Abstract: Bodies (22) containing bonding material are applied in a substantially simultaneous manner to each of an array of bonding sites (18). A member (50) holds the bodies (22) in an array corresponding to the array of bonding sites (18). A pickup head (40) holds an array of pickup pins (42) such that pickup ends thereof correspond to the array of bodies (22) and sites (18). A mechanism (31) manipulates the head (40) and the array of pins (42) in steps, to substantially simultaneously engage each of the bodies (22) in the member (50) with a corresponding pickup end of a pin (42), to substantially simultaneously contact each of the bodies (22) to a corresponding bonding site (18) and to substantially simultaneously disengage the pins (42) from the bodies (22). In a preferred embodiment, the bodies (22) contain solder which is readily conductive and frictionally engageable by pressure of the pins (42) upon the bodies (22).

Abstract: A method of forming a direct contact lens on a light emitting device strure is disclosed which facilitates the formation of large arrays of light emitting devices. The method uses a printing fixture including a large number of vertically oriented pins which is dipped into a bath of a liquid epoxy material. The printing fixture is then placed over the array structures and lowered until the pins contact the diodes. When the printing fixture is subsequently raised, the lens material will adhere to the associated devices and flow to completely encapsulate the device and a substantial portion of the device mounting structure.