstract: A semiconductor chip has at least one first contact and one second contact on its top side and has connecting elements which are arranged jointly on a structure element and which connect the first contact and the second contact of the top side of the semiconductor chip to the external contacts.
    Type: Application
    Filed: August 6, 2007
    Publication date: February 12, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Joachim Mahler, Alfred Haimerl, Angela Kessler, Michael Bauer, Wolfgang Schober
  • Publication number: 20090026558
    Abstract: A semiconductor sensor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening. The sensor chip is mechanically decoupled from the cavity housing. In one embodiment, the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the cavity housing.
    Type: Application
    Filed: August 18, 2005
    Publication date: January 29, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Patent number: 7464603
    Abstract: A semiconductor sensor component including a housing with a cavity and a sensor chip and a method for producing the same are described herein. The housing includes an opening to the surroundings of the housing and the sensor chip includes a sensor region which faces the opening. The sensor chip is embedded in the cavity of the housing into a rubber-elastic layer with its rear side and its edge sides, where the rubber-elastic layer includes cleavable included organometallic or inorganic metallic complexes. The metals of the complexes lie in a freely accessible manner on the top side of the rubber-elastic layer and form metallic nuclei for wiring lines which electrically connect the sensor region of the sensor chip to contact pads in the cavity of the cavity housing.
    Type: Grant
    Filed: October 4, 2007
    Date of Patent: December 16, 2008
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Angela Kessler, Wolfgang Schober, Alfred Haimerl, Joachim Mahler
  • Publication number: 20080303172
    Abstract: Apparatus for packaging two chips includes, in some embodiments, a first chip having at least one elevation and at least one cutout on a bottom thereof. It also includes a second chip having at least one elevation and at least one cutout on a top thereof. In some embodiments disclosed, the elevations and cutouts of the first chip and the second chip are configured to allow the elevations to be intermeshed with the cutouts when the chips are stacked with the bottom of the first chip engaging the top of the second chip.
    Type: Application
    Filed: June 11, 2007
    Publication date: December 11, 2008
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler
  • Patent number: 7462940
    Abstract: A semiconductor component includes flip-chip contacts arranged on a wiring structure of a semiconductor chip. The wiring structure includes at least one metallization layer and at least one dielectric insulation layer made of a low-k material with a relative permittivity ?r lower than the relative permittivity of a silicon dioxide. The flip-chip contacts are arranged on contact areas of an upper metallization layer and have a polymer core surrounded by a lead-free solder sheath.
    Type: Grant
    Filed: January 8, 2007
    Date of Patent: December 9, 2008
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Patent number: 7443019
    Abstract: The invention relates to a semiconductor device with conductor tracks between a semiconductor chip and a circuit carrier, and to a method for producing the same. The conductor tracks extend from contact areas on the top side of the semiconductor chip to contact pads on the circuit carrier. The conductor tracks include an electrically conductive polymer in the semiconductor device.
    Type: Grant
    Filed: August 3, 2006
    Date of Patent: October 28, 2008
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober