Patents by Inventor Animesh Datta
Animesh Datta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11508725Abstract: A CMOS device with a plurality of PMOS transistors each having a PMOS drain and a plurality of NMOS transistors each having an NMOS drain includes a first interconnect and a second interconnect. The first interconnect is on an interconnect level extending in a length direction to connect the PMOS drains together, and the second interconnect is on the interconnect level extending in the length direction to connect the NMOS drains together. A set of interconnects on at least one additional interconnect level physically couple the first interconnect and the second interconnect to an output of the CMOS device. A third interconnect on the interconnect level extends perpendicular to the length direction and offset from the set of interconnects. The third interconnect is capable of flowing current from the PMOS drains or from the NMOS drains to the output of the CMOS device.Type: GrantFiled: January 30, 2020Date of Patent: November 22, 2022Assignee: QUALCOMM INCORPORATEDInventors: Seid Hadi Rasouli, Michael Joseph Brunolli, Christine Sung-An Hau-Riege, Mickael Malabry, Sucheta Kumar Harish, Prathiba Balasubramanian, Kamesh Medisetti, Nikolay Bomshtein, Animesh Datta, Ohsang Kwon
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Patent number: 11437375Abstract: A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together through at least one other interconnect level.Type: GrantFiled: January 16, 2020Date of Patent: September 6, 2022Assignee: QUALCOMM INCORPORATEDInventors: Seid Hadi Rasouli, Animesh Datta, Ohsang Kwon
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Publication number: 20200168604Abstract: A CMOS device with a plurality of PMOS transistors each having a PMOS drain and a plurality of NMOS transistors each having an NMOS drain includes a first interconnect and a second interconnect. The first interconnect is on an interconnect level extending in a length direction to connect the PMOS drains together, and the second interconnect is on the interconnect level extending in the length direction to connect the NMOS drains together. A set of interconnects on at least one additional interconnect level physically couple the first interconnect and the second interconnect to an output of the CMOS device. A third interconnect on the interconnect level extends perpendicular to the length direction and offset from the set of interconnects. The third interconnect is capable of flowing current from the PMOS drains or from the NMOS drains to the output of the CMOS device.Type: ApplicationFiled: January 30, 2020Publication date: May 28, 2020Inventors: Seid Hadi RASOULI, Michael Joseph BRUNOLLI, Christine Sung-An HAU-RIEGE, Mickael MALABRY, Sucheta Kumar HARISH, Prathiba BALASUBRAMANIAN, Kamesh MEDISETTI, Nikolay BOMSHTEIN, Animesh DATTA, Ohsang KWON
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Publication number: 20200152630Abstract: A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together through at least one other interconnect level.Type: ApplicationFiled: January 16, 2020Publication date: May 14, 2020Inventors: Seid Hadi RASOULI, Animesh DATTA, Ohsang KWON
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Patent number: 10600785Abstract: A CMOS device with a plurality of PMOS transistors and a plurality of NMOS transistors includes a first interconnect and a second interconnect on an interconnect level connecting a first subset and a second subset of PMOS drains together, respectively. The first and second subsets are different and the first and second interconnect are disconnected on the interconnect level. A third interconnect and a fourth interconnect on the interconnect level connect a first subset and a second subset of the NMOS drains together, respectively. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, fourth interconnects are coupled together through at least one other interconnect level. Additional interconnects on the interconnect level connect the first and third interconnects together, and the second and fourth interconnects together, to provide parallel current paths with a current path through the at least one other interconnect level.Type: GrantFiled: March 21, 2018Date of Patent: March 24, 2020Assignee: QUALCOMM IncorporatedInventors: Seid Hadi Rasouli, Michael Joseph Brunolli, Christine Sung-An Hau-Riege, Mickael Malabry, Sucheta Kumar Harish, Prathiba Balasubramanian, Kamesh Medisetti, Nikolay Bomshtein, Animesh Datta, Ohsang Kwon
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Patent number: 10580774Abstract: A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together through at least one other interconnect level.Type: GrantFiled: August 7, 2018Date of Patent: March 3, 2020Assignee: QUALCOMM IncorporatedInventors: Seid Hadi Rasouli, Animesh Datta, Ohsang Kwon
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Publication number: 20180342515Abstract: A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together through at least one other interconnect level.Type: ApplicationFiled: August 7, 2018Publication date: November 29, 2018Inventors: Seid Hadi RASOULI, Animesh DATTA, Ohsang KWON
