Patents by Inventor Anthony Giovannone

Anthony Giovannone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5795535
    Abstract: A precut die apparatus arranged and adapted for use in a thermoform-trimming method and system to produce plastic molded articles, and to the method and system in which the apparatus is employed. The precut apparatus is positioned, in the method and system, between the form press and the trim station. The precut apparatus is arranged to precut, in a desired and selected manner, the thermoformed sheet material containing thermoformed articles therein, about the periphery of the thermoformed articles. The precut provides for a bridged and joining area of the sheet material to allow for slight movement and adjusting of the molded articles for precise alignment in the punch and die trim step of the thermoforming and trimming operation.
    Type: Grant
    Filed: March 15, 1996
    Date of Patent: August 18, 1998
    Assignee: Sencorp Systems, Inc.
    Inventors: Anthony Giovannone, David Mitchell
  • Patent number: 5600939
    Abstract: Apparatus and method for the packaging of an article in a plastic-card package which includes a flat card having a window aperture cut therein fed to the apparatus, and a flat, thermoformable plastic sheet, cut-to-size larger than the aperture and smaller than the face of the card and positioned to cover the aperture. The perimeter of the sheet is heat tacked by an adhesive to the card at a plurality of points around the perimeter of the aperture, and the thermoformable material is heated to form a blister in the sheet and to heat seal the edges of the formed blister to the card. The blister is filled, and the filled blister is covered with a backing cover sheet, and the card sealed to form a package.
    Type: Grant
    Filed: May 31, 1995
    Date of Patent: February 11, 1997
    Assignee: Sencorp Systems, Inc.
    Inventor: Anthony Giovannone
  • Patent number: 5522505
    Abstract: Apparatus and method for the packaging of an article in a plastic-card package which includes a flat card having a window aperture cut therein fed to the apparatus, and a flat, thermoformable plastic sheet, cut-to-size larger than the aperture and smaller than the face of the card and positioned to cover the aperture. The perimeter of the sheet is heat tacked by an adhesive to the card at a plurality of points around the perimeter of the aperture, and the thermoformable material is heated to form a blister in the sheet and to heat seal the edges of the formed blister to the card. The blister is filled, and the filled blister is covered with a backing cover sheet, and the card sealed to form a package.
    Type: Grant
    Filed: March 8, 1995
    Date of Patent: June 4, 1996
    Assignee: Sencorp Systems, Inc.
    Inventor: Anthony Giovannone
  • Patent number: 5404693
    Abstract: Apparatus and method for the packaging of an article in a plastic-card package which includes a flat card having a window aperture cut therein fed to the apparatus, and a flat, thermoformable plastic sheet, cut-to-size larger than the aperture and smaller than the face of the card and positioned to cover the aperture. The perimeter of the sheet is heat tacked by an adhesive to the card at a plurality of points around the perimeter of the aperture, and the thermoformable material is heated to form a blister in the sheet and to heat seal the edges of the formed blister to the card. The blister is filled, and the filled blister is covered with a backing cover sheet, and the card sealed to form a package.
    Type: Grant
    Filed: August 3, 1994
    Date of Patent: April 11, 1995
    Assignee: Sencorp Systems, Inc.
    Inventor: Anthony Giovannone
  • Patent number: 5379572
    Abstract: A blister packaging system and method which includes a preheat station, a cold seal press station, and a trimming station to provide a blister-type cold seal bonded blister package. The method comprises feeding the adjacent sheets of thermoplastic material to a preheat station and preheating selected sections, usually edge areas, of the plastic material for very short periods of time to a tacky or melt temperature, thereafter cold pressing the preheated sections under pressure at a temperature of less than 60.degree. F. to cold bond seal the preheated sections, and thereafter optionally to trim the cold bonded thermoplastic sheet material to a finished size and recovering a blister, cold-bonded package.
    Type: Grant
    Filed: August 25, 1993
    Date of Patent: January 10, 1995
    Assignee: Sencorp Systems, Inc.
    Inventor: Anthony Giovannone