Patents by Inventor Animesh Datta

Animesh Datta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11508725
    Abstract: A CMOS device with a plurality of PMOS transistors each having a PMOS drain and a plurality of NMOS transistors each having an NMOS drain includes a first interconnect and a second interconnect. The first interconnect is on an interconnect level extending in a length direction to connect the PMOS drains together, and the second interconnect is on the interconnect level extending in the length direction to connect the NMOS drains together. A set of interconnects on at least one additional interconnect level physically couple the first interconnect and the second interconnect to an output of the CMOS device. A third interconnect on the interconnect level extends perpendicular to the length direction and offset from the set of interconnects. The third interconnect is capable of flowing current from the PMOS drains or from the NMOS drains to the output of the CMOS device.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: November 22, 2022
    Assignee: QUALCOMM INCORPORATED
    Inventors: Seid Hadi Rasouli, Michael Joseph Brunolli, Christine Sung-An Hau-Riege, Mickael Malabry, Sucheta Kumar Harish, Prathiba Balasubramanian, Kamesh Medisetti, Nikolay Bomshtein, Animesh Datta, Ohsang Kwon
  • Patent number: 11437375
    Abstract: A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together through at least one other interconnect level.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: September 6, 2022
    Assignee: QUALCOMM INCORPORATED
    Inventors: Seid Hadi Rasouli, Animesh Datta, Ohsang Kwon
  • Publication number: 20200168604
    Abstract: A CMOS device with a plurality of PMOS transistors each having a PMOS drain and a plurality of NMOS transistors each having an NMOS drain includes a first interconnect and a second interconnect. The first interconnect is on an interconnect level extending in a length direction to connect the PMOS drains together, and the second interconnect is on the interconnect level extending in the length direction to connect the NMOS drains together. A set of interconnects on at least one additional interconnect level physically couple the first interconnect and the second interconnect to an output of the CMOS device. A third interconnect on the interconnect level extends perpendicular to the length direction and offset from the set of interconnects. The third interconnect is capable of flowing current from the PMOS drains or from the NMOS drains to the output of the CMOS device.
    Type: Application
    Filed: January 30, 2020
    Publication date: May 28, 2020
    Inventors: Seid Hadi RASOULI, Michael Joseph BRUNOLLI, Christine Sung-An HAU-RIEGE, Mickael MALABRY, Sucheta Kumar HARISH, Prathiba BALASUBRAMANIAN, Kamesh MEDISETTI, Nikolay BOMSHTEIN, Animesh DATTA, Ohsang KWON
  • Publication number: 20200152630
    Abstract: A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together through at least one other interconnect level.
    Type: Application
    Filed: January 16, 2020
    Publication date: May 14, 2020
    Inventors: Seid Hadi RASOULI, Animesh DATTA, Ohsang KWON
  • Patent number: 10600785
    Abstract: A CMOS device with a plurality of PMOS transistors and a plurality of NMOS transistors includes a first interconnect and a second interconnect on an interconnect level connecting a first subset and a second subset of PMOS drains together, respectively. The first and second subsets are different and the first and second interconnect are disconnected on the interconnect level. A third interconnect and a fourth interconnect on the interconnect level connect a first subset and a second subset of the NMOS drains together, respectively. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, fourth interconnects are coupled together through at least one other interconnect level. Additional interconnects on the interconnect level connect the first and third interconnects together, and the second and fourth interconnects together, to provide parallel current paths with a current path through the at least one other interconnect level.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: March 24, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Seid Hadi Rasouli, Michael Joseph Brunolli, Christine Sung-An Hau-Riege, Mickael Malabry, Sucheta Kumar Harish, Prathiba Balasubramanian, Kamesh Medisetti, Nikolay Bomshtein, Animesh Datta, Ohsang Kwon
  • Patent number: 10580774
    Abstract: A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together through at least one other interconnect level.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: March 3, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Seid Hadi Rasouli, Animesh Datta, Ohsang Kwon
  • Publication number: 20180342515
    Abstract: A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together through at least one other interconnect level.
