Patents by Inventor Anthony D. Minervini
Anthony D. Minervini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240114277Abstract: Aspects of the subject technology relate to liquid-resistant microphone modules for electronic devices. A microphone module may include a non-porous membrane that seals the front volume of the microphone module from the external environment of the electronic device. The microphone module may also include a substrate having an opening that allows airflow between the front volume and an interior cavity within the housing of the electronic device. In various implementations, an inductive vent and/or a resistive vent may be provided over the opening in the substrate.Type: ApplicationFiled: December 12, 2023Publication date: April 4, 2024Inventors: Anthony D. MINERVINI, Peter C. HRUDEY, Gokhan HATIPOGLU
-
Publication number: 20240107249Abstract: Embodiments of the present disclosure include a structure with a substrate, an electronic device, and a molding compound layer. The substrate has a first surface and a second surface opposite to the first surface, where the substrate includes a first opening. The electronic device is disposed on the first surface of the substrate and includes a second opening aligned with the first opening of the substrate. Further, the molding compound layer is disposed on the second surface of the substrate and includes a third opening aligned with the second opening of the electronic device.Type: ApplicationFiled: March 9, 2023Publication date: March 28, 2024Applicant: Apple Inc.Inventors: Kyusang KIM, Ali N. Ergun, Anthony D. Minervini, Bilal Mohamed Ibrahim Kani, Kishore N. Renjan
-
Patent number: 11902727Abstract: Aspects of the subject technology relate to inductive acoustic filters for acoustic devices. An inductive filter may include a substrate, an etched serpentine channel in a surface of the substrate and extending within the substrate from a first port in the substrate to a second port in the substrate. The inductive filter may also include a polymer cover layer adhesively attached to the surface of the substrate over the etched serpentine channel. The inductive filter may be positioned over an opening in a substrate of an acoustic module, such as a microphone module or a speaker module.Type: GrantFiled: February 11, 2022Date of Patent: February 13, 2024Assignee: Apple Inc.Inventors: Anthony D. Minervini, Peter C. Hrudey, Gokhan Hatipoglu
-
Patent number: 11882394Abstract: Aspects of the subject technology relate to liquid-resistant microphone modules for electronic devices. A microphone module may include a non-porous membrane that seals the front volume of the microphone module from the external environment of the electronic device. The microphone module may also include a substrate having an opening that allows airflow between the front volume and an interior cavity within the housing of the electronic device. In various implementations, an inductive vent and/or a resistive vent may be provided over the opening in the substrate.Type: GrantFiled: February 11, 2022Date of Patent: January 23, 2024Assignee: Apple Inc.Inventors: Anthony D. Minervini, Peter C. Hrudey, Gokhan Hatipoglu
-
Publication number: 20230379609Abstract: Implementations of the subject technology provide for a microphone in the front volume of a speaker. The speaker and the microphone may be provided in a single speaker assembly. The microphone may be implemented as an error microphone or a feedback microphone. The microphone may be mounted to a speaker frame of the speaker, with a sound-sensitive element of the microphone in the front volume of the speaker on a first side of the speaker frame, and with conductive contacts for the microphone disposed on an opposing second side of the speaker frame.Type: ApplicationFiled: May 8, 2023Publication date: November 23, 2023Inventors: Scott C. GRINKER, Ali N. ERGUN, Anthony D. MINERVINI, Claudio NOTARANGELO, Matthew A. DONARSKI
-
Publication number: 20230262370Abstract: Aspects of the subject technology relate to inductive acoustic filters for acoustic devices. An inductive filter may include a substrate, an etched serpentine channel in a surface of the substrate and extending within the substrate from a first port in the substrate to a second port in the substrate. The inductive filter may also include a polymer cover layer adhesively attached to the surface of the substrate over the etched serpentine channel. The inductive filter may be positioned over an opening in a substrate of an acoustic module, such as a microphone module or a speaker module.Type: ApplicationFiled: February 11, 2022Publication date: August 17, 2023Inventors: Anthony D. MINERVINI, Peter C. HRUDEY, Gokhan HATIPOGLU
-
Publication number: 20230262372Abstract: Aspects of the subject technology relate to liquid-resistant microphone modules for electronic devices. A microphone module may include a non-porous membrane that seals the front volume of the microphone module from the external environment of the electronic device. The microphone module may also include a substrate having an opening that allows airflow between the front volume and an interior cavity within the housing of the electronic device. In various implementations, an inductive vent and/or a resistive vent may be provided over the opening in the substrate.Type: ApplicationFiled: February 11, 2022Publication date: August 17, 2023Inventors: Anthony D. MINERVINI, Peter C. HRUDEY, Gokhan HATIPOGLU
-
Patent number: 11635334Abstract: Embodiments described herein are directed to a temperature measurement device that includes a sensor body configured to be placed on a skin of a user. The temperature measurement device can include a first section defining a first lower surface and having a first thickness, a second section defining a second lower surface and having a second thickness, and a channel separating the first lower surface from the second lower surface. The temperature measurement device can also include a first set of temperature sensors positioned across the first thickness, a second set of temperature sensors positioned across the second thickness, and a processor configured to estimate a tissue temperature of the user based on comparing temperature signals from the first set of temperature sensors with temperature signals from the second set of temperature sensors.Type: GrantFiled: June 30, 2020Date of Patent: April 25, 2023Assignee: Apple Inc.Inventors: Helia Rahmani, Anthony D. Minervini, Wanfeng Huang, James C. Clements, Jiandong Yu, Zijing Zeng, Charley T. Ogata
-
Publication number: 20230092004Abstract: An acoustic device comprising: an enclosure defining an acoustic port and an acoustic pathway between the acoustic port and a transducer coupled to the enclosure; and an array of attenuators acoustically coupled to the acoustic pathway to absorb ultrasonic acoustic waves.Type: ApplicationFiled: August 2, 2022Publication date: March 23, 2023Inventors: Peter C. Hrudey, Gokhan Hatipoglu, Anthony D. Minervini
-
Patent number: 11228846Abstract: Aspects of the subject technology relate to low noise microphone assemblies for electronic devices. A microphone assembly may include components for sensing sound, mounted on a substrate, under a cover disposed on the substrate. The components may receive sound through an opening in the substrate. The microphone assembly may include an interposer on the substrate. The interposer includes one or more contacts on a surface that is spatially separated from the surface of the substrate, in a direction perpendicular to the surface of the substrate. A first side of the substrate may be mounted to an inner surface of a housing of the electronic device. The components, the cover, and the interposer may be mounted to an opposing second side of the substrate. A flexible printed circuit may be coupled to the contacts on the surface of the interposer, and mechanically attached to a surface of the cover.Type: GrantFiled: February 14, 2020Date of Patent: January 18, 2022Assignee: Apple Inc.Inventors: Florence W. Ow, Peter C. Hrudey, Yu-Chun Hsu, Anthony D. Minervini, John K. Queeney, Tavys Q. Ashcroft
-
Publication number: 20210404883Abstract: Embodiments described herein are directed to a temperature measurement device that includes a sensor body configured to be placed on a skin of a user. The temperature measurement device can include a first section defining a first lower surface and having a first thickness, a second section defining a second lower surface and having a second thickness, and a channel separating the first lower surface from the second lower surface. The temperature measurement device can also include a first set of temperature sensors positioned across the first thickness, a second set of temperature sensors positioned across the second thickness, and a processor configured to estimate a tissue temperature of the user based on comparing temperature signals from the first set of temperature sensors with temperature signals from the second set of temperature sensors.Type: ApplicationFiled: June 30, 2020Publication date: December 30, 2021Inventors: Helia Rahmani, Anthony D. Minervini, Wanfeng Huang, James C. Clements, Jiandong Yu, Zijing Zeng, Charley T. Ogata
-
Patent number: 11134325Abstract: A microphone assembly has an interconnect substrate and a microphone transducer coupled with the substrate. A lid overlies the microphone transducer. At least a portion of the lid is spaced from the substrate, defining an acoustic chamber for the microphone transducer. The lid can have a layer of discretized metal or other patterned conductor. The discretized layer of metal or other patterned conductor is configured to inhibit formation of eddy currents, as when exposed to electromagnetic radiation. The lid can be grounded. Microphone modules and electronic devices also are described.Type: GrantFiled: June 24, 2019Date of Patent: September 28, 2021Assignee: Apple Inc.Inventors: Peter C. Hrudey, Anthony D. Minervini, Joseph R. Maurer
-
