Abstract: A method of growing a GaAs crystalline layer on a Si substrate by means of which mechanical stresses causing microcracks in the materials when cooled due to the difference in their thermal coefficients are reduced and the location of the microcrack is controlled to predetermined sites. Microcracks are deliberately induced in the GaAs layer at locations where the operation of the ultimate electronic device created on the material is not affected by applying to the substrate a SiO.sub.2 mask providing a deposition opening or window for the GaAs layer, which masks defines along the opening boundary at least one vertex in the cleavage direction of the GaAs crystals. The vertices in the mask create notches in the periphery of the deposited layer which determines the location of any microcracks.