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Patent number: 10074609Abstract: A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together though at least one other interconnect level.Type: GrantFiled: April 20, 2017Date of Patent: September 11, 2018Assignee: QUALCOMM IncorporatedInventors: Seid Hadi Rasouli, Animesh Datta, Ohsang Kwon
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Publication number: 20180211957Abstract: A CMOS device with a plurality of PMOS transistors and a plurality of NMOS transistors includes a first interconnect and a second interconnect on an interconnect level connecting a first subset and a second subset of PMOS drains together, respectively. The first and second subsets are different and the first and second interconnect are disconnected on the interconnect level. A third interconnect and a fourth interconnect on the interconnect level connect a first subset and a second subset of the NMOS drains together, respectively. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, fourth interconnects are coupled together through at least one other interconnect level. Additional interconnects on the interconnect level connect the first and third interconnects together, and the second and fourth interconnects together, to provide parallel current paths with a current path through the at least one other interconnect level.Type: ApplicationFiled: March 21, 2018Publication date: July 26, 2018Inventors: Seid Hadi RASOULI, Michael BRUNOLLI, Christine HAU-RIEGE, Mickael Sebtastien Alain MALABRY, Sucheta Kumar HARISH, Prathiba BALASUBRAMANIAN, Kamesh MEDISETTI, Nikolay BOMSHTEIN, Animesh DATTA, Ohsang KWON
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Patent number: 10033359Abstract: A method and an apparatus for wireless communication are provided. The apparatus having a first latch having a first latch input and first latch output and a second latch having a second latch input, a second latch scan output, and a second latch data output. The second latch input is coupled to the first latch output. The apparatus further includes a selection component configured to select between a data input and a scan input based on a shift input. The selection component is coupled to the first latch input. The selection component includes a first NAND-gate, a second NAND-gate, and an OR-gate.Type: GrantFiled: October 23, 2015Date of Patent: July 24, 2018Assignee: QUALCOMM IncorporatedInventors: Qi Ye, Animesh Datta
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Patent number: 9979394Abstract: The apparatus may include a first latch configured to store a first state or a second state. The first latch may have a first latch input, one of a set input or a reset input, a first pulse clock input, and a first latch output. The first latch input may be coupled to a fixed logic value. The one of the set input or the reset input may be coupled to a clock signal or an inverted clock signal, respectively. The apparatus may include an AND gate having a first AND gate input, a second AND gate input, and a first AND gate output. The clock signal may be coupled to the first AND gate input. The first latch output may be coupled to the second AND gate input. The AND gate output may be configured to output a pulsed clock. The pulsed clock may be coupled to the first pulse clock input.Type: GrantFiled: February 16, 2016Date of Patent: May 22, 2018Assignee: QUALCOMM IncorporatedInventors: Qi Ye, Animesh Datta, Venkatasubramanian Narayanan, Venugopal Boynapalli
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Patent number: 9972624Abstract: A CMOS device with a plurality of PMOS transistors each having a PMOS drain and a plurality of NMOS transistors each having an NMOS drain includes a first interconnect on an interconnect level extending in a length direction to connect the PMOS drains together. A second interconnect on the interconnect level extends in the length direction to connect the NMOS drains together. A set of interconnects on at least one additional interconnect level couple the first interconnect and the second interconnect together. A third interconnect on the interconnect level extends perpendicular to the length direction and is offset from the set of interconnects to connect the first interconnect and the second interconnect together.Type: GrantFiled: August 23, 2013Date of Patent: May 15, 2018Assignee: QUALCOMM IncorporatedInventors: Seid Hadi Rasouli, Michael Joseph Brunolli, Christine Sung-An Hau-Riege, Mickael Malabry, Sucheta Kumar Harish, Prathiba Balasubramanian, Kamesh Medisetti, Nikolay Bomshtein, Animesh Datta, Ohsang Kwon
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Patent number: 9966953Abstract: A low clock power data-gated flip-flop is provided. The data-gated flip-flop includes an exclusive OR component including a first exclusive OR input, a second exclusive OR input, and a first exclusive OR output. The first exclusive OR input is configured to receive a data input to the data-gated flip-flop. The data-gated flip-flop includes a first latch including a first latch data input and a first latch reset input, the first exclusive OR output being coupled to the first latch data input and the first latch reset input. The data-gated flip-flop includes a second latch having a data output, the data output coupled to the second exclusive OR input.Type: GrantFiled: June 2, 2016Date of Patent: May 8, 2018Assignee: QUALCOMM IncorporatedInventors: Qi Ye, Animesh Datta, Bo Pang