    Type: Application
    Filed: August 7, 2018
    Publication date: November 29, 2018
    Inventors: Seid Hadi RASOULI, Animesh DATTA, Ohsang KWON
  • Patent number: 10074609
    Abstract: A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together though at least one other interconnect level.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: September 11, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Seid Hadi Rasouli, Animesh Datta, Ohsang Kwon
  • Publication number: 20180211957
    Abstract: A CMOS device with a plurality of PMOS transistors and a plurality of NMOS transistors includes a first interconnect and a second interconnect on an interconnect level connecting a first subset and a second subset of PMOS drains together, respectively. The first and second subsets are different and the first and second interconnect are disconnected on the interconnect level. A third interconnect and a fourth interconnect on the interconnect level connect a first subset and a second subset of the NMOS drains together, respectively. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, fourth interconnects are coupled together through at least one other interconnect level. Additional interconnects on the interconnect level connect the first and third interconnects together, and the second and fourth interconnects together, to provide parallel current paths with a current path through the at least one other interconnect level.
    Type: Application
    Filed: March 21, 2018
    Publication date: July 26, 2018
    Inventors: Seid Hadi RASOULI, Michael BRUNOLLI, Christine HAU-RIEGE, Mickael Sebtastien Alain MALABRY, Sucheta Kumar HARISH, Prathiba BALASUBRAMANIAN, Kamesh MEDISETTI, Nikolay BOMSHTEIN, Animesh DATTA, Ohsang KWON
  • Patent number: 10033359
    Abstract: A method and an apparatus for wireless communication are provided. The apparatus having a first latch having a first latch input and first latch output and a second latch having a second latch input, a second latch scan output, and a second latch data output. The second latch input is coupled to the first latch output. The apparatus further includes a selection component configured to select between a data input and a scan input based on a shift input. The selection component is coupled to the first latch input. The selection component includes a first NAND-gate, a second NAND-gate, and an OR-gate.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: July 24, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Qi Ye, Animesh Datta
  • Patent number: 9979394
    Abstract: The apparatus may include a first latch configured to store a first state or a second state. The first latch may have a first latch input, one of a set input or a reset input, a first pulse clock input, and a first latch output. The first latch input may be coupled to a fixed logic value. The one of the set input or the reset input may be coupled to a clock signal or an inverted clock signal, respectively. The apparatus may include an AND gate having a first AND gate input, a second AND gate input, and a first AND gate output. The clock signal may be coupled to the first AND gate input. The first latch output may be coupled to the second AND gate input. The AND gate output may be configured to output a pulsed clock. The pulsed clock may be coupled to the first pulse clock input.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: May 22, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Qi Ye, Animesh Datta, Venkatasubramanian Narayanan, Venugopal Boynapalli
  • Patent number: 9972624
    Abstract: A CMOS device with a plurality of PMOS transistors each having a PMOS drain and a plurality of NMOS transistors each having an NMOS drain includes a first interconnect on an interconnect level extending in a length direction to connect the PMOS drains together. A second interconnect on the interconnect level extends in the length direction to connect the NMOS drains together. A set of interconnects on at least one additional interconnect level couple the first interconnect and the second interconnect together. A third interconnect on the interconnect level extends perpendicular to the length direction and is offset from the set of interconnects to connect the first interconnect and the second interconnect together.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: May 15, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Seid Hadi Rasouli, Michael Joseph Brunolli, Christine Sung-An Hau-Riege, Mickael Malabry, Sucheta Kumar Harish, Prathiba Balasubramanian, Kamesh Medisetti, Nikolay Bomshtein, Animesh Datta, Ohsang Kwon
  • Patent number: 9966953
    Abstract: A low clock power data-gated flip-flop is provided. The data-gated flip-flop includes an exclusive OR component including a first exclusive OR input, a second exclusive OR input, and a first exclusive OR output. The first exclusive OR input is configured to receive a data input to the data-gated flip-flop. The data-gated flip-flop includes a first latch including a first latch data input and a first latch reset input, the first exclusive OR output being coupled to the first latch data input and the first latch reset input. The data-gated flip-flop includes a second latch having a data output, the data output coupled to the second exclusive OR input.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: May 8, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Qi Ye, Animesh Datta, Bo Pang
  • Patent number: 9875209
    Abstract: A synchronous data-link throughput enhancement technique based on data signal duty-cycle and phase modulation demodulation is disclosed. A method includes receiving multiple bits to be transmitted, encoding the multiple bits to generate a multi-bit signal that represents the multiple bits, and transmitting, via a synchronous interface, the multi-bit signal during a time period that corresponds to one-half of a cycle of a synchronization signal.
    Type: Grant
    Filed: May 6, 2013
    Date of Patent: January 23, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Lalan J. Mishra, Dexter T. Chun, Animesh Datta
  • Publication number: 20170353186
    Abstract: A low clock power data-gated flip-flop is provided. The data-gated flip-flop includes an exclusive OR component including a first exclusive OR input, a second exclusive OR input, and a first exclusive OR output. The first exclusive OR input is configured to receive a data input to the data-gated flip-flop. The data-gated flip-flop includes a first latch including a first latch data input and a first latch reset input, the first exclusive OR output being coupled to the first latch data input and the first latch reset input. The data-gated flip-flop includes a second latch having a data output, the data output coupled to the second exclusive OR input.
    Type: Application
    Filed: June 2, 2016
    Publication date: December 7, 2017
    Inventors: Qi YE, Animesh DATTA, Bo PANG
  • Patent number: 9786663
    Abstract: A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together through at least one other interconnect level.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: October 10, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Seid Hadi Rasouli, Animesh Datta, Ohsang Kwon
  • Publication number: 20170237434
    Abstract: The apparatus may include a first latch configured to store a first state or a second state. The first latch may have a first latch input, one of a set input or a reset input, a first pulse clock input, and a first latch output. The first latch input may be coupled to a fixed logic value. The one of the set input or the reset input may be coupled to a clock signal or an inverted clock signal, respectively. The apparatus may include an AND gate having a first AND gate input, a second AND gate input, and a first AND gate output. The clock signal may be coupled to the first AND gate input. The first latch output may be coupled to the second AND gate input. The AND gate output may be configured to output a pulsed clock. The pulsed clock may be coupled to the first pulse clock input.
    Type: Application
    Filed: February 16, 2016
    Publication date: August 17, 2017
    Inventors: Qi YE, Animesh DATTA, Venkatasubramanian NARAYANAN, Venugopal BOYNAPALLI
  • Publication number: 20170221826
    Abstract: A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together though at least one other interconnect level.
    Type: Application
    Filed: April 20, 2017
    Publication date: August 3, 2017
    Inventors: Seid Hadi RASOULI, Animesh DATTA, Ohsang KWON
  • Patent number: 9678154
    Abstract: In one embodiment, a method for signal delay in a scan path comprises, in a scan mode, delaying a scan signal in the scan path by propagating the scan signal through a plurality of delay devices coupled in series, wherein a first one of the delay devices is powered by a first voltage, a second one of the delay devices is powered by a second voltage, and the second voltage is greater than the first voltage. The method also comprises, in a functional mode, disabling the delay devices.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: June 13, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Animesh Datta, Qi Ye, Steven James Dillen
  • Patent number: 9673786
    Abstract: A circuit including a logic gate responsive to a clock signal and to a control signal. The circuit also includes a master stage of a flip-flop. The circuit further includes a slave stage of the flip-flop responsive to the master stage. The circuit further includes an inverter responsive to the logic gate and configured to output a delayed version of the clock signal. An output of the logic gate and the delayed version of the clock signal are provided to the master stage and to the slave stage of the flip-flop. The master stage is responsive to the control signal to control the slave stage.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: June 6, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Seid Hadi Rasouli, Animesh Datta, Jay Madhukar Shah, Martin Saint-Laurent, Peeyush Kumar Parkar, Sachin Bapat, Ramaprasath Vilangudipitchai, Mohamed Hassan Abu-Rahma, Prayag Bhanubhai Patel