Publication number: 20210258698Abstract: Aspects of the subject technology relate to low noise microphone assemblies for electronic devices. A microphone assembly may include components for sensing sound, mounted on a substrate, under a cover disposed on the substrate. The components may receive sound through an opening in the substrate. The microphone assembly may include an interposer on the substrate. The interposer includes one or more contacts on a surface that is spatially separated from the surface of the substrate, in a direction perpendicular to the surface of the substrate. A first side of the substrate may be mounted to an inner surface of a housing of the electronic device. The components, the cover, and the interposer may be mounted to an opposing second side of the substrate. A flexible printed circuit may be coupled to the contacts on the surface of the interposer, and mechanically attached to a surface of the cover.Type: ApplicationFiled: February 14, 2020Publication date: August 19, 2021Inventors: Florence W. OW, Peter C. HRUDEY, Yu-Chun HSU, Anthony D. MINERVINI, John K. QUEENEY, Tavys Q. ASHCROFT
-
Patent number: 10911850Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.Type: GrantFiled: October 19, 2018Date of Patent: February 2, 2021Assignee: INVENSENSE, INC.Inventors: Anthony D. Minervini, Kieran Harney, Aleksey S. Khenkin, Baris Cagdaser
-
Publication number: 20200404407Abstract: A microphone assembly has an interconnect substrate and a microphone transducer coupled with the substrate. A lid overlies the microphone transducer. At least a portion of the lid is spaced from the substrate, defining an acoustic chamber for the microphone transducer. The lid can have a layer of discretized metal or other patterned conductor. The discretized layer of metal or other patterned conductor is configured to inhibit formation of eddy currents, as when exposed to electromagnetic radiation. The lid can be grounded. Microphone modules and electronic devices also are described.Type: ApplicationFiled: June 24, 2019Publication date: December 24, 2020Inventors: Peter C. Hrudey, Anthony D. Minervini, Joseph R. Maurer
-
Publication number: 20200107096Abstract: A liquid-resistant microphone assembly includes a substrate defining a sound-entry region and a microphone transducer coupled with the substrate. The transducer has a sound-responsive region acoustically coupled with the sound-entry opening defined by the substrate. A liquid-resistant port membrane spans across the sound-entry opening defined by the substrate. The membrane is gas-permeable. An adhesive layer is positioned between the substrate and the liquid-resistant port membrane, coupling the liquid-resistant port membrane with the substrate and spacing the liquid-resistant port membrane from the substrate to form a gap between the membrane and the substrate. The adhesive layer defines an aperture having a periphery extending around and positioned outward of the sound-entry region. Modules and electronic devices incorporating such a microphone transducer also are disclosed.Type: ApplicationFiled: September 28, 2018Publication date: April 2, 2020Inventors: Anthony D. Minervini, David S. Wilkes, JR., Nikolas T. Vitt, Peter C. Hrudey, Ruchir M. Dave, Amin M. Younes
-
Patent number: 10587942Abstract: A liquid-resistant microphone assembly includes a substrate defining a sound-entry region and a microphone transducer coupled with the substrate. The transducer has a sound-responsive region acoustically coupled with the sound-entry opening defined by the substrate. A liquid-resistant port membrane spans across the sound-entry opening defined by the substrate. The membrane is gas-permeable. An adhesive layer is positioned between the substrate and the liquid-resistant port membrane, coupling the liquid-resistant port membrane with the substrate and spacing the liquid-resistant port membrane from the substrate to form a gap between the membrane and the substrate. The adhesive layer defines an aperture having a periphery extending around and positioned outward of the sound-entry region. Modules and electronic devices incorporating such a microphone transducer also are disclosed.Type: GrantFiled: September 28, 2018Date of Patent: March 10, 2020Assignee: Apple Inc.Inventors: Anthony D. Minervini, David S. Wilkes, Jr., Nikolas T. Vitt, Peter C. Hrudey, Ruchir M. Dave, Amin M. Younes
-
Patent number: 10477301Abstract: A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.Type: GrantFiled: April 23, 2019Date of Patent: November 12, 2019Assignee: Knowles Electronics, LLCInventor: Anthony D. Minervini
-
Publication number: 20190253791Abstract: A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.Type: ApplicationFiled: April 23, 2019Publication date: August 15, 2019Applicant: Knowles Electronics, LLCInventor: Anthony D. MINERVINI
-
Patent number: 10321226Abstract: A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.Type: GrantFiled: May 1, 2018Date of Patent: June 11, 2019Assignee: Knowles Electronics, LLCInventor: Anthony D. Minervini