Abstract: The invention relates to a contact-adhesive tape which can be removed damage-free and residue-free by stretching the tape substantially within the adhesion plane and which consists of one or more adhesive substance layers, all made of a contact-adhesive substance expanded with micro-balloons, and one or two optional intermediate backings. The disclosed contact-adhesive tape consists exclusively of the aforementioned adhesive substance layers and optional intermediate backings, and the one external upper surface as well as the one external lower surface of the contact-adhesive tape are formed by said adhesive substance layer or layers.

Abstract: The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.

Abstract: Composite made of two substrates for use for optical, electronic and/or precision-engineered equipment, comprising a first substrate and a second substrate and, arranged so as to connect the first substrate to the second substrate, an adhesive layer, wherein the adhesive layer comprises an adhesive which has, relative to the mixture, (a) from 60% by weight to 90% by weight of a first polymer component based on polyacrylate and (b) from 10% by weight to 40% by weight of a second polymer component based on elastomers, where the second polymer component is essentially not miscible with the first polymer component, so that the adhesive is present in at least two separate phases in the adhesive layer.

Abstract: A self-adhesive compound comprising a) at least one elastomer, at least one type of polybutadiene block copolymer being used as an elastomer, b) at least one partially hydrogenated hydrocarbon resin having a softening temperature of at least 90° C., c) at least one additional hydrocarbon resin, a terpene phenol resin and/or a colophonium resin having a softening temperature of at least 90° C., d) a soft resin, and e) additional additives as applicable.

Abstract: The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.

Abstract: The invention relates to an adhesive film strip comprising at least two, particularly three, layers, which adhesive film strip can be detached without residues and nondestructively by expansive stretching substantially in the adhesion plane, with a carrier on which a first external adhesive compound layer is present on at least one side, wherein the adhesive compound layer consists of adhesive compound formed on the basis of vinyl aromatic block copolymers and adhesive resins, wherein at least 75% of the resin (relative to the overall resin content) is selected with a DACP (diacetone alcohol cloud point) of greater than ?20° C., preferably greater than 0° C., and the carrier has at least one layer made from a polyurethane with an elongation at break of at least 100% and a restoring power of more than 50%. A nonpolar hydrocarbon resin or a polyterpene resin is particularly used as the tackifier for the adhesive compound(s).

Abstract: The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.

Abstract: A pressure-sensitive adhesive is to achieve good bond strengths at both high and low temperatures. This aim is accomplished by the adhesive comprising the following components: a) 40-70 wt %, based on the total weight of the adhesive, of at least one poly(meth)acrylate; b) 15-50 wt %, based on the total weight of the adhesive, of at least one synthetic rubber; and c) at least one tackifier compatible with the poly(meth)acrylate(s). The invention further relates to an adhesive tape which comprises at least one layer of the pressure-sensitive adhesive of the invention.

Abstract: Pressure-sensitive adhesive having high bond strengths to polar substrates as well as to non-polar substrates, comprising: a) 30-65 wt %, based on the total weight of the adhesive, of at least one poly(meth)acrylate; b) 5-20 wt %, based on the total weight of the adhesive, of at least one synthetic rubber; c) at least one tackifier compatible with the poly(meth)acrylate(s); and d) at least one hydrocarbon resin compatible with the synthetic rubber(s), and adhesive tape comprising at least one layer of the pressure-sensitive adhesive.