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Patent number: 9875209Abstract: A synchronous data-link throughput enhancement technique based on data signal duty-cycle and phase modulation demodulation is disclosed. A method includes receiving multiple bits to be transmitted, encoding the multiple bits to generate a multi-bit signal that represents the multiple bits, and transmitting, via a synchronous interface, the multi-bit signal during a time period that corresponds to one-half of a cycle of a synchronization signal.Type: GrantFiled: May 6, 2013Date of Patent: January 23, 2018Assignee: QUALCOMM IncorporatedInventors: Lalan J. Mishra, Dexter T. Chun, Animesh Datta
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Publication number: 20170353186Abstract: A low clock power data-gated flip-flop is provided. The data-gated flip-flop includes an exclusive OR component including a first exclusive OR input, a second exclusive OR input, and a first exclusive OR output. The first exclusive OR input is configured to receive a data input to the data-gated flip-flop. The data-gated flip-flop includes a first latch including a first latch data input and a first latch reset input, the first exclusive OR output being coupled to the first latch data input and the first latch reset input. The data-gated flip-flop includes a second latch having a data output, the data output coupled to the second exclusive OR input.Type: ApplicationFiled: June 2, 2016Publication date: December 7, 2017Inventors: Qi YE, Animesh DATTA, Bo PANG
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Patent number: 9786663Abstract: A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together through at least one other interconnect level.Type: GrantFiled: August 23, 2013Date of Patent: October 10, 2017Assignee: QUALCOMM IncorporatedInventors: Seid Hadi Rasouli, Animesh Datta, Ohsang Kwon
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Publication number: 20170237434Abstract: The apparatus may include a first latch configured to store a first state or a second state. The first latch may have a first latch input, one of a set input or a reset input, a first pulse clock input, and a first latch output. The first latch input may be coupled to a fixed logic value. The one of the set input or the reset input may be coupled to a clock signal or an inverted clock signal, respectively. The apparatus may include an AND gate having a first AND gate input, a second AND gate input, and a first AND gate output. The clock signal may be coupled to the first AND gate input. The first latch output may be coupled to the second AND gate input. The AND gate output may be configured to output a pulsed clock. The pulsed clock may be coupled to the first pulse clock input.Type: ApplicationFiled: February 16, 2016Publication date: August 17, 2017Inventors: Qi YE, Animesh DATTA, Venkatasubramanian NARAYANAN, Venugopal BOYNAPALLI
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Publication number: 20170221826Abstract: A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together though at least one other interconnect level.Type: ApplicationFiled: April 20, 2017Publication date: August 3, 2017Inventors: Seid Hadi RASOULI, Animesh DATTA, Ohsang KWON
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Patent number: 9678154Abstract: In one embodiment, a method for signal delay in a scan path comprises, in a scan mode, delaying a scan signal in the scan path by propagating the scan signal through a plurality of delay devices coupled in series, wherein a first one of the delay devices is powered by a first voltage, a second one of the delay devices is powered by a second voltage, and the second voltage is greater than the first voltage. The method also comprises, in a functional mode, disabling the delay devices.Type: GrantFiled: October 30, 2014Date of Patent: June 13, 2017Assignee: QUALCOMM IncorporatedInventors: Animesh Datta, Qi Ye, Steven James Dillen
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Patent number: 9673786Abstract: A circuit including a logic gate responsive to a clock signal and to a control signal. The circuit also includes a master stage of a flip-flop. The circuit further includes a slave stage of the flip-flop responsive to the master stage. The circuit further includes an inverter responsive to the logic gate and configured to output a delayed version of the clock signal. An output of the logic gate and the delayed version of the clock signal are provided to the master stage and to the slave stage of the flip-flop. The master stage is responsive to the control signal to control the slave stage.Type: GrantFiled: April 12, 2013Date of Patent: June 6, 2017Assignee: QUALCOMM IncorporatedInventors: Seid Hadi Rasouli, Animesh Datta, Jay Madhukar Shah, Martin Saint-Laurent, Peeyush Kumar Parkar, Sachin Bapat, Ramaprasath Vilangudipitchai, Mohamed Hassan Abu-Rahma, Prayag Bhanubhai